Patents by Inventor Patrizio Broglia

Patrizio Broglia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interposer for connecting two substrates and resulting assembly
    Patent number: 6493240
    Abstract: The present invention is an interposer for electrically coupling a microcard with a mother board. The interposer includes a frame which is interposed between the microcard and the motherboard, electrically connecting the microcard and the motherboard by means of plated via-holes. The substrate is organic and a plurality of chips are mounted on both sides of the substrate. On the opposite sides of the interposer are pluralities of metal pads which are coupled by metallized via holes, the pads in turn connected to the chips, thereby coupling chips or cards on one side of the interposer to chips or boards on the other side. Electrical connection between the chips on the top side of the substrate and the metal pads on the lower side of the substrate is provided by the metallized via holes.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: December 10, 2002
    Assignee: International Business Machines Corporation
    Inventors: Patrizio Broglia, Francesco Garbelli, Alberto Monti
  • Interposer for connecting two substrates and resulting assembly
    Publication number: 20010046129
    Abstract: The present invention is an interposer for electrically coupling a microcard with a mother board. The interposer includes a frame which is interposed between the microcard and the motherboard, electrically connecting the microcard and the motherboard by means of plated via-holes. The substrate is organic and a plurality of chips are mounted on both sides of the substrate. On the opposite sides of the interposer are pluralities of metal pads which are coupled by metallized via holes, the pads in turn connected to the chips, thereby coupling chips or cards on one side of the interposer to chips or boards on the other side. Electrical connection between the chips on the top side of the substrate and the metal pads on the lower side of the substrate is provided by the metallized via holes.
    Type: Application
    Filed: May 17, 2001
    Publication date: November 29, 2001
    Applicant: International Business Machines Corporation
    Inventors: Patrizio Broglia, Francesco Garbelli, Alberto Monti