Abstract: A system and method comprising a master electrode arranged on substrate, said master electrode comprising a pattern layer, least partly of an insulating material and having a first surface provided with a plurality of cavities in which a conducting material is arranged, said electrode conducting material being electrically connected to at least one electrode current supply contact; said substrate comprising a top surface in contact with or arranged adjacent said first surface and having conducting material and/or structures of a conducting material arranged thereon, said substrate conducting material being electrically connected to at least one current supply contact; whereby a plurality of electrochemical cells are formed delimited by said cavities, said substrate conducting material and said electrode conducting material, said cells comprising an electrolyte; herein an electrode resistance between said electrode conducting material and said electrode current supply contact and a substrate resistance between

Abstract: The present invention concerns an electrochemical pattern replication method, ECPR, and a construction of a conductive electrode for production of applications involving micro and nano structures. An etching or plating pattern, which is defined by a conductive electrode, a master electrode, is replicated on an electrically conductive material, a substrate. The master electrode is put in close contact with the substrate and the etching/plating pattern is directly transferred onto the substrate by using a contact etching/plating process. The contact etching/plating process is performed in local etching/plating cells, that are formed in closed or open cavities between the master electrode and the substrate.