Abstract: Static tendon attachments for motile tensile truss appliances are described which are simultaneously economic and support full undiminished service lifespans. These attachments impose compliant tendon bending over a substantial curvature, wherein the bending of a tendon follows an in-plane changing direction aligned to a tendon paired non-static pulley or sheave attachment. Attachments for trusses which have platforms which move extensively in three dimensions are described which have only a single rotating axis. Attachments for trusses which have platforms which move linearly, or in a plane, are described which have no moving parts other than the tendon itself. Attachments are presented for trussed platforms having 6 Degrees Of Freedom (6DOF), such as those useful for house 3D cement printers. Alternate attachments are presented for trussed platforms constrained to planar motion such as drop plotters, and in linear movement trusses such as semiconductor FOUP hoists, anti-sway cranes, and elevators.

Abstract: A uniaxial press for shaping pellets by compressing powder in a die by punches. The uniaxial press can be used in a restricted and hostile environment and includes small modules that can pass separately through narrow openings, the modules being assembled by placing over columns and by screwing, therefore by remote handling in the confined space where the press is to operate without requiring any further intervention. The actuation is generally exclusively electromechanical.

Abstract: A uniaxial press for shaping pellets by compressing powder in a die by punches. The uniaxial press can be used in a restricted and hostile environment and includes small modules that can pass separately through narrow openings, the modules being assembled by placing over columns and by screwing, therefore by remote handling in the confined space where the press is to operate without requiring any further intervention. The actuation is generally exclusively electromechanical.

Abstract: The subject invention relates to the fabrication of micro-optical structures in a glass-like transparent material using conventional photolithography processing steps. The glass-like material is a spin-on glass (SOG) material, which behaves like a negative-tone photoresist, and has high quality optical properties similar to those of glass. The present invention can take advantage of gray scale photomasks to illuminate the uncured spin-on material with various illumination intensities, thus resulting in variations in resultant film thickness of the SOG material after the chemical development step. This results in micro-optical structures that can be fabricated with the desired shapes, depending on the transmission characteristics of each region of the gray scale photomask.

Abstract: The present invention claims a unique way to pattern an optical microstructure immediately on top of a mass produced light-emitting device, such as a light emitting diode (LED), a vertical cavity surface emitting laser (VCSEL) or a photo detector, for the purpose of efficient coupling of light to or from the active region of the light-emitting device. The invention addresses the need to effectively and efficiently extract light from the light-emitting optoelectronic device. Finally, the invention allows for the optical microstructure to be deposited and patterned directly over the light-emitting device contained on a suitable substrate, such as a wafer.

Abstract: The subject invention relates to the fabrication of micro-optical structures in a glass-like transparent material using conventional photolithography processing steps. The glass-like material is a spin-on glass (SOG) material, which behaves like a negative-tone photoresist, and has high quality optical properties similar to those of glass. The present invention can take advantage of gray scale photomasks to illuminate the uncured spin-on material with various illumination intensities, thus resulting in variations in resultant film thickness of the SOG material after the chemical development step. This results in micro-optical structures that can be fabricated with the desired shapes, depending on the transmission characteristics of each region of the gray scale photomask.

Abstract: The present invention relates to a process for controlling and/or enhancing the light emission and/or amplitude of a light-emitting device comprising depositing on the surface of such light-emitting device a spin-on glass material at a process temperature of less than 225° C., wherein the spin-on glass material is directly patternable as a negative photoresist. The spin-on glass material is directly patternable using standard photolithography methods and may be used for the purpose of patterning mechanical stand-offs for light emitting device-packaging purposes.

Abstract: The present invention claims a unique way to pattern an optical microstructure immediately on top of a mass produced light-emitting device, such as a light emitting diode (LED), a vertical cavity surface emitting laser (VCSEL) or a photo detector, for the purpose of efficient coupling of light to or from the active region of the light-emitting device. The invention addresses the need to effectively and efficiently extract light from the light-emitting optoelectronic device. Finally, the invention allows for the optical microstructure to be deposited and patterned directly over the light-emitting device contained on a suitable substrate, such as a wafer.