Patents by Inventor Patrick Daney De Marcillac

Patrick Daney De Marcillac has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Identification of 3D printed objects
    Patent number: 11710327
    Abstract: In example implementations, a method is provided. The method includes printing a three-dimensional (3D) object that includes a secondary structure. The secondary structure is removed. A representation of a surface of the 3D object where the secondary structure was removed is captured. The 3D object is authenticated based on the representation of the surface.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: July 25, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Craig Peter Sayers, Patrick Daney De Marcillac, Wei Huang
  • GENERATION OF MODIFIED MODEL DATA FOR THREE-DIMENSIONAL PRINTERS
    Publication number: 20220363004
    Abstract: Model data is obtained, defining parts to be generated by a three-dimensional printer. A sprue is determined to connect the parts, and a label is automatically generated on the sprue which identifies the parts connected to the sprue. Modified model data is generated representing the parts and the sprue.
    Type: Application
    Filed: October 16, 2019
    Publication date: November 17, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventor: Patrick Daney de Marcillac
  • IDENTIFICATION OF 3D PRINTED OBJECTS
    Publication number: 20210224535
    Abstract: In example implementations, a method is provided. The method includes printing a three-dimensional (3D) object that includes a secondary structure. The secondary structure is removed. A representation of a surface of the 3D object where the secondary structure was removed is captured. The 3D object is authenticated based on the representation of the surface.
    Type: Application
    Filed: December 1, 2020
    Publication date: July 22, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Craig Peter Sayers, Patrick Daney De Marcillac, Wei Huang