Abstract: Disclosed is a method for pre-design estimation of coupling noise and avoidance of coupling noise failures in interconnects. An initial routing of a plurality of nets is estimated utilizing global paths. Then, the worst-case and average-case models for various parameters of each net are evaluated. With these models, a noise analysis is completed by which a determination is made whether coupling noise of any one of the nets is above a threshold level for noise-induced failure (i.e., a noise-failure threshold). When it is determined that the estimated coupling noise of a net falls below the noise-failure threshold, a response mechanism is triggered for later implementation during detailed routing of the nets to prevent the coupling noise from reaching the noise-failure threshold.

Abstract: A method for timing and noise analysis in designing data processing chips is provided. The process begins by wiring all unconnected nets in the design and then using a 2½ D capacitance extraction technique built into a detailed router to extract all of the wired nets. The data from the extracted nets is then process using a timing and analysis tool. Optimization programs are then used to generate fixes for any nets in the design which contribute to timing and noise failures. The present invention gives designers the capability of fast and accurate interconnect extraction within the routing tool. In addition, this technique is incremental. Any wiring changes can be quickly re-extracted, since only local information is required for extraction. This incremental capability allows designers to perform quick iterations of wiring, extraction and timing analysis.

Abstract: A method for performing capacitance estimations on an integrated circuit design routed by a global routing tool is disclosed. Routing areas and pin locations of a net within an integrated circuit design are initially obtained from a global routing tool. Common boundaries among the routing areas are then defined. Before the performance of a detailed routing step, congestion information furnished by the global routing tool is utilized to perform probabilistic capacitance calculations for an interconnect that can be routed within the routing areas via the defined common boundaries to connect the pin locations.

Abstract: A method for timing and noise analysis in designing data processing chips is provided. The process begins by wiring all unconnected nets in the design and then using a 2-½ D capacitance extraction technique built into a detailed router to extract all of the wired nets. The data from the extracted nets is then processed using a timing and analysis tool. Optimization programs are then used to generate fixes for any nets in the design which contribute to timing and noise failures. The present invention gives designers the capability of fast and accurate interconnect extraction within the routing tool. In addition, this technique is incremental. Any wiring changes can be quickly re-extracted, since only local information is required for extraction. This incremental capability allows designers to perform quick iterations of wiring, extraction and timing analysis.

Abstract: A method for performing circuit analysis on an integrated-circuit design having design data available in different forms is disclosed. In accordance with the method and system of the present invention, the integrated-circuit design includes multiple networks, and the different forms of design data may appear within one of the networks. For all of the networks within the integrated-circuit design, different forms of design data are categorized into at least three databases. The first of the at least three databases may contain three-dimensional extraction information, the second of the databases may contain wiring information, and the third of the databases may contain pre-wiring information. For each of the networks, a determination is made as to whether or not three-dimensional extraction information is available. In response to a determination that three-dimensional extraction information is available, performing circuit analysis by utilizing the three-dimensional extraction information.

Abstract: A method and system for performing timing analysis on an integrated circuit design are disclosed. It is always advantageous to be able to conveniently perform a timing analysis on the entire IC design at any stage of the design process in order to gain more accurate timing information about the design. However, at an early stage of the design process, the available physical circuit data are often incomplete, not to mention these preliminary data are usually of a lower quality as far as capability of providing an accurate RC delay and capacitance estimation is concerned. To make the best usage of the preliminary data, the present disclosure describes a method of performing a fleeting timing analysis that can be very useful during an early floor planning stage of the design process when there is no opportunity to buffer or widen any exceptionally long interconnect wires within the IC circuit design.

Abstract: A structure for reducing cross-talk in VLSI circuits is disclosed. By filling voltage and ground metal lines in free or unused channels of VLSI chips and connecting them efficiently to the regular power image of the chip, the line to line coupling through vertical layers is reduced almost to zero and in-layer line to line coupling is also drastically reduced.

Abstract: A method and system for characterizing interconnect data within an integrated circuit in order to facilitate parasitic capacitance estimation is disclosed. An integrated circuit typically includes a substrate layer and several metal layers. In accordance with the method and system of the present invention, an overlapping area of interconnect wires is first identified within the integrated circuit. This overlapping area, which is a polygon, may be formed between the substrate layer and at least one interconnect wire in one of the several metal layers. The overlapping area may also be formed between two interconnect wires, each in a different one of the several metal layers. A netname for the overlapping area is then recorded. Finally, a netname of an interconnect wire in a metal layer that is at the same level of an interconnect wire within the overlapping area and an associated distance from each side of the overlapping area is recorded, for every interconnect wire within the overlapping area.

Abstract: A method for determining an optimal design for wiring interconnect and driver power for a designed target delay begins at the floor planning stages of the chip design and may be repeated during the design process. The designer initially specifies a maximum width that wires are allowed to use and a target delay value. Then the designer gives values to weights used in the calculation of an optimization function G(d,p,w), where d is the delay, p is the power, and w is wire width. An "ideal" slope ##EQU1## is calculated, assuming zero resistance. The designer chooses a slope decrease value from the "ideal" slope value. For each set wire width, the delay (at the proper slope) belonging to that particular wire width is obtained. With these inputs, an optimization program according to the invention is run. This program then calculates values of the function G(d,p,w) for increasing wire pitches, starting with the minimum allowed by the technology.