Patents by Inventor Patrick G. Kim

Patrick G. Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for interconnecting devices using an adhesive
    Patent number: 6439898
    Abstract: A method and apparatus for interconnecting at least two devices. Each of the interconnected devices includes a contact structure for electrically and/or physically interconnecting the devices. Preferably, the contact structure for at least one of the devices includes a spring contact. An adhesive, such as a UV-curable adhesive, is applied to at least a portion of one of the devices, and once the adhesive is applied, the devices are assembled, i.e., brought into sufficient proximity so that the contact structures interconnect the devices. The adhesive can be applied directly to contact structures of one of the devices and/or can be applied to other portions of the devices so that the adhesive flows around the contact structures during assembly. The adhesive is then cured to bond the devices together.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: August 27, 2002
    Assignee: Xerox Corporation
    Inventors: Christopher L. Chua, David K. Fork, Patrick G. Kim, Linda Romano
  • Wear-resistant spring contacts
    Patent number: 6352454
    Abstract: A spring contact includes a free portion having a tip. The free portion includes a contact surface and side surfaces. In some embodiments, a wear resistant material is formed on only selected portions of the tip. In other embodiments, the wear resistant material is formed on the contact surface and on the side surfaces. The wear resistant material increases the wear resistance of the spring contact. The spring contacts can be used in probes.
    Type: Grant
    Filed: October 20, 1999
    Date of Patent: March 5, 2002
    Assignee: Xerox Corporation
    Inventors: Patrick G. Kim, Donald L. Smith, Andrew S. Alimonda
  • Method and apparatus for interconnecting devices using an adhesive
    Publication number: 20010053620
    Abstract: A method and apparatus for interconnecting at least two devices. Each of the interconnected devices includes a contact structure for electrically and/or physically interconnecting the devices. Preferably, the contact structure for at least one of the devices includes a spring contact. An adhesive, such as a UV-curable adhesive, is applied to at least a portion of one of the devices, and once the adhesive is applied, the devices are assembled, i.e., brought into sufficient proximity so that the contact structures interconnect the devices. The adhesive can be applied directly to contact structures of one of the devices and/or can be applied to other portions of the devices so that the adhesive flows around the contact structures during assembly. The adhesive is then cured to bond the devices together.
    Type: Application
    Filed: February 28, 2001
    Publication date: December 20, 2001
    Applicant: Xerox Corporation
    Inventors: Christopher L. Chua, David K. Fork, Patrick G. Kim, Linda Romano
  • Method and apparatus for interconnecting devices using an adhesive
    Patent number: 6213789
    Abstract: A method and apparatus for interconnecting at least two devices. Each of the interconnected devices includes a contact structure for electrically and/or physically interconnecting the devices. Preferably, the contact structure for at least one of the devices includes a spring contact. An adhesive, such as a UV-curable adhesive, is applied to at least a portion of one of the devices, and once the adhesive is applied, the devices are assembled, i.e., brought into sufficient proximity so that the contact structures interconnect the devices. The adhesive can be applied directly to contact structures of one of the devices and/or can be applied to other portions of the devices so that the adhesive flows around the contact structures during assembly. The adhesive is then cured to bond the devices together.
    Type: Grant
    Filed: December 15, 1999
    Date of Patent: April 10, 2001
    Assignee: Xerox Corporation
    Inventors: Christopher L. Chua, David K. Fork, Patrick G. Kim, Linda Romano