Patents by Inventor Patrick Jose Lazatin
Patrick Jose Lazatin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8218320Abstract: A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid, and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines a tapered inlet distribution chamber configured to receive a coolant, C-shaped inlet manifolds configured to receive the coolant from the tapered inlet distribution chamber, inverted C-shaped outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and disposed in a circular arrangement. The outlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the inlet chamber. The body further defines a tapered outlet chamber configured to receive the coolant from the outlet manifolds, where the inlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the tapered outlet chamber.Type: GrantFiled: June 29, 2010Date of Patent: July 10, 2012Assignee: General Electric CompanyInventors: Adam Gregory Pautsch, Satish Sivarama Gunturi, Patrick Jose Lazatin
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Patent number: 8120915Abstract: A heat sink is provided for directly cooling at least one electronic device package having an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material, where the cooling piece defines at least one inlet manifold configured to receive a coolant and at least one outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a spiral arrangement. The cooling piece further defines a number of millichannels disposed in a radial arrangement and configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.Type: GrantFiled: August 23, 2010Date of Patent: February 21, 2012Assignee: General Electric CompanyInventors: Adam Gregory Pautsch, Satish Sivarama Gunturi, Patrick Jose Lazatin
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Publication number: 20110317369Abstract: A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines inlet manifolds configured to receive a coolant and outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a circular or spiral arrangement. Millichannels are formed in the body or in the lids, are disposed in a radial arrangement, and are configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to cool one of the upper and lower contact surfaces of the electronic device package. Heat sinks with a single lid are also provided.Type: ApplicationFiled: June 29, 2010Publication date: December 29, 2011Applicant: GENERAL ELECTRIC COMPANYInventors: Adam Gregory Pautsch, Satish Sivarama Gunturi, Patrick Jose Lazatin
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Publication number: 20110317368Abstract: A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid, and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines a tapered inlet distribution chamber configured to receive a coolant, C-shaped inlet manifolds configured to receive the coolant from the tapered inlet distribution chamber, inverted C-shaped outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and disposed in a circular arrangement. The outlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the inlet chamber. The body further defines a tapered outlet chamber configured to receive the coolant from the outlet manifolds, where the inlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the tapered outlet chamber.Type: ApplicationFiled: June 29, 2010Publication date: December 29, 2011Applicant: GENERAL ELECTRIC COMPANYInventors: Adam Gregory Pautsch, Satish Sivarama Gunturi, Patrick Jose Lazatin
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Publication number: 20100315782Abstract: A heat sink is provided for directly cooling at least one electronic device package having an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material, where the cooling piece defines at least one inlet manifold configured to receive a coolant and at least one outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a spiral arrangement. The cooling piece further defines a number of millichannels disposed in a radial arrangement and configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.Type: ApplicationFiled: August 23, 2010Publication date: December 16, 2010Applicant: GENERAL ELECTRIC COMPANYInventors: Adam Gregory Pautsch, Satish Sivarama Gunturi, Patrick Jose Lazatin
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Publication number: 20080185045Abstract: An activatable pump is provided. The pump includes a piston in slideable communication with an inner surface of a cylinder, which has a first end and a second end. A first control valve and a second control valve are in physical communication with the first end of the cylinder. The first control valve and the second control valve are in fluid communication with the piston. Either the first control valve or the second control valve is not a check valve. A first check valve and a second check valve are in physical communication with the second end of the cylinder. The first check valve and the second check valve are in fluid communication with the piston. A pressure controller communicates with the piston to control an amount of force by or on the piston. A method and an energy recovery apparatus are also provided.Type: ApplicationFiled: February 5, 2007Publication date: August 7, 2008Applicant: GENERAL ELECTRIC COMPANYInventors: Jeffrey David Erno, Daniel Jason Erno, Patrick Jose Lazatin, Philip Paul Beauchamp, Erik John Schoepke