Patents by Inventor Patrick Y. Huet

Patrick Y. Huet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8289510
    Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: October 16, 2012
    Assignee: KLA-Tencor Corporation
    Inventors: Patrick Y. Huet, Robinson Piramuthu, Martin Plihal, Christopher W. Lee, Cho H. Teh, Yan Xiong
  • Patent number: 8165837
    Abstract: A computerized method for categorizing defects on a substrate. A list of defects on the substrate is received as input to a processor, where each defect is represented by a defect location and an associated micro-defect code. The input is analyzed with the processor to detect spatial clusters of defects on the substrate. The spatial clusters are analyzed with the processor to determine which of the spatial clusters represent known macro-defects and which of the spatial clusters represent unknown macro-defects. The micro-defect code associated with each defect that is included in one of the spatial clusters that is determined to be a known macro-defect is changed with the processor with a macro-defect code that is associated solely with the known macro-defect. The processor analyzes the defects that are included in one of the spatial clusters that is determined to be an unknown macro-defect to determine a predominantly occurring micro-defect code.
    Type: Grant
    Filed: June 5, 2009
    Date of Patent: April 24, 2012
    Assignee: KLA-Tencor Corporation
    Inventors: Saravanan Paramasivam, Patrick Y. Huet, Martin Plihal, Luc Debarge
  • Publication number: 20110137576
    Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.
    Type: Application
    Filed: February 10, 2011
    Publication date: June 9, 2011
    Applicant: KLA-TENCOR CORPORATION
    Inventors: Patrick Y. Huet, Robinson Piramuthu, Martin Plihal, Christopher W. Lee, Cho H. Teh, Yan Xiong
  • Publication number: 20100067781
    Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.
    Type: Application
    Filed: November 25, 2009
    Publication date: March 18, 2010
    Applicant: KLA-TENCOR CORPORATION
    Inventors: Patrick Y. Huet, Robinson Piramuthu, Martin Plihal, Christopher W. Lee, Cho H. Teh, Yan Xiong
  • Patent number: 7646476
    Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.
    Type: Grant
    Filed: May 9, 2008
    Date of Patent: January 12, 2010
    Assignee: KLA-Tencor Corporation
    Inventors: Patrick Y. Huet, Robinson Piramuthu, Martin Plihal, Christopher W. Lee, Cho H. Teh, Yan Xiong
  • Publication number: 20080204739
    Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.
    Type: Application
    Filed: May 9, 2008
    Publication date: August 28, 2008
    Applicant: KLA-TENCOR CORPORATION
    Inventors: Patrick Y. Huet, Robinson Piramuthu, Martin Plihal, Christopher W. Lee, Cho H. Teh, Yan Xiong
  • Patent number: 7394534
    Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: July 1, 2008
    Assignee: KLA-Tencor Corporation
    Inventors: Patrick Y. Huet, Robinson Piramuthu, Martin Plihal, Christopher W. Lee, Cho H. Teh, Yan Xiong
  • Patent number: 7006886
    Abstract: A method for analyzing defects on a substrate, including inspecting the substrate to detect the defects, identifying the defects by location, analyzing the defects to detect extended objects, and analyzing the extended objects for repetition across the substrate. Thus, the present invention extends beyond the present analysis methods, by analyzing the extended objects for repetition across the substrate. In this manner, correlation with processing problems can be more readily detected, in cases where the individual defects themselves, of which the extended objects are formed, do not appear to have repeating properties.
    Type: Grant
    Filed: January 12, 2004
    Date of Patent: February 28, 2006
    Assignee: KLA Tencor-Technologies Corporation
    Inventors: Patrick Y. Huet, Robinson Piramuthu, Martin Plihal
  • Patent number: 6718526
    Abstract: A system for determining an assigned classification for a set of physical events on a substrate. Sensors sense the physical events on the substrate and produce event data. A plug in rule module manager receives and manages any number of plug in rule modules. Each plug in rule module has an input, a local filter, an analyzer, and an output. The input receives the event data and confidence values from preceding plug in rule modules. The local filter analyzes the received confidence values from the preceding plug in rule modules and selectively by passes the plug in rule module based at least in part upon the received confidence values from the preceding plug in rule modules. The analyzer analyzes the event data in view of a given classification associated with the plug in rule module, and assigns a confidence value based at least in part upon how well the event data fits the given classification. The output provides the confidence value to subsequent plug in rule modules.
    Type: Grant
    Filed: February 7, 2003
    Date of Patent: April 6, 2004
    Assignee: KLA-Tencor Corporation
    Inventors: Peter Eldredge, Patrick Y. Huet, Robinson Piramuthu, Sandeep Bhagwat, Kai Chi, Kai Liu, Martin Plihal, Shaio Roan, Maruti Shanbhag