Abstract: A scintillator panel includes a substrate having a front side and a rear side. A first scintillator layer is embedded into the front side of the substrate to a first depth. A second scintillator layer is embedded into the rear side of the substrate to a second depth.

Abstract: A scintillator panel includes a substrate having a front side and a rear side. A first scintillator layer is embedded into the front side of the substrate to a first depth. A second scintillator layer is embedded into the rear side of the substrate to a second depth.

Abstract: A TFT-PIN array substrate and an assembly structure for a flat-panel x-ray detector are provided to overcome the problem that the conventional scintillator substrate and TFT-PIN array substrate are neither penetrated by UV-light nor assembled by UV curable LOCA. The metal layer of the PIN photodiode of the TFT-PIN array substrate is perforated to have at least one hole, whereby UV-light can pass through the TFT-PIN array substrate to cure UV curable LOCA. Therefore, UV curable LOCA can be used as an adhesive layer in the assembly structure of a scintillator substrate and a TFT-PIN array substrate to promote the detective quantum efficiency and image quality of a flat-panel X-Ray detector.

Abstract: An electromagnetic wave conversion structure consists of a substrate, a plurality of electromagnetic wave conversion units forming a two-dimensional array, a reflective film and a plurality of reflective layers. The substrate has a first surface and a second surface disposed opposite to the first surface. The second surface consists of a plurality of trenches formed in the body of the substrate. Each electromagnetic wave conversion units is disposed in each trench, is used to absorb first electromagnetic waves with a first wavelength and is used to emit second electromagnetic waves with a second wavelength. The first wavelength is shorter than the second wavelength. The reflective film covers the first surface of the substrate and is used to reflect the second electromagnetic wave. Each of the reflective layers is disposed on the sidewall of each trench of the corresponding electromagnetic wave conversion unit.

Abstract: A TFT-PIN array substrate and an assembly structure for a flat-panel x-ray detector are provided to overcome the problem that the conventional scintillator substrate and TFT-PIN array substrate are neither penetrated by UV-light nor assembled by UV curable LOCA. The metal layer of the PIN photodiode of the TFT-PIN array substrate is perforated to have at least one hole, whereby UV-light can pass through the TFT-PIN array substrate to cure UV curable LOCA. Therefore, UV curable LOCA can be used as an adhesive layer in the assembly structure of a scintillator substrate and a TFT-PIN array substrate to promote the detective quantum efficiency and image quality of a flat-panel X-Ray detector.

Abstract: A chip having a bump layout suitable for the chip on glass technology and a driving IC includes a plurality of first bumps and a plurality of second bumps for electrically connecting to a glass substrate of a displayer. The first and second bumps are disposed on a surface of the chip and near two opposite long sides of the chip respectively. The ratio of the total contacting area of the first bumps to that of the second bumps is between 0.8 and 1.2. Thus, a pressure applied on the chip and the glass substrate of the displayer for connection can be uniformly exerted all over the chip, and the stability of the connection is therefore improved.

Abstract: An electromagnetic wave conversion structure consists of a substrate, a plurality of electromagnetic wave conversion units forming a two-dimensional array, a reflective film and a plurality of reflective layers. The substrate has a first surface and a second surface disposed opposite to the first surface. The second surface consists of a plurality of trenches formed in the body of the substrate. Each electromagnetic wave conversion units is disposed in each trench, is used to absorb first electromagnetic waves with a first wavelength and is used to emit second electromagnetic waves with a second wavelength. The first wavelength is shorter than the second wavelength. The reflective film covers the first surface of the substrate and is used to reflect the second electromagnetic wave. Each of the reflective layers is disposed on the sidewall of each trench of the corresponding electromagnetic wave conversion unit.

Abstract: A panel module is provided, including a first substrate, a second substrate, a first optical glue, and a second optical glue. The first and second optical glues are disposed between the first and second substrates, wherein the first optical glue protrudes from the first substrate, and the second optical glue adheres the first substrate to the second substrate. Specifically, the viscosity of the second optical glue is smaller than the first optical glue before solidification.

Abstract: A liquid crystal display panel includes a lower substrate, a printed circuit board, at least one connection unit and a plurality of readout lines. The connection unit is adapted to connect the printed circuit board to a periphery region of the lower substrate, and has a driver. The readout lines are extended from the lower substrate to the printed circuit board through the connection unit having the driver.

Abstract: A display apparatus includes a substrate, a daisy chain, a driving circuit, and a conductive portion. The substrate has an electrode line. The daisy chain includes a first conducting wire separated from the electrode line. The first conducting wire has a first terminal and a second terminal. The conductive portion is disposed on the substrate. The first terminal is electrically connected to the electrode line and the second terminal is separated from the driving circuit.

Abstract: A panel module is provided, including a first substrate, a second substrate, a first optical glue, and a second optical glue. The first and second optical glues are disposed between the first and second substrates, wherein the first optical glue protrudes from the first substrate, and the second optical glue adheres the first substrate to the second substrate. Specifically, the viscosity of the second optical glue is smaller than the first optical glue before solidification.

Abstract: A chip having a bump layout suitable for the chip on glass technology and a driving IC includes a plurality of first bumps and a plurality of second bumps for electrically connecting to a glass substrate of a displayer. The first and second bumps are disposed on a surface of the chip and near two opposite long sides of the chip respectively. The ratio of the total contacting area of the first bumps to that of the second bumps is between 0.8 and 1.2. Thus, a pressure applied on the chip and the glass substrate of the displayer for connection can be uniformly exerted all over the chip, and the stability of the connection is therefore improved.

Abstract: A liquid crystal display panel includes a lower substrate, a printed circuit board, at least one connection unit and a plurality of readout lines. The connection unit is adapted to connect the printed circuit board to a periphery region of the lower substrate, and has a driver. The readout lines are extended from the lower substrate to the printed circuit board through the connection unit having the driver.

Abstract: A chip having a bump layout suitable for the chip on glass technology and a driving IC includes a plurality of first bumps and a plurality of second bumps for electrically connecting to a glass substrate of a displayer. The first and second bumps are disposed on a surface of the chip and near two opposite long sides of the chip respectively. The ratio of the total contacting area of the first bumps to that of the second bumps is between 0.8 and 1.2. Thus, a pressure applied on the chip and the glass substrate of the displayer for connection can be uniformly exerted all over the chip, and the stability of the connection is therefore improved.

Abstract: A liquid crystal display panel includes a lower substrate, a printed circuit board, at least one connection unit and a plurality of readout lines. The connection unit is adapted to connect the printed circuit board to a periphery region of the lower substrate, and has a driver. The readout lines are extended from the lower substrate to the printed circuit board through the connection unit having the driver.

Abstract: A connection structure for a chip-on-glass (COG) driver IC and a connection method therefor are provided. The connection structure includes a driver IC having a surface provided with a plurality of polymeric bumps and a plurality of conductive bumps, and the height of the polymeric bumps in relation to the surface is smaller than that of the conductive bumps. When the driver IC is bonded to a glass substrate via an adhesive film by thermal compression bonding, the polymeric bumps are embedded into the adhesive film, and a gap is defined between the polymeric bumps and the glass substrate. Thus, the polymeric bumps can increase the contact area between the driver IC and the adhesive film, and enhance the connection reliability between the conductive bumps and pads of the glass substrate.

Abstract: A liquid crystal display panel includes a lower substrate, a printed circuit board, at least one connection unit and a plurality of readout lines. The connection unit is adapted to connect the printed circuit board to a periphery region of the lower substrate, and has a driver. The readout lines are extended from the lower substrate to the printed circuit board through the connection unit having the driver.

Abstract: The present invention discloses a bump structure and a method for fabricating the same. The bump structure of the present invention comprises a semiconductor substrate having a plurality of connection pads; a passivation layer covering the substrate and having openings each corresponding to one connection pad, wherein the openings reveal a portion of each connection pad to form a plurality of electrical-connection areas; an elastic layer formed on the passivation layer; and a plurality of bumps each formed corresponding to one electric-connection area and extending to the elastic layer, whereby the elasticity and deformability of the bumps is enhanced. The present invention uses a larger-texture (?20 ?m) patterning process to fabricate an appropriate patterned elastic layer (having parallel lines, strips, or saw teeth) to enhance the elasticity and deformability of the bumps, whereby the bump structure of the present invention can apply to a fine-pitch IC.

Abstract: A chip having a bump layout suitable for the chip on glass technology and a driving IC includes a plurality of first bumps and a plurality of second bumps for electrically connecting to a glass substrate of a displayer. The first and second bumps are disposed on a surface of the chip and near two opposite long sides of the chip respectively. The ratio of the total contacting area of the first bumps to that of the second bumps is between 0.8 and 1.2. Thus, a pressure applied on the chip and the glass substrate of the displayer for connection can be uniformly exerted all over the chip, and the stability of the connection is therefore improved.

Abstract: A display apparatus includes a substrate, a daisy chain, a driving circuit, and a conductive portion. The substrate has an electrode line. The daisy chain includes a first conducting wire separated from the electrode line. The first conducting wire has a first terminal and a second terminal. The conductive portion is disposed on the substrate. The first terminal is electrically connected to the electrode line and the second terminal is separated from the driving circuit.