Abstract: Techniques and mechanisms for the wireless transmission of power or control signals between two components of an implantable ophthalmic system are disclosed herein. An example device includes an accommodating intraocular lens (aIOL) and separate auxiliary electronics, both enclosed in biocompatible materials. The aIOL includes a dynamic optic, control logic, a battery and an antenna. The auxiliary electronics include an antenna, an energy storage cell, and a sensor. The auxiliary electronics may be wirelessly coupled to the aIOL for the wireless transmission of power or control signals.

Abstract: Techniques and mechanisms for the wireless transmission of power or control signals between two components of an implantable ophthalmic system are disclosed herein. An example device includes an accommodating intraocular lens (aIOL) and separate auxiliary electronics, both enclosed in biocompatible materials. The aIOL includes a dynamic optic, control logic, a battery and an antenna. The auxiliary electronics include an antenna, an energy storage cell, and a sensor. The auxiliary electronics may be wirelessly coupled to the aIOL for the wireless transmission of power or control signals.

Abstract: Techniques and mechanisms for the wireless transmission of power and sensor information between two components of an implantable ophthalmic device are disclosed herein. An example device includes an accommodating intraocular lens (aIOL) and separate auxiliary electronics, both enclosed in biocompatible materials. The aIOL includes a dynamic optic, control logic, a battery and an antenna. The auxiliary electronics include an antenna, an energy storage cell, and a sensor. The auxiliary electronics may be wirelessly coupled to the aIOL for the wireless transmission of power and sensor information.

Abstract: Techniques and mechanisms for the wireless transmission of power and sensor information between two components of an implantable ophthalmic device are disclosed herein. An example device includes an accommodating intraocular lens (aIOL) and separate auxiliary electronics, both enclosed in biocompatible materials. The aIOL includes a dynamic optic, control logic, a battery and an antenna. The auxiliary electronics include an antenna, an energy storage cell, and a sensor. The auxiliary electronics may be wirelessly coupled to the aIOL for the wireless transmission of power and sensor information.

Abstract: Techniques and mechanisms for the wireless transmission of power and sensor information between two components of an implantable ophthalmic device are disclosed herein. An example device includes an accommodating intraocular lens (aIOL) and separate auxiliary electronics, both enclosed in biocompatible materials. The aIOL includes a dynamic optic, control logic, a battery and an antenna. The auxiliary electronics include an antenna, an energy storage cell, and a sensor. The auxiliary electronics may be wirelessly coupled to the aIOL for the wireless transmission of power and sensor information.

Abstract: Techniques and mechanisms for the wireless transmission of power and sensor information between two components of an implantable ophthalmic device are disclosed herein. An example device includes an accommodating intraocular lens (aIOL) and separate auxiliary electronics, both enclosed in biocompatible materials. The aIOL includes a dynamic optic, control logic, a battery and an antenna. The auxiliary electronics include an antenna, an energy storage cell, and a sensor. The auxiliary electronics may be wirelessly coupled to the aIOL for the wireless transmission of power and sensor information.

Abstract: A method of focusing a digital camera module with an image sensor including capturing an image of a test target with the digital camera module, determining a focus quality of the image with the image sensor, outputting a signal related to the focus quality of the image from the digital camera module to a focusing station external to the digital camera module, and determining whether a position of a lens from the image sensor within the digital camera module should be altered to improve a focus quality of subsequently captured images.

Abstract: A camera module includes a gradient index lens on a spacer plate attached over an array of pixel sensors and associated micro lenses. The spacer plate and gradient index lens can be formed at the wafer level during the manufacture of multiple camera modules. A process for manufacturing the camera modules thus provides tolerances and yields provided by wafer processing techniques rather than mechanical assembly.

Abstract: A method of focusing a digital camera module with an image sensor including capturing an image of a test target with the digital camera module, determining a focus quality of the image with the image sensor, outputting a signal related to the focus quality of the image from the digital camera module to a focusing station external to the digital camera module, and determining whether a position of a lens from the image sensor within the digital camera module should be altered to improve a focus quality of subsequently captured images.

Abstract: A method of focusing a digital camera module with an image sensor including capturing an image of a test target with the digital camera module, determining a focus quality of the image with the image sensor, outputting a signal related to the focus quality of the image from the digital camera module to a focusing station external to the digital camera module, and determining whether a position of a lens from the image sensor within the digital camera module should be altered to improve a focus quality of subsequently captured images.

Abstract: A camera module includes a gradient index lens on a spacer plate attached over an array of pixel sensors and associated micro lenses. The spacer plate and gradient index lens can be formed at the wafer level during the manufacture of multiple camera modules. A process for manufacturing the camera modules thus provides tolerances and yields provided by wafer processing techniques rather than mechanical assembly.

Abstract: A camera module includes a gradient index lens on a spacer plate attached over an array of pixel sensors and associated micro lenses. The spacer plate and gradient index lens can be formed at the wafer level during the manufacture of multiple camera modules. A process for manufacturing the camera modules thus provides tolerances and yields provided by wafer processing techniques rather than mechanical assembly.

Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.

Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.

Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.

Abstract: A camera module includes a gradient index lens on a spacer plate attached over an array of pixel sensors and associated micro lenses. The spacer plate and gradient index lens can be formed at the wafer level during the manufacture of multiple camera modules. A process for manufacturing the camera modules thus provides tolerances and yields provided by wafer processing techniques rather than mechanical assembly.

Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.