Patents by Inventor Patrick Guay
Patrick Guay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230053631Abstract: Provided herein are various embodiments relating to antibodies that bind LILRB2. Anti-LILRB2 antibodies can be used in methods to treat disease, for example, cancer.Type: ApplicationFiled: June 13, 2022Publication date: February 23, 2023Inventors: Heather B. COHEN, Lauren Pepper MACKENZIE, Yasmin RAMSAY, Donald Raymond SHAFFER, Jeffrey Yan-Fei SMITH, Kristin Shanea O'MALLEY, Kevin Patrick GUAY
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Publication number: 20200339690Abstract: Provided herein are various embodiments relating to antibodies that bind LILRB2. Anti-LILRB2 antibodies can be used in methods to treat disease, for example, cancer.Type: ApplicationFiled: July 14, 2020Publication date: October 29, 2020Inventors: Heather B. COHEN, Lauren Pepper MACKENZIE, Yasmin RAMSAY, Donald Raymond SHAFFER, Jeffrey Yan-Fei SMITH, Kristin Shanea O'MALLEY, Kevin Patrick GUAY
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Publication number: 20200207856Abstract: Provided herein are various embodiments relating to antibodies that bind LILRB2. Anti-LILRB2 antibodies can be used in methods to treat disease, for example, cancer.Type: ApplicationFiled: March 11, 2020Publication date: July 2, 2020Inventors: Heather B. Cohen, Lauren Pepper MacKenzie, Yasmin Ramsay, Donald Raymond Shaffer, Jeffrey Yan-Fei Smith, Kristin Shanea O'Malley, Kevin Patrick Guay
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Patent number: 10618961Abstract: Provided herein are various embodiments relating to antibodies that bind LILRB2. Anti-LILRB2 antibodies can be used in methods to treat disease, for example, cancer.Type: GrantFiled: December 20, 2018Date of Patent: April 14, 2020Assignee: Jounce Therapeutics, Inc.Inventors: Heather B. Cohen, Lauren Pepper Mackenzie, Yasmin Ramsay, Donald Raymond Shaffer, Jeffrey Yan-Fei Smith, Kristin Shanea O'Malley, Kevin Patrick Guay
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Publication number: 20190194327Abstract: Provided herein are various embodiments relating to antibodies that bind LILRB2. Anti-LILRB2 antibodies can be used in methods to treat disease, for example, cancer.Type: ApplicationFiled: December 20, 2018Publication date: June 27, 2019Inventors: Heather B. COHEN, Lauren Pepper MACKENZIE, Yasmin RAMSAY, Donald Raymond SHAFFER, Jeffrey Yan-Fei SMITH, Kristin Shanea O'MALLEY, Kevin Patrick GUAY
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Patent number: 7528007Abstract: A method for assembling one or more semiconductor devices with an interposer includes positioning the one or more semiconductor devices within a receptacle that extends through the interposer, on a retention element that extends over at least a portion of the receptacle. Material may be introduced between at least a portion of an outer periphery of the one or more semiconductor devices and an inner periphery of the interposer to facilitate securing of the one or more semiconductor devices in place relative to the interposer. The retention element may be removed from the semiconductor devices. Once the one or more semiconductor devices are in place, they may be electrically connected to the interposer.Type: GrantFiled: April 25, 2006Date of Patent: May 5, 2009Assignee: Micron Technology, Inc.Inventors: Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay, Edmund Lua Koon Tian, Yap Kah Eng, Eric Tan Swee Seng
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Patent number: 7274095Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.Type: GrantFiled: June 8, 2004Date of Patent: September 25, 2007Assignee: Micron Technology, Inc.Inventors: Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay, Edmund Lua Koon Tian, Yap Kah Eng, Eric Tan Swee Seng
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Publication number: 20060194373Abstract: A method for assembling one or more semiconductor devices with an interposer includes positioning the one or more semiconductor devices within a receptacle that extends through the interposer, on a retention element that extends over at least a portion of the receptacle. Material may be introduced between at least a portion of an outer periphery of the one or more semiconductor devices and an inner periphery of the interposer to facilitation securing of the one or more semiconductor devices in place relative to the interposer. The retention element may be removed from the semiconductor devices. Once the one or more semiconductor devices are in place, they may be electrically connected to the interposer.Type: ApplicationFiled: April 25, 2006Publication date: August 31, 2006Inventors: Setho Fee, Lim Chye, Steven Heppler, Leng Yin, Keith Tan, Patrick Guay, Edmund Tian, Yap Eng, Eric Seng
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Publication number: 20040217459Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.Type: ApplicationFiled: June 8, 2004Publication date: November 4, 2004Inventors: Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay, Edmund Lua Koon Tian, Yap Kah Eng, Eric Tan Swee Seng
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Patent number: 6746894Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.Type: GrantFiled: April 19, 2001Date of Patent: June 8, 2004Assignee: Micron Technology, Inc.Inventors: Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay, Edmund Lua Koon Tian, Yap Kah Eng, Eric Tan Swee Seng
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Patent number: 6617201Abstract: An FBGA packaged device including a die adhered to a substrate with a small gap being formed between the die and substrate. An opening is formed through the substrate adjacent the center portion of the die. An encapsulating mold is formed around the die extending into the gap and also filling the channel. At least one barrier is disposed in the gap between the substrate and the die adjacent the channel to control the flow path of the encapsulating material as the mold is formed in the package.Type: GrantFiled: September 30, 2002Date of Patent: September 9, 2003Assignee: Micron Technology, Inc.Inventors: Lim T. Chye, Lee C. Kuan, Jeffrey Toh, Tim Teoh, Patrick Guay, Choong L. Wah
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Publication number: 20030025185Abstract: An FBGA packaged device including a die adhered to a substrate with a small gap being formed between the die and substrate. An opening is formed through the substrate adjacent the center portion of the die. An encapsulating mold is formed around the die extending into the gap and also filling the channel. At least one barrier is disposed in the gap between the substrate and the die adjacent the channel to control the flow path of the encapsulating material as the mold is formed in the package.Type: ApplicationFiled: September 30, 2002Publication date: February 6, 2003Inventors: Lim T. Chye, Lee C. Kuan, Jeffrey Toh, Tim Teoh, Patrick Guay, Choong L. Wah
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Patent number: 6486536Abstract: An FBGA packaged device including a die adhered to a substrate with a small gap being formed between the die and substrate. An opening is formed through the substrate adjacent the center portion of the die. An encapsulating mold is formed around the die extending into the gap and also filling the channel. At least one barrier is disposed in the gap between the substrate and the die adjacent the channel to control the flow path of the encapsulating material as the mold is formed in the package.Type: GrantFiled: August 29, 2000Date of Patent: November 26, 2002Assignee: Micron Technology, Inc.Inventors: Lim T. Chye, Lee C. Kuan, Jeffery Toh, Tim Teoh, Patrick Guay, Choong L. Wah
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Publication number: 20020142513Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.Type: ApplicationFiled: April 19, 2001Publication date: October 3, 2002Inventors: Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay, Edmund Lua Koon Tian, Yap Kah Eng, Eric Tan Swee Seng