Abstract: A conductive terminal includes a holding portion, a positioning portion and a welding portion. The positioning portion is connected to the holding portion and includes two positioning branches separated by a first trench. The welding portion is connected to the positioning portion and the positioning portion is located between the holding portion and the welding portion. The welding portion includes two welding branches separated by a second trench, wherein the first trench is communicated with the second trench and each of the welding branches is connected to one of the positioning branches. The positioning portion has a first outer diameter, and a second outer diameter on at least part of the welding portion is greater than the first outer diameter. An electrical connecting structure is further provided.

Abstract: A conductive terminal includes a holding portion, a positioning portion and a welding portion. The positioning portion is connected to the holding portion and includes two positioning branches separated by a first trench. The welding portion is connected to the positioning portion and the positioning portion is located between the holding portion and the welding portion. The welding portion includes two welding branches separated by a second trench, wherein the first trench is communicated with the second trench and each of the welding branches is connected to one of the positioning branches. The positioning portion has a first outer diameter, and a second outer diameter on at least part of the welding portion is greater than the first outer diameter. An electrical connecting structure is further provided.

Abstract: A heat dissipation and temperature-homogenizing structure which includes a body made of a material with low thermal conductivity and a heat conducting member made of a material with high thermal conductivity is disclosed. The body has opposite inner surfaces and outer surfaces. The heat conducting member is embedded inside the body and is completely surrounded between the inner surfaces and the outer surfaces. When the electronic device generates heat, the heat is firstly transferred to the heat conducting member from the inner surfaces, and then rapidly and evenly spreads over the heat conducting member. Finally, the heat inside the heat conducting member is uniformly dissipated through the outer surfaces. Accordingly, the heat dissipation and temperature-homogenizing structure may effectively and evenly spread the heat over the outer surfaces for exchanging heat with the ambient.