Abstract: The present disclosure relates to compounds of formula (I) and pharmaceutical compositions and their use in reducing Widely Interspaced Zinc Finger Motifs (WIZ) expression levels, or inducing fetal hemoglobin (HbF) expression, and in the treatment of inherited blood disorders (e.g., hemoglobinopathies, e.g., beta-hemoglobinopathies), such as sickle cell disease and beta-thalassemia.

Abstract: Methods of manufacturing a flat-pack no-lead microelectronic package (2100) coat exposed base metal at a cut end of a lead frame of the package with solder (1001). One method coats the exposed base metal with solder when the package is in a strip (200, 300). Another method coats the exposed base metal with solder after the package is singulated. As a result, all portions of leads of the package that may receive solder during mounting of the package to a printed circuit board are solder wettable. A solder wettable lead end (504) on the package facilitates formation of a solder fillet during mounting of the package.

Abstract: Methods of manufacturing a flat-pack no-lead microelectronic package (2100) coat exposed base metal at a cut end of a lead frame of the package with solder (1001). One method coats the exposed base metal with solder when the package is in a strip (200, 300). Another method coats the exposed base metal with solder after the package is singulated. As a result, all portions of leads of the package that may receive solder during mounting of the package to a printed circuit board are solder wettable. A solder wettable lead end (504) on the package facilitates formation of a solder fillet during mounting of the package.

Abstract: A mechanism is provided by which optically-inspectable features formed during surface mount bonding of no-leads packages are enhanced. Embodiments of the present invention use a lead frame having features that will lie upon the edges of the finished semiconductor device package, where molding material is prevented from lying in those features through the use of a preplaced film on the lead frame or film-assisted molding in conjunction with a mold chase that conforms to the features provided on the lead frame. Embodiments use a lead frame that has a pre-plated solderable surface, such that the exposed features enhance formation of the optically-inspectable features during solder reflow operations of PCB mounting.

Abstract: A method of diagnosing subjects for breast cancer comprising the steps of (a) establishing the seprase level of a subjects test material and (b) determining those subjects with seprase levels above about 0.0008 nmoles.min?1.mg?1 (by wgt); or above about 0.05 nmoles.min?1.ml?1 (by volume) as positive for breast cancer and other epithelial cancers.