Abstract: The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.

Abstract: A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, a plurality of leads, a chip, and a package body. The die pad includes: (1) a peripheral edge region defining, a cavity with a cavity bottom including a central portion; (2) an upper sloped portion; and (3) a lower sloped portion. Each lead includes an upper sloped portion and a lower sloped portion. The chip is disposed on the central portion of the cavity bottom and is coupled to the leads. The package body is formed over the chip and the leads, substantially fills the cavity, and substantially covers the upper sloped portions of the die pad and the leads. The lower sloped portions of the die pad and the leads at least partially extend outwardly from a lower surface of the package body.

Abstract: The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The leads include first leads disposed around the die pad, second leads disposed around the first leads and at least an embedded lead portion between the first leads and the second leads. The wires are disposed between the chip, the first leads and the embedded lead portion. The advanced quad flat non-leaded package structures designed with the embedded lead portion can provide better electrical connection.

Abstract: The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The inner leads of the leads are designed to possess incurved sidewalls for enhancing the adhesion between the inner leads and the surrounding molding compound.

Abstract: The manufacturing method of advanced quad flat non-leaded packages includes performing a pre-cutting process prior to the backside etching process for defining the contact terminals. The pre-cutting process ensures the isolation of individual contact terminals and improves the package reliability.

Abstract: A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, a first plurality of leads disposed in a lead placement area around the die pad, a second plurality of leads disposed in corner regions of the lead placement area, a semiconductor chip on the die pad and coupled to each lead, and a package body. Each lead includes an upper sloped portion and a lower sloped portion. An average of surface areas of lower surfaces of each of the second plurality of leads is at least twice as large as an average of surface areas of lower surfaces of each of the first plurality of leads. The package body substantially covers the upper sloped portions of the leads. The lower sloped portions of the leads at least partially extend outwardly from a lower surface of the package body.

Abstract: A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, multiple leads, a chip, a package body, and a protective layer. The die pad includes an upper sloped portion, a lower sloped portion, and a peripheral edge region defining a cavity with a cavity bottom. Each lead includes an upper sloped portion and a lower sloped portion. The chip is disposed on the cavity bottom and is coupled to the leads. The package body is formed over the chip and the leads, substantially fills the cavity, and substantially covers the upper sloped portions of the die pad and the leads. The lower sloped portions of the die pad and the leads at least partially extend outwardly from a lower surface of the package body. The protective layer substantially covers the lower sloped portion and the lower surface of at least one lead.

Abstract: The advanced quad flat non-leaded package structure includes a carrier having a die pad and a plurality of leads, at least a chip, a plurality of wires, and a molding compound. The rough surface of the carrier enhances the adhesion between the carrier and the surrounding molding compound.

Abstract: The advanced quad flat non-leaded package structure includes a carrier having a die pad and a plurality of leads, at least a chip, a plurality of wires, and a molding compound. The rough surface of the carrier enhances the adhesion between the carrier and the surrounding molding compound.

Abstract: The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The inner leads of the leads electively have a plurality of locking grooves for enhancing the adhesion between the inner leads and the surrounding molding compound.

Abstract: The manufacturing method of advanced quad flat non-leaded packages includes performing a pre-cutting process prior to the backside etching process for defining the contact terminals. The pre-cutting process ensures the isolation of individual contact terminals and improves the package reliability.

Abstract: An advanced quad flat non-leaded package structure includes a carrier, a chip and a molding compound. The carrier includes a die pad and a plurality of leads. The die pad has a central portion, a peripheral portion disposed around the central portion and a plurality of connecting portions connecting the central portion and the peripheral portion. The central portion, the peripheral portion, and the connecting portions define at least two hollow regions. The leads are disposed around the die pad. The chip is located within the central portion of the die pad and electrically connected to the leads via a plurality of wires. The molding compound encapsulates the chip, the wires, inner leads and a portion of the carrier.

Abstract: The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The leads include first leads disposed around the die pad, second leads disposed around the first leads and at least an embedded lead portion between the first leads and the second leads. The wires are disposed between the chip, the first leads and the embedded lead portion. The advanced quad flat non-leaded package structures designed with the embedded lead portion can provide better electrical connection.

Abstract: The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.

Abstract: A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, a first plurality of leads disposed in a lead placement area around the die pad, a second plurality of leads disposed in corner regions of the lead placement area, a semiconductor chip on the die pad and coupled to each lead, and a package body. Each lead includes an upper sloped portion and a lower sloped portion. An average of surface areas of lower surfaces of each of the second plurality of leads is at least twice as large as an average of surface areas of lower surfaces of each of the first plurality of leads. The package body substantially covers the upper sloped portions of the leads. The lower sloped portions of the leads at least partially extend outwardly from a lower surface of the package body.

Abstract: A semiconductor package and related methods are described. In one embodiment the semiconductor package includes a die pad, a plurality of leads, a semiconductor chip, and a package body. The die pad includes a first part that includes a lower surface and a first peripheral edge region comprising a ground region. The die pad further includes a second part that is spaced apart from the first part and that includes a lower surface and a second peripheral edge region comprising a power region. The plurality of leads is disposed around the die pad. The semiconductor chip is disposed on the die pad and is electrically coupled to the ground region, the power region, and the plurality of leads. The package body is formed over the semiconductor chip and the plurality of leads.

Abstract: A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, a plurality of leads, a chip, and a package body. The die pad includes: (1) a peripheral edge region defining, a cavity with a cavity bottom including a central portion; (2) an upper sloped portion; and (3) a lower sloped portion. Each lead includes an upper sloped portion and a lower sloped portion. The chip is disposed on the central portion of the cavity bottom and is coupled to the leads. The package body is formed over the chip and the leads, substantially fills the cavity, and substantially covers the upper sloped portions of the die pad and the leads. The lower sloped portions of the die pad and the leads at least partially extend outwardly from a lower surface of the package body.

Abstract: The present invention relates to a stackable semiconductor package and the method for making the same. The stackable semiconductor package comprises a first substrate, a semiconductor device, a plurality of stud bumps, a plurality of first wires, a second substrate, and a molding compound. The semiconductor device is disposed on the first substrate and electrically connected to the first substrate. The stud bumps are above the semiconductor device. The first wires are used for electrically connecting the stud bumps and the first substrate. The stud bumps are in contact with the second substrate. The molding compound encapsulates the first substrate, the semiconductor device, the stud bumps, the first wires, and the second substrate, and thus, the second substrate will not undergo wire bonding, and will not be suspended and shake or sway, as present in a conventional stackable semiconductor package.

Abstract: The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.

Abstract: The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.