Abstract: A flip chip structure of a light-emitting device comprising a UV/blue light emitting diode (LED) is disclosed. The flip chip structure is optimized to produce unique light focusing and phosphor illumination out the bottom of the structure. The flip chip structure includes a substrate, a gallium nitride layer epitaxially grown on a top surface of the substrate, and one or more layers of lensing material deposited on a bottom surface of the substrate. The lensing material is preferably a polymer lensing material, an index matching material, or a mixture thereof. The gallium nitride layer is deposited in the form of one or more odd-sided polygons, for enhanced light extraction.

Abstract: An improved LED lead frame packaging assembly includes a thermally conducting, electrically insulating material that enhances the thermal conduction and structural integrity of the assembly, a UV-resistant encapsulantmaterial, and an integral ESD material that reduces electrostatic discharge. The thermally conducting, electrically insulating material creates an electrically insulating, thermally conductive path in the lead frame assembly for dissipation of power and also acts as a mounting structure thus allowing for the use of a soft encapsulant material, preferably a silicone.