Patents by Inventor Patrick Gorun
Patrick Gorun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9281229Abstract: A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly.Type: GrantFiled: December 1, 2014Date of Patent: March 8, 2016Assignee: SUSS MicroTec Lithography GmbHInventors: Gregory George, Hale Johnson, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles
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Publication number: 20150083342Abstract: A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly.Type: ApplicationFiled: December 1, 2014Publication date: March 26, 2015Applicant: SUSS MICROTEC LITHOGRAPHY, GMBHInventors: GREGORY GEORGE, HALE JOHNSON, PATRICK GORUN, EMMETT HUGHLETT, JAMES HERMANOWSKI, MATTHEW STILES
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Patent number: 8919412Abstract: A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly.Type: GrantFiled: April 15, 2010Date of Patent: December 30, 2014Assignee: Suss Microtec Lithography, GmbHInventors: Gregory George, Hale Johnson, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles
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Patent number: 8267143Abstract: An apparatus for debonding two temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge arranged adjacent to a first edge of the chuck and connected to a hinge. The flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor moves the contact roller vertical to the plane of the chuck top surface.Type: GrantFiled: April 15, 2010Date of Patent: September 18, 2012Assignee: Suss Microtec Lithography, GmbHInventors: Gregory George, Hale Johnson, Patrick Gorun, James Hermanowski, Matthew Stiles
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Patent number: 8181688Abstract: An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.Type: GrantFiled: April 15, 2010Date of Patent: May 22, 2012Assignee: Suss Microtec Lithography, GmbHInventors: Hale Johnson, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles, Michael Kuhnle
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Publication number: 20110010908Abstract: A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly.Type: ApplicationFiled: April 15, 2010Publication date: January 20, 2011Applicant: SUSS MICROTEC INCInventors: GREGORY GEORGE, HALE JOHNSON, PATRICK GORUN, EMMETT HUGHLETT, JAMES HERMANOWSKI, MATTHEW STILES
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Publication number: 20110014774Abstract: An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.Type: ApplicationFiled: April 15, 2010Publication date: January 20, 2011Applicant: SUSS MICROTEC INCInventors: HALE JOHNSON, PATRICK GORUN, EMMETT HUGHLETT, JAMES HERMANOWSKI, MATTHEW STILES, MICHAEL KUHNLE
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Publication number: 20100263794Abstract: A debonder apparatus for debonding two via an adhesive layer combined with a release layer temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder configured to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge connected to a hinge and a second edge diametrically opposite to the first edge, and the flex plate's first edge is arranged adjacent to a first edge of the chuck and the flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor is configured to move the contact roller vertical to the plane of the chuck top surface.Type: ApplicationFiled: April 15, 2010Publication date: October 21, 2010Applicant: SUSS MICROTEC INCInventors: GREGORY GEORGE, HALE JOHNSON, PATRICK GORUN, JAMES HERMANOWSKI, MATTHEW STILES
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Patent number: 7703658Abstract: An improved apparatus for filling patterned mold cavities formed on a surface of a mold structure with solder includes an injector head assembly comprising a solder reservoir having a bottom surface with an elongated slot for injecting solder into the mold cavities and a carriage assembly configured to carry and scan the mold structure under the injector head assembly. The mold structure is brought into contact with the solder reservoir bottom surface and a seal is formed between an area of the solder reservoir bottom surface surrounding the elongated slot and the mold structure surface and then the mold structure is scanned under the injector head assembly in a first direction from a starting position to a finish position for filling the mold cavities and in a second direction opposite to the first direction for returning back from the finish position to the starting position.Type: GrantFiled: March 27, 2008Date of Patent: April 27, 2010Assignee: Suss Microtec AGInventors: G. Gerard Gormley, Patrick Gorun, Michael Davidson
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Publication number: 20080237315Abstract: An improved apparatus for filling patterned mold cavities formed on a surface of a mold structure with solder includes an injector head assembly comprising a solder reservoir having a bottom surface with an elongated slot for injecting solder into the mold cavities and a carriage assembly configured to carry and scan the mold structure under the injector head assembly. The mold structure is brought into contact with the solder reservoir bottom surface and a seal is formed between an area of the solder reservoir bottom surface surrounding the elongated slot and the mold structure surface and then the mold structure is scanned under the injector head assembly in a first direction from a starting position to a finish position for filling the mold cavities and in a second direction opposite to the first direction for returning back from the finish position to the starting position.Type: ApplicationFiled: March 27, 2008Publication date: October 2, 2008Applicant: SUSS MICROTEC AGInventors: G. GERARD GORMLEY, PATRICK GORUN, MICHAEL DAVIDSON