Patent number: 9046250
Abstract: Methods and apparatus related to a circuit board having a dielectric layer (140A/B, 240A/B, 340, 440, 340B, 440B) on the top and/or bottom thereof. A circuit board is provided having a core layer (110, 210, 310, 410) and at least one conductive layer (130A/B,132A/B, 230A/B, 232A/B, 330, 430) positioned on a first side of the core layer (110, 210, 310, 410). An outer dielectric layer (140A/B, 240A/B, 340, 440, 340B, 440B) is provided atop an outermost of the at least one conductive layer (130A/B, 132A/B, 230A/B, 232A/B, 330, 430). The dielectric layer (140A/B, 240A/B, 340, 440, 340B, 440B) includes a plurality of openings (334A, 336A, 445A) that provide access to at least one of connection pads and vias that are in electrical contact with one or more of the conductive layer(s) (130A/B, 132A/B, 230A/B, 232A/B, 330, 430).
Type:
Grant
Filed:
February 28, 2012
Date of Patent:
June 2, 2015
Assignee:
KONINKLIJKE PHILIPS N.V.
Inventor:
Pascal Pavao
Publication number: 20130329427
Abstract: Methods and apparatus related to a circuit board having a dielectric layer (140A/B, 240A/B, 340, 440, 340B, 440B) on the top and/or bottom thereof. A circuit board is provided having a core layer (110, 210, 310, 410) and at least one conductive layer (130A/B,132A/B, 230A/B, 232A/B, 330, 430) positioned on a first side of the core layer (110, 210, 310, 410). An outer dielectric layer (140A/B, 240A/B, 340, 440, 340B, 440B) is provided atop an outermost of the at least one conductive layer (130A/B, 132A/B, 230A/B, 232A/B, 330, 430). The dielectric layer (140A/B, 240A/B, 340, 440, 340B, 440B) includes a plurality of openings (334A, 336A, 445A) that provide access to at least one of connection pads and vias that are in electrical contact with one or more of the conductive layer(s) (130A/B, 132A/B, 230A/B, 232A/B, 330, 430).
Type:
Application
Filed:
February 28, 2012
Publication date:
December 12, 2013
Applicant:
KONINKLIJKE PHILIPS N.V.
Inventor:
Pascal Pavao