Abstract: The present invention pertains to methods and apparatus for removal of one or more solutes from a supercritical process solution. Solute additives and contaminants are removed from supercritical processing solutions via a contaminant removal system that is either part of the process vessel itself or is part of a local recirculation loop in fluid communication with the process vessel. This invention provides supercritical processing methods and apparatus for the removal of additives and contaminants during circulation so that depressurization and substrate removal can occur without contamination. The removal in some cases, for example cleaning residue, can be done continuously during a process to improve its efficiency. Removal mechanisms may include separation, destruction, conversion of the contaminant to acceptable species, or combinations thereof.

Abstract: Methods for cleaning semiconductor wafers are presented. Contaminants, particularly photoresist and post-etch residue, are removed from semiconductor wafers. A wafer or wafers is first treated with a peroxide-containing medium, for example, to oxidatively cleave bond structures of contaminants on the wafer work surface. Excitation energy is used to activate the peroxide-containing medium toward the formation of radical species. After treatment with the peroxide-containing medium, a supercritical fluid treatment is used to remove any remaining contaminants as well as to condition the wafer for subsequent processing.

Abstract: A supercritical process vessel with an interior for holding a supercritical fluid is provided. A wafer support for supporting a wafer within the interior of a supercritical process vessel to expose the wafer to the supercritical fluid is provided. A lamp, which is able to operate at supercritical fluid pressures within the interior of the supercritical process vessel is provided.