Abstract: A sub system for a computing device comprising a plurality of chips mounted on a foldable substrate wherein the foldable substrate and the chips are layered by folding the substrate whereby the chips are disposed in at least one stacked configuration and wherein the sub system is adapted to be received on a host board. In addition, removable connections using resilient and nanostructure based members.

Abstract: The generation a search query based on information stored on a storage medium is described. According to one embodiment of the invention, search criteria is entered to perform a search of a storage medium of a client computer. The search of the storage medium determines a web search criteria. The client computer provides search results based on the web search criteria.

Abstract: In a semiconductor device having a semiconductor die without an ESD circuit and a separate ESD circuit and an external lead, the external lead is first bonded to the separate ESD circuit. Thereafter, the separate ESD circuit is bonded to the semiconductor die. As a result, in the process of bonding the semiconductor die, any ESD disturbance is absorbed by the ESD circuit. In addition, a semiconductor device such as a DDR DRAM memory device, has a chip carrier with a first surface having a plurality of leads and a second surface opposite to it with an aperture between them. A semiconductor die with a mounting surface and a bonding pad faces the second surface with the bonding pad in the aperture. An ESD circuit is mounted on the mounting surface in the aperture. A first electrical connector connects one of a plurality of leads to the ESD circuit and a second electrical connector connects the ESD circuit to the bonding pad.

Abstract: In a semiconductor device having a semiconductor die without an ESD circuit and a separate ESD circuit and an external lead, the external lead is first bonded to the separate ESD circuit. Thereafter, the separate ESD circuit is bonded to the semiconductor die. As a result, in the process of bonding the semiconductor die, any ESD disturbance is absorbed by the ESD circuit. In addition, a semiconductor device such as a DDR DRAM memory device, has a chip carrier with a first surface having a plurality of leads and a second surface opposite to it with an aperture between them. A semiconductor die with a mounting surface and a bonding pad faces the second surface with the bonding pad in the aperture. An ESD circuit is mounted on the mounting surface in the aperture. A first electrical connector connects one of a plurality of leads to the ESD circuit and a second electrical connector connects the ESD circuit to the bonding pad.