Patents by Inventor Patrick H. Bair

Patrick H. Bair has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming an electronic pressure sensitive transducer on a printed circuit board
    Patent number: 7213323
    Abstract: The cost and complexity of an electronic pressure sensitive transducer are decreased by constructing such a transducer directly on a printed circuit board containing support electronics. Conductive traces are formed on the printed circuit board to define a contact area. A flexible substrate having an inner surface is positioned over the contact area. An adhesive spacer, substantially surrounding the contact area, attaches the flexible substrate to the printed circuit board. At least one resistive layer is deposited on the flexible substrate inner surface. In use, the resistive layer contacts at least two conductive traces in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: May 8, 2007
    Assignee: Interlink Electronics, Inc.
    Inventors: Jeffrey R. Baker, Carlos S. Sanchez, Patrick H. Bair