Abstract: An apparatus and method for combined radio frequency identification (RFID)-based asset management and component authentication are provided. The apparatus comprises a plurality of components to be authenticated, a memory configured to store inventory data, a plurality of root-of-trust (RoT) integrated circuits (ICs), a wired communication bus, and a radio frequency identification (RFID) relay tag. Each RoT IC is mechanically coupled to a corresponding one of the plurality of components and configured to generate authentication data based on a unique key generated for authenticating the corresponding component. The RFID relay tag is connected to each of the RoT ICs via the wired communication bus and is configured to communicate with each of the RoT ICs via the wired communication bus and pass the authentication data and the inventory data to an RFID reader via a radio frequency signal to facilitate authentication of components and inventory management.

Abstract: An apparatus and method for combined radio frequency identification (RFID)-based asset management and component authentication are provided. The apparatus comprises a plurality of components to be authenticated, a memory configured to store inventory data, a plurality of root-of-trust (RoT) integrated circuits (ICs), a wired communication bus, and a radio frequency identification (RFID) relay tag. Each RoT IC is mechanically coupled to a corresponding one of the plurality of components and configured to generate authentication data based on a unique key generated for authenticating the corresponding component. The RFID relay tag is connected to each of the RoT ICs via the wired communication bus and is configured to communicate with each of the RoT ICs via the wired communication bus and pass the authentication data and the inventory data to an RFID reader via a radio frequency signal to facilitate authentication of components and inventory management.

Abstract: A method of encapsulating integrated circuits is disclosed. The method includes placing a front side of a semiconductor wafer, having partially cut scribe lines that separate a plurality of semiconductor dies, onto a backside of a dicing tape, grinding a backside of the cut semiconductor wafer to singulate the plurality of semiconductor dies, exposing the backside of the dicing tape to ultraviolet (UV) light to soften the dicing tape between each of the plurality of semiconductor dies and stretching the dicing tape to increase a distance between the plurality of semiconductor dies, laminating a backside and sides of each of the plurality of semiconductor dies with a first layer of encapsulant material, exposing a front side of the dicing tape to UV light to release the dicing tape from the plurality of semiconductor dies, and laminating a front side of the semiconductor dies with a second layer of encapsulant material.

Abstract: A system is disclosed for diagnosing cylinder misfiring in an internal combustion engine. A control computer is configured to periodically diagnose whether each cylinder of the engine is firing or misfiring, and to log information relating to such cylinder firing or misfiring.

Abstract: A system is disclosed for diagnosing cylinder misfiring in an internal combustion engine. A control computer is configured to periodically diagnose whether each cylinder of the engine is firing or misfiring, and to log information relating to such cylinder firing or misfiring.