Patents by Inventor Patrick N. Keifer

Patrick N. Keifer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8466207
    Abstract: Disclosed is a method for making a polyurethane closed-cell foam material exhibiting a bulk density below 4 lbs/ft3 and high strength. The present embodiment uses the reaction product of a modified MDI and a sucrose/glycerine based polyether polyol resin wherein a small measured quantity of the polyol resin is “pre-reacted” with a larger quantity of the isocyanate in a defined ratio such that when the necessary remaining quantity of the polyol resin is added to the “pre-reacted” resin together with a tertiary amine catalyst and water as a blowing agent, the polymerization proceeds slowly enough to provide a stable foam body.
    Type: Grant
    Filed: February 27, 2007
    Date of Patent: June 18, 2013
    Assignee: Sandia Corporation
    Inventors: Leroy L. Whinnery, Jr., Steven H. Goods, Dawn M. Skala, Craig C. Henderson, Patrick N. Keifer
  • Patent number: 7465419
    Abstract: A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.
    Type: Grant
    Filed: May 24, 2006
    Date of Patent: December 16, 2008
    Assignee: Sandia Corporation
    Inventors: Alfredo M. Morales, Linda A. Domeier, Marcela G. Gonzales, Patrick N. Keifer, Terry J. Garino
  • Patent number: 7090189
    Abstract: A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: August 15, 2006
    Assignee: Sandia National Laboratories
    Inventors: Alfredo Martin Morales, Linda A. Domeier, Marcela G. Gonzales, Patrick N. Keifer, Terry Joseph Garino
  • Publication number: 20030057096
    Abstract: A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.
    Type: Application
    Filed: August 15, 2002
    Publication date: March 27, 2003
    Inventors: Alfredo Martin Morales, Linda A. Domeier, Marcela G. Gonzales, Patrick N. Keifer, Terry Joseph Garino
  • Publication number: 20020179449
    Abstract: A sacrificial plastic mold having an electroplatable backing is provided as are methods of making such a mold via the infusion of a castable liquid formulation through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale master mold. Upon casting and demolding, the porous metal substrate is embedded within the cast formulation and projects a plastic structure with features determined by the mold tool. The plastic structure provides a sacrificial plastic mold mechanically bonded to the porous metal substrate, which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved, leaving the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.
    Type: Application
    Filed: January 17, 2002
    Publication date: December 5, 2002
    Inventors: Linda A. Domeier, Alfredo M. Morales, Marcela G. Gonzales, Patrick N. Keifer