Patents by Inventor Patrick J. Schouterden

Patrick J. Schouterden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100317798
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than ?20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Application
    Filed: August 23, 2010
    Publication date: December 16, 2010
    Applicant: Dow Global Technologies Inc.
    Inventors: Jozef J. VanDun, Peter F.M. van den Berghe, Patrick J. Schouterden, Ruddy Nicasy, Johan Vanvoorden, Frederik E.I. Gemoets, Kalyan Sehanobish, Noorallah Jivraj, Ravi S. Dixit
  • Patent number: 7645835
    Abstract: Blend compositions containing a novel homopolymer, the use of which allows the incorporation of more comonomer in the additional components of the blend (for the same overall density) resulting in increased tie molecule formation and improvement in properties such as ESCR, toughness and impact strength are disclosed. The homopolymers are important for applications where a high density is needed to ensure certain mechanical properties like abrasion resistance, indentation resistance, pressure resistance, topload resistance, modulus of elasticity, or morphology (for the chlorination of PE to CPE) and additional advantages such as melt processability. The blend can be obtained by dry or melt mixing the already produced components, or through in-situ production by in parallel and/or in series arranged reactors. These resins can be used in applications such as films, blow molded, injection molded, and rotomolded articles, fibers, and cable and wire coatings and jacketings and, various forms of pipe.
    Type: Grant
    Filed: June 21, 2006
    Date of Patent: January 12, 2010
    Assignee: Dow Global Technologies, Inc.
    Inventors: Jozef J. Van Dun, Akira Miyamoto, Grant B. Jacobsen, Fumio Matsushita, Patrick J. Schouterden, Lee Spencer, Pak-Wing S. Chum, Larry A. Meiske, Peter L. Wauteraerts
  • Publication number: 20080161497
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than ?20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Application
    Filed: January 11, 2008
    Publication date: July 3, 2008
    Applicant: Dow Global Technologies Inc.
    Inventors: Jozef J. Van Dun, Patrick J. Schouterden, Kalyan Sehanobish, Peter F.M. van den Berghe, Noorallah Jivraj, Johan Vanvoorden, Ruddy Nicasy, Ravi S. Dixit, Frederik E.L. Gemoets
  • Patent number: 7153909
    Abstract: Blend compositions containing a novel homopolymer, the use of which allows the incorporation of more comonomer in the additional components of the blend (for the same overall density) resulting in increased tie molecule formation and improvement in properties such as ESCR, toughness and impact strength are disclosed. The homopolymers are important for applications where a high density is needed to ensure certain mechanical properties like abrasion resistance, indentation resistance, pressure resistance, topload resistance, modulus of elasticity, or morphology (for the chlorination of PE to CPE) and additional advantages such as melt processability. The blend can be obtained by dry or melt mixing the already produced components, or through in-situ production by in parallel and/or in series arranged reactors. These resins can be used in applications such as films, blow molded, injection molded, and rotomolded articles, fibres, and cable and wire coatings and jacketings and, various forms of pipe.
    Type: Grant
    Filed: June 13, 2002
    Date of Patent: December 26, 2006
    Assignee: Dow Global Technologies Inc.
    Inventors: Jozef J. Van Dun, Akira Miyamoto, Grant B. Jacobsen, Fumio Matsushita, Patrick J. Schouterden, Lee Spencer, Pak-Wing S. Chum, Larry A. Meiski, Peter L. Wauteraerts
  • Patent number: 7129296
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (LMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Grant
    Filed: April 2, 2004
    Date of Patent: October 31, 2006
    Assignee: Dow Global Technologies Inc.
    Inventors: Jozef J. Van Dun, Patrick J. Schouterden, Kalyan Sehanobish, Peter F. M. van den Berghen, Noorallah Jivraj, Ruddy Nicasy, Johan Vanvoorden, Ravi S. Dixit, Frederik E. Gemoets
  • Publication number: 20040198911
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Application
    Filed: April 2, 2004
    Publication date: October 7, 2004
    Inventors: Jozef J. Van Dun, Patrick J. Schouterden, Kalyan Sehanobish, Peter F. M. van den Berghen, Noorallah Jivraj, Ruddy Nicasy, Johan Vanvoorden, Ravi S. Dixit, Frederik E. Gemoets
  • Patent number: 6787608
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than −20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Grant
    Filed: August 16, 2002
    Date of Patent: September 7, 2004
    Assignee: Dow Global Technologies, Inc.
    Inventors: Jozef J. VanDun, Patrick J. Schouterden, Peter F. M. van den Berghe, Ruddy Nicasy, Johan Vanveorden, Frederick E. L. Gemoets, Kalyan Sehanobish, Noorallah Jivraj, Ravi S. Dixit
  • Publication number: 20030149180
    Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than −20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
    Type: Application
    Filed: August 16, 2002
    Publication date: August 7, 2003
    Applicant: Dow Global Technologies Inc.
    Inventors: Jozef J. Van Dun, Patrick J. Schouterden, Kalyan Sehanobish, Peter F.M. van den Berghe, Noorallah Jivraj, Johan Vanvoorden, Ravi S. Dixit, Ruddy Nicasy, Frederik E.L. Gemoets