Abstract: A side storage pod includes an outer enclosure having a sealing surface configured to couple to an EFEM and a side storage pod chamber having a body coupled to vertically-spaced storage members. Each of the vertically-spaced storage members is configured to support a corresponding substrate within the body. The side storage pod further includes a removable door. The removable door and the body are to seal relative to each other responsive to the removable door being in a closed position. A load-unload robot of the EFEM is to access the vertically-spaced storage members responsive to the removable door being in an open position. An environment within the side storage pod chamber is to be controlled to be one or more of: at first environmental conditions responsive to the removable door being in the closed position; or at second environmental conditions responsive to the removable door being in the open position.

Abstract: Electronic device processing assemblies including an EFEM with at least one side storage pod attached thereto. The side storage pod has a side storage pod container. A supply conduit extends between an upper plenum of the EFEM to the side storage pod container. A fan causes purge gas to simultaneously flow into the EFEM chamber and into the side storage pod container. The fan also causes recirculation of the purge gas from the EFEM chamber. Methods of operating EFEMs and EFEMs are also disclosed.

Abstract: A method includes flowing gas comprising an oxidation inhibiting gas into a chamber of a semiconductor processing system. The chamber includes one or more of a factory interface of the semiconductor processing system or an adjacent chamber that is mounted to the factory interface. The method further includes receiving, via one or more sensors coupled to the chamber, sensor data indicating at least one of a current oxygen level within the chamber or a current moisture level within the chamber. The method further includes determining, based on the sensor data, whether to perform an adjustment of a current amount of the oxidation inhibiting gas entering into the chamber. The method further includes, responsive to determining to perform the adjustment, causing the adjustment of the current amount of the oxidation inhibiting gas entering into the chamber.

Abstract: A side storage pod includes an outer enclosure having a sealing surface configured to couple to an EFEM and a side storage pod chamber having a body coupled to vertically-spaced storage members. Each of the vertically-spaced storage members is configured to support a corresponding substrate within the body. The side storage pod further includes a removable door. The removable door and the body are to seal relative to each other responsive to the removable door being in a closed position. A load-unload robot of the EFEM is to access the vertically-spaced storage members responsive to the removable door being in an open position. An environment within the side storage pod chamber is to be controlled to be one or more of: at first environmental conditions responsive to the removable door being in the closed position; or at second environmental conditions responsive to the removable door being in the open position.

Abstract: In some embodiments, a side storage pod apparatus of an equipment front end module (EFEM) includes a side storage enclosure having a surface configured to couple to a side wall of a body of the equipment front end module, and an opening configured to receive substrates from the equipment front end module. The EFEM further includes a side storage chamber within the side storage enclosure having a plurality of support members configured to support substrates thereon. The EFEM further includes a plenum chamber provided proximate the side storage chamber, the plenum chamber being a separate chamber from the side storage chamber and an exhaust port coupled to the plenum chamber.

Abstract: In some embodiments, a side storage pod of an equipment front end module is provided that includes (1) an outer enclosure having a sealing surface configured to couple to the equipment front end module; (2) a side storage pod chamber having a body with a plurality of vertically-spaced storage members each configured to support a substrate; and (3) an indexer operable to vertically move the side storage pod chamber so that different subgroups of storage members are accessible by a load-unload robot in the equipment front end module. In other embodiments, a heated side storage pod is provided enabling degassing of substrates stored therein. Methods for processing substrates are described, as are numerous other aspects.

Abstract: A method includes flowing gas comprising an oxidation inhibiting gas into a chamber of a semiconductor processing system. The chamber includes one or more of a factory interface of the semiconductor processing system or an adjacent chamber that is mounted to the factory interface. The method further includes receiving, via one or more sensors coupled to the chamber, sensor data indicating at least one of a current oxygen level within the chamber or a current moisture level within the chamber. The method further includes determining, based on the sensor data, whether to perform an adjustment of a current amount of the oxidation inhibiting gas entering into the chamber. The method further includes, responsive to determining to perform the adjustment, causing the adjustment of the current amount of the oxidation inhibiting gas entering into the chamber.

Abstract: A method of purging a substrate carrier at a load port includes: opening a door of a substrate carrier that is delivered to a load port; spraying the substrate carrier with a gas flow responsive to the opening the door; mapping substrates within the substrate carrier to generate a substrate map; determining a process purge state based on the substrate map; and activating one or more inter-substrate nozzle arrays and one or more curtain nozzle arrays using a predefined spray status configuration for the process purge state.

Abstract: In some embodiments, a side storage pod apparatus of an equipment front end module (EFEM) includes a side storage enclosure having a surface configured to couple to a side wall of a body of the equipment front end module, and an opening configured to receive substrates from the equipment front end module. The EFEM further includes a side storage chamber within the side storage enclosure having a plurality of support members configured to support substrates thereon. The EFEM further includes a plenum chamber provided proximate the side storage chamber, the plenum chamber being a separate chamber from the side storage chamber and an exhaust port coupled to the plenum chamber.

Abstract: Electronic device processing assemblies including an EFEM with at least one side storage pod attached thereto. The side storage pod has a side storage pod container. A supply conduit extends between an upper plenum of the EFEM to the side storage pod container. A fan causes purge gas to simultaneously flow into the EFEM chamber and into the side storage pod container. The fan also causes recirculation of the purge gas from the EFEM chamber. Methods of operating EFEMs and EFEMs are also disclosed.

Abstract: A method of purging a substrate carrier at a load port includes: opening a door of a substrate carrier that is delivered to a load port; spraying the substrate carrier with a gas flow responsive to the opening the door; mapping substrates within the substrate carrier to generate a substrate map; determining a process purge state based on the substrate map; and activating one or more inter-substrate nozzle arrays and one or more curtain nozzle arrays using a predefined spray status configuration for the process purge state.

Abstract: Embodiments of the present invention provide systems, apparatus, and methods for purging a substrate carrier. Embodiments include a frame configured to sit proximate to a load port door without interfering with operation of a factory interface or equipment front end module robot; one or more inter-substrate nozzle arrays supported by the frame and configured to spray gas into a substrate carrier; and one or more curtain nozzle arrays supported by the frame and configured to spray gas across an opening of the substrate carrier. Numerous additional aspects are disclosed.

Abstract: In some embodiments, a side storage pod of an equipment front end module is provided that includes (1) an outer enclosure having a sealing surface configured to couple to the equipment front end module; (2) a side storage pod chamber having a body with a plurality of vertically-spaced storage members each configured to support a substrate; and (3) an indexer operable to vertically move the side storage pod chamber so that different subgroups of storage members are accessible by a load-unload robot in the equipment front end module. In other embodiments, a heated side storage pod is provided enabling degassing of substrates stored therein. Methods for processing substrates are described, as are numerous other aspects.

Abstract: Embodiments of the present invention provide systems, apparatus, and methods for purging a substrate carrier. Embodiments include a frame configured to sit proximate to a load port door without interfering with operation of a factory interface or equipment front end module robot; one or more inter-substrate nozzle arrays supported by the frame and configured to spray gas into a substrate carrier; and one or more curtain nozzle arrays supported by the frame and configured to spray gas across an opening of the substrate carrier. Numerous additional aspects are disclosed.

Abstract: A programming interface for a hardware system includes an embedded layer for programmatic access to a physical realization of hardware, a simulation system for simulation of the hardware, and a diagnostics engine that analyzes and compares feedback data from the simulation system and the physical realization. The programming interface may be usefully employed, for example, in the design, purchase, and deployment of robotics for semiconductor manufacturing.

Abstract: A variety of process modules are described for use in semiconductor manufacturing processes.

Abstract: Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

Abstract: Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

Abstract: A programming interface for a hardware system includes an embedded layer for programmatic access to a physical realization of hardware, a simulation system for simulation of the hardware, and a diagnostics engine that analyzes and compares feedback data from the simulation system and the physical realization. The programming interface may be usefully employed, for example, in the design, purchase, and deployment of robotics for semiconductor manufacturing.

Abstract: An aspect of the present invention relates to methods and systems for creating real-time closed loop parametrically driven simulations for inverse kinematics defined objects using models created by a computer aided design application. In embodiments, custom design inverse kinematics devices are imported into the simulation application and users interactively modify parameters defining the inverse kinematics device.