Patents by Inventor Pai-Chien Wei

Pai-Chien Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9715220
    Abstract: The present invention is a method for real-time controlling a resin transfer molding process, which is used to control a filling pressure of a resin in a resin transfer molding (RTM) apparatus. In a pre-control RTM process, the current filling pressure, the current permeability and the wave front position at the current time point is input into a prediction-control model to acquire a predicted filling pressure at the next time point. The predicted filling pressure is used as the filling pressure to make the resin flow to the expected position of the wave front at the next time point, whereby to achieve stable quality of RTM products.
    Type: Grant
    Filed: February 3, 2015
    Date of Patent: July 25, 2017
    Assignee: National Tsing Hua University
    Inventors: Yuan Yao, Pai-Chien Wei
  • Publication number: 20160167276
    Abstract: The present invention is a method for real-time controlling a resin transfer molding process, which is used to control a filling pressure of a resin in a resin transfer molding (RTM) apparatus. In a pre-control RTM process, the current filling pressure, the current permeability and the wave front position at the current time point is input into a prediction-control model to acquire a predicted filling pressure at the next time point. The predicted filling pressure is used as the filling pressure to make the resin flow to the expected position of the wave front at the next time point, whereby to achieve stable quality of RTM products.
    Type: Application
    Filed: February 3, 2015
    Publication date: June 16, 2016
    Inventors: Yuan Yao, Pai-Chien Wei
  • Publication number: 20160116391
    Abstract: A method for online measurement of local permeability in resin transfer molding adopts a detection module, which includes a pressure transducer unit, at least one image capture device and a processing unit electrically connected with the pressure transducer unit and the image capture device, to measure the local permeability of the flowing resin on line.
    Type: Application
    Filed: January 7, 2015
    Publication date: April 28, 2016
    Inventors: Yuan Yao, Pai-Chien Wei, Yu-Sung Chang