Patents by Inventor Paphat PHAOHARUHAN

Paphat PHAOHARUHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tape chip on lead using paste die attach material
    Patent number: 9679831
    Abstract: According to various embodiments, systems and methods for packaging a semiconductor device are provided. The disclosure discusses a semiconductor die having a top side and a bottom side that is disposed on a lead frame. An adhesive paste is then applied to attach the semiconductor die to the lead frame such that the adhesive paste fixes the die to a portion of the lead frame. The adhesive paste may be applied directly between die and the lead frame or may be applied in conjunction with a frame tape.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: June 13, 2017
    Assignee: Cypress Semiconductor Corporation
    Inventors: Lai Nguk Chin, Paphat Phaoharuhan, Sally Foong
  • TAPE CHIP ON LEAD USING PASTE DIE ATTACH MATERIAL
    Publication number: 20170047272
    Abstract: According to various embodiments, systems and methods for packaging a semiconductor device are provided. The disclosure discusses a semiconductor die having a top side and a bottom side that is disposed on a lead frame. An adhesive paste is then applied to attach the semiconductor die to the lead frame such that the adhesive paste fixes the die to a portion of the lead frame. The adhesive paste may be applied directly between die and the lead frame or may be applied in conjunction with a frame tape.
    Type: Application
    Filed: December 16, 2015
    Publication date: February 16, 2017
    Applicant: Cypress Semiconductor Corporation
    Inventors: Lai Nguk CHIN, Paphat PHAOHARUHAN, Sally FOONG