Patents by Inventor Pai-Sheng Shih
Pai-Sheng Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230269866Abstract: An electronic device is provided. The electronic device includes a carrier, a first electronic component, a second electronic component, and an encapsulant. The first electronic component is disposed at a first side of the carrier. The second electronic component is disposed at a second side of the carrier opposite to the first side. The encapsulant encapsulates the first electronic component and has an uneven thickness. The encapsulant is configured to reduce a warpage of the carrier.Type: ApplicationFiled: February 24, 2022Publication date: August 24, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei-Jhen CIOU, Jenchun CHEN, Chang-Fu LU, Pai-Sheng SHIH
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Patent number: 9674991Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.Type: GrantFiled: November 30, 2015Date of Patent: June 6, 2017Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.Inventors: Jen-Chun Chen, Pai-Sheng Shih
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Publication number: 20160081235Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.Type: ApplicationFiled: November 30, 2015Publication date: March 17, 2016Inventors: JEN-CHUN CHEN, PAI-SHENG SHIH
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Patent number: 9271436Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.Type: GrantFiled: May 23, 2014Date of Patent: February 23, 2016Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.Inventors: Jen-Chun Chen, Pai-Sheng Shih
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Patent number: 9089046Abstract: An electronic module includes a circuit board, a plurality of electronic components, a plurality of molding layers, at least one first conductive layer, at least one insulating filler, and one second conductive layer. The circuit board has a first plane and at least one grounding pad on the first plane. The electronic components are mounted on the first plane and electrically connected with the circuit board. The molding layers cover the electronic components and the first plane. The trench appears between two adjacent molding layers. The grounding pad is positioned at the bottom of the trench. The first conductive layer covers the sidewall of the trench and the grounding pad. The grounding pad electrically connected with the first conductive layer. The insulating filler is positioned in the trench. The second conductive layer covers the molding layers and the insulating filler, and electrically connects with the first conductive layer.Type: GrantFiled: January 23, 2013Date of Patent: July 21, 2015Assignees: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD., UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.Inventors: Jen-Chun Chen, Pai-Sheng Shih, Hsin-Chin Chang
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Publication number: 20150173258Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.Type: ApplicationFiled: May 23, 2014Publication date: June 18, 2015Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD.Inventors: JEN-CHUN CHEN, PAI-SHENG SHIH
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Patent number: 8436452Abstract: A carrier for holding a plurality of chip packages and a carrier assembly are provided, wherein the chip package has a central area without solder balls and a peripheral area with solder balls formed thereon. The carrier includes a tray component and a plurality of supports disposed on the tray component, wherein each support holds the central area of a respective chip package. The carrier assembly is formed by stacking a plurality of the carriers through a plurality of peripheral projections disposed at a periphery of each tray component, wherein each peripheral projection has a pin formed thereon and a hole formed thereunder.Type: GrantFiled: May 28, 2010Date of Patent: May 7, 2013Assignee: Nanya Technology CorporationInventor: Pai-Sheng Shih
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Publication number: 20110291255Abstract: A carrier for holding a plurality of chip packages and a carrier assembly are provided, wherein the chip package has a central area without solder balls and a peripheral area with solder balls formed thereon. The carrier includes a tray component and a plurality of supports disposed on the tray component, wherein each support holds the central area of a respective chip package. The carrier assembly is formed by stacking a plurality of the carriers through a plurality of peripheral projections disposed at a periphery of each tray component, wherein each peripheral projection has a pin formed thereon and a hole formed thereunder.Type: ApplicationFiled: May 28, 2010Publication date: December 1, 2011Applicant: NANYA TECHNOLOGY CORPORATIONInventor: Pai-Sheng Shih