Abstract: There is described an RF waveguide array. The array comprises a substrate comprising a plurality of optical waveguides, each waveguide being elongate in a first direction. An electrical RF transmission line array is located on a face of the substrate and comprises a plurality of signal electrodes and a plurality of ground electrodes, each electrode extending in the first direction. Each signal electrode is positioned to provide a signal to two respective waveguides. The ground electrodes include at least one intermediate ground electrode positioned between each pair of signal electrodes. Each intermediate ground electrode includes a portion extending into the substrate.

Abstract: There is described an RF waveguide array. The array comprises a substrate comprising a plurality of optical waveguides, each waveguide being elongate in a first direction. An electrical RF transmission line array is located on a face of the substrate and comprises a plurality of signal electrodes and a plurality of ground electrodes, each electrode extending in the first direction. Each signal electrode is positioned to provide a signal to two respective waveguides. The ground electrodes include at least one intermediate ground electrode positioned between each pair of signal electrodes. Each intermediate ground electrode includes a portion extending into the substrate.

Abstract: The invention relates to a folded Mach-Zehnder modulator. The modulator may comprise a beam splitter configured to split an input light beam into a plurality of light beams. The modulator may comprise a plurality of Mach-Zehnder devices configured to receive one or more of the plurality of light beams. The modulator may comprise a U-turn section configured to receive light beams from the Mach-Zehnder devices and to change the direction of the light beams by substantially 180 degrees. The modulator may comprise a polarization management section configured to combine light beams received from the U-turn section and to output a polarization multiplexed phase modulated light beam.

Abstract: The invention relates to a folded Mach-Zehnder modulator. The modulator may comprise a beam splitter configured to split an input light beam into a plurality of light beams. The modulator may comprise a plurality of Mach-Zehnder devices configured to receive one or more of the plurality of light beams. The modulator may comprise a U-turn section configured to receive light beams from the Mach-Zehnder devices and to change the direction of the light beams by substantially 180 degrees. The modulator may comprise a polarisation management section configured to combine light beams received from the U-turn section and to output a polarisation multiplexed phase modulated light beam.

Abstract: The present application discloses a method for producing a stable ultra thin metal film that comprises the following steps: a) deposition, on a substrate, of an ultra thin metal film, such as an ultra thin film of nickel, chromium, aluminum, or titanium; b) thermal treatment of the ultra thin metal film, optionally in combination with an O2 treatment; and c) obtaining a protective oxide layer on top of the ultra thin metal film.

Abstract: The present application discloses a method for producing a stable ultra thin metal film that comprises the following steps: a) deposition, on a substrate, of an ultra thin metal film, such as an ultra thin film of nickel, chromium, aluminium, or titanium; b) thermal treatment of the ultra thin metal film, optionally in combination with an O2 treatment; and c) obtaining a protective oxide layer on top of the ultra thin metal film.

Abstract: A method and structure are disclosed with a simplified approach for fabricating a LiNbO3 wafer with Ti indiffusion wafeguide on the surface that is domain inverted. The method involves indiffusing Ti into LiNbO3 with a predefined temperature and time indiffusion range, a Li enriched and dry oxygen atmosphere, which allows making optical waveguides on the z? crystal face without any significant domain inversion occurring on the z+ face of the crystal. This allows for subsequent poling without the need of any additional removal of the thin domain inverted layer which would otherwise appear on the z+ face. Even in instance where a thin domain inversion layer is formed, it is insufficient thick to prevent poling, eliminating the need for the grinding process.

Abstract: A method and structure are disclosed with a simplified approach for fabricating a LiNbO3 wafer with Ti indiffusion wafeguide on the surface that is domain inverted. The method involves indiffusing Ti into LiNbO3 with a predefined temperature and time indiffusion range, a Li enriched and dry oxygen atmosphere, which allows making optical waveguides on the z? crystal face without any significant domain inversion occurring on the z+ face of the crystal. This allows for subsequent poling without the need of any additional removal of the thin domain inverted layer which would otherwise appear on the z+ face. Even in instance where a thin domain inversion layer is formed, it is insufficient thick to prevent poling, eliminating the need for the grinding process.

Abstract: The method is based on the use of an etching mask comprising silicon carbide or titanium nitride for removing a sacrificial region. In case of manufacture of integrated semiconductor material structures, the following steps are performed: forming a sacrificial region of silicon oxide on a substrate of semiconductor material; growing a pseudo-epitaxial layer; forming electronic circuit components; depositing a masking layer comprising silicon carbide or titanium nitride; defining photolithographically the masking layer so as to form an etching mask containing the topography of a microstructure to be formed; with the etching mask, forming trenches in the pseudo-epitaxial layer as far as the sacrificial region so as to laterally define the microstructure; and removing the sacrificial region through the trenches.

Abstract: The method is based on the use of an etching mask comprising silicon carbide or titanium nitride for removing a sacrificial region. In case of manufacture of integrated semiconductor material structures, the following steps are performed: forming a sacrificial region of silicon oxide on a substrate of semiconductor material; growing a pseudo-epitaxial layer; forming electronic circuit components; depositing a masking layer comprising silicon carbide or titanium nitride; defining photolithographically the masking layer so as to form an etching mask containing the topography of a microstructure to be formed; with the etching mask, forming trenches in the pseudo-epitaxial layer as far as the sacrificial region so as to laterally define the microstructure; and removing the sacrificial region through the trenches.