Patents by Inventor Paramveer Singh THIND

Paramveer Singh THIND has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230308448
    Abstract: Various methods, apparatuses/systems, and media for integrating incompatible open identity connect (OIDC) implementations are disclosed. A processor creates a custom protocol within an API gateway that understands data coming in from the aIDC protocol; receives data from the OIDC protocol; and determines, based on analyzing the data received from the aIDC protocol, any communication gap between an application and an identity layer, wherein the API gateway is implemented between the application and the identity layer. The processor then converts, in response to determining a communication gap, the data received from the aIDC protocol into a formatted data that is understandable by the application; transmits the formatted data to the application; and automatically eliminates any communication gap between the application and the identity layer based on the received formatted data.
    Type: Application
    Filed: March 23, 2022
    Publication date: September 28, 2023
    Applicant: JPMorgan Chase Bank, N.A.
    Inventors: Anupam ARORA, Paramveer Singh THIND, Jose Rudel DE CASTRO, Akhilesh GUPTA