Patents by Inventor Pat O'Brien

Pat O'Brien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TREAD MARKER, TIRE WITH INTEGRAL TREAD MARKERS, AND METHODS FOR PRODUCING BOTH
    Publication number: 20130186531
    Abstract: Disclosed are several embodiments of a colorized tread marker for a tire, a method of manufacturing the tread markers, as well as a tire incorporating the colorized markers within the tire tread and a method for manufacturing the tire. The tread markers serve as both aesthetic complements to the tires' visual appearance, such as indicia of the source of manufacture, distribution, or point of consumer purchase of the tire, as well as tread wear indicators that notify consumers when a tire is in need of replacement to help ensure the safety of a vehicle's occupants as well as the public at large.
    Type: Application
    Filed: March 5, 2013
    Publication date: July 25, 2013
    Inventor: Pat O'Brien
  • TREAD MARKER, TIRE WITH INTEGRAL TREAD MARKERS, AND METHODS FOR PRODUCING BOTH
    Publication number: 20090114322
    Abstract: Disclosed are several embodiments of a colorized tread marker for a tire, a method of manufacturing the tread markers, as well as a tire incorporating the colorized markers within the tire tread and a method for manufacturing the tire. The tread markers serve as both aesthetic complements to the tires' visual appearance, such as indicia of the source of manufacture, distribution, or point of consumer purchase of the tire, as well as tread wear indicators that notify consumers when a tire is in need of replacement to help ensure the safety of a vehicle's occupants as well as the public at large.
    Type: Application
    Filed: November 6, 2008
    Publication date: May 7, 2009
    Inventor: Pat O'Brien
  • Flip chip integrated circuit and passive chip component package fabrication method
    Patent number: 6546620
    Abstract: A package includes both a flip chip mounted active chip component and a passive chip component. To form the package, a solder paste is screened onto a passive chip component contact on an upper surface of a substrate. A terminal of the passive chip component is aligned with the solder paste. The solder paste is melted to form a solder joint between the passive chip component contact and the terminal. Solder flux residue from the solder paste is removed. A solder bump is formed on a bond pad of an active chip component. The solder bump is aligned with an active chip component contact on the upper surface of the substrate. The solder bump is melted to form a bump between the active chip component contact and the bond pad, wherein the solder joint does not melt during the melting of the solder bump.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: April 15, 2003
    Assignee: Amkor Technology, Inc.
    Inventors: Frank Juskey, Christopher Scanlan, Pat O'Brien
  • Electronic package having flip chip integrated circuit and passive chip component
    Patent number: 6356453
    Abstract: A package includes both a flip chip mounted active Chip component and a passive chip component. The flip chip bumps between the bond pads of the active chip component and the substrate are low impedance. Further, by mounting the active chip component as a flip chip, the area on the substrate occupied by the active chip component is approximately equal to the area of the active chip component.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: March 12, 2002
    Assignee: Amkor Technology, Inc.
    Inventors: Frank Juskey, Christopher Scanlan, Pat O'Brien