Abstract: A non-volatile memory device includes a plurality of MOS transistors 34 and 36 connected to respective word lines 16 and 18 to allow individual pages of memory stored in the memory cells 8a, 10a and 8b, 10b on the respective word lines 16 and 18 to be erased and erase verified. A method of erasing a page of memory cells includes the steps of applying an erase voltage to one of the MOS transistors 16 and 18 to erase the page of memory cells along the respective word line, and applying an initial erase-inhibit floating voltage to other MOS transistors which are connected to the word lines unselected for page erase. In an erase verify mode, an erase verify voltage is applied to the word line which was selected for page erase in the erase mode, and an erase verify unselect voltage is applied to the word lines which was not selected for page erase.

Abstract: In the programming of a non-volatile memory device, such as a NAND flash memory device 100, a positive bias voltage V.sub.bias is applied to a bit line 44 to set a respective memory gate 44a in a programmed state. In a further embodiment, the positive bias voltage V.sub.bias is obtained by dividing the select drain gate voltage V.sub.cc using two resistors 56 and 58 connected in series.

Abstract: A method is provided for biasing a NAND array EEPROM during programming to allow the array to be scaled down further before reach punchthrough. The sources of the ground-select transistors of the NAND array are biased at V.sub.cc instead of ground to reduce the voltage drop across the source and drain of the ground-select transistors. As a result, the channel length of the ground-select transistors can be further shortened before punchthrough is obtained, resulting in a higher density EEPROM.

Abstract: A charge pump circuit having a fast rise time and reduced physical area is disclosed. The charge pump includes a plurality of stages having a non-uniform series of bootstrap capacitors. By using non-uniform capacitors at the various stages, charging rise time is enhanced while at the same time reducing the overall physical size of the charge pump.

Abstract: A reference voltage circuit is disclosed that is independent of the voltage supply as well as substantially insensitive to process and temperature variations. The reference voltage circuit includes an intrinsic transistor circuit which includes a plurality of intrinsic transistors of equal size. The intrinsic transistor circuit is coupled to a current mirror circuit, and a plurality of threshold transistors. In so doing, a reference voltage circuit is provided that is substantially independent of process and temperature variations. In addition, by grounding the source connections of the plurality of threshold transistors, the reference voltage circuit output voltage also is substantially independent of supply voltage variations.

Abstract: In a high voltage pass gate suitable for use as a block decoder in a flash memory circuit, the boosting of the block decoder's internal nodes is performed using coupling capacitors and boost transistors which are decoupled from the high capacitance pass gate node. The block decoder uses three internal block decoder nodes. Each of the three nodes is held to ground by a corresponding discharge transistor when the block is unselected. Each of the three nodes of a selected block is discharged to a normal supply voltage by a corresponding diode-connected regulation transistor when the high voltage supply is turned off after a programming operation has finished. Each of the three nodes has a separate coupling capacitor associated with it. One of the nodes is connected to the gates of the high voltage pass transistors, this node has high capacitance. The remaining two nodes have relatively small coupling capacitors.

Abstract: A series select transistor and a source select transistor are connected in series at the end of a NAND string of floating gate data storage transistors. The floating gates, the series select gate, and the source select gate are all preferably formed of polysilicon. The same tunnel oxide layer is used as gate oxide for the series select transistor and source select transistor as well as for the floating gate data storage transistors. Two layers of polysilicon in the series select gate and the source select gates are tied together. The series select transistor is tied to the last transistor in the NAND string. The source select transistor is tied to the array Vss supply. In order to program inhibit a specific NAND cell during the programming of another NAND cell, the gate of the series select transistor is raised to Vcc, while the gate of the source select transistor is held to ground.

Abstract: According to an aspect of the embodiments, the block decoder control circuits which drive the pass transistors for the word lines for a flash memory array are driven with a control voltage that is regulated to be one enhancement transistor's threshold voltage higher than the highest voltage that is actually driven onto the word lines. According to another aspect of some of the embodiments, the block decoder control circuits are implemented with transistors having a very low threshold voltage. According to yet another aspect of some of the embodiments, a special series connection is used to prevent any leakage current through the block decoder control circuit from the high voltage generating charge pumps which might otherwise result from the use of low threshold voltage transistors. In the special series connection, any leakage current occurs from the supply voltage source rather than from the high voltage generating charge pumps.

Abstract: Two NMOS boost transistors have their sources connected to the high voltage input while their drains and gates are cross-connected. Two coupling capacitors connect two alternate phase clocks to the gates of the two cross-connected boost transistors. An NMOS pass transistor has its gate connected to the drain of one of the NMOS boost transistors, its source connected to the high voltage input, and its drain connected to the output. In an embodiment, two diode-connected regulation transistors connect the gates of the boost transistors to the high voltage input. These connections insure that the gates of the boost transistors and the gate of the pass transistor never reach voltages higher than one threshold voltage above the high voltage input. In another embodiment, two discharge transistors have their drains connected to a decode input, their sources connected to the gates of the boost transistors, and their gates connected to the positive power supply.

Abstract: According to an aspect of the embodiments, the block decoder control circuits which drive the pass transistors for the word lines for a flash memory array are driven with a control voltage that is regulated to be one enhancement transistors threshold voltage higher than the highest voltage that is actually driven onto the word lines. According to another aspect of some of the embodiments, the block decoder control circuits are implemented with transistors having a very low threshold voltage. According to yet another aspect of some of the embodiments, a special series connection is used to prevent any leakage current through the block decoder control circuit from the high voltage generating charge pumps which might otherwise result from the use of low threshold voltage transistors. In the special series connection, any leakage current occurs from the supply voltage source rather than from the high voltage generating charge pumps.

Abstract: A high-voltage level shifter includes one or more complementary NMOS/PMOS series intermediate transistor pairs to divide the high-voltage supply range into two or more sub-ranges. The level shifter has a differential structure with complementary NMOS input transistors. Cross-coupled PMOS output transistors provide complementary outputs. The complementary NMOS/PMOS series intermediate transistor pairs separate the NMOS input transistor drains from the PMOS output transistor drains. In order to divide the high voltage range into h subranges, h-1 complementary NMOS/PMOS series intermediate transistor pairs are used each being biased by monotonically increasing fixed intermediate voltages. In a shared-bias embodiment, each complementary NMOS/PMOS series intermediate transistor pair is biased by a single corresponding intermediate voltage.

Abstract: A charge pump circuit having a fast rise time and reduced physical area is disclosed. The charge pump includes a plurality of stages having a non-uniform series of bootstrap capacitors. By using non-uniform capacitors at the various stages, charging rise time is enhanced while at the same time the overall physical size of the charge pump is reduced.

Abstract: There is provided an improved method for eliminating hot-carrier disturb during a read operation in a NAND memory architecture in which a floating gate device is used as a select gate. A first positive pulse voltage having a ramp-rate characteristic on its leading edge is applied to the drain of the floating gate device during the read operation. Simultaneously, a second positive pulse voltage is applied to the control gate of the floating gate device during the read operation so as to overlap the first positive pulse voltage.

Abstract: Two NMOS boost transistors have their sources connected to the high voltage input while their drains and gates are cross-connected. Two coupling capacitors connect two alternate phase clocks to the gates of the two cross-connected boost transistors. An NMOS pass transistor has its gate connected to the drain of one of the NMOS boost transistors, its source connected to the high voltage input, and its drain connected to the output. In an embodiment, two diode-connected regulation transistors connect the gates of the boost transistors to the high voltage input. These connections insure that the gates of the boost transistors and the gate of the pass transistor never reach voltages higher than one threshold voltage above the high voltage input. In another embodiment, two discharge transistors have their drains connected to a decode input, their sources connected to the gates of the boost transistors, and their gates connected to the positive power supply.

Abstract: A flash memory including a page buffer with bias circuitry and a reference array enabling reading and verifying values stored on a word line of memory cells in parallel using the page buffer irrespective of temperature, Vcc, and process variations. The bias circuitry includes a cascode transistor having a source connected to the reference cell array which provides a single reference signal. The bias cascode couples the reference signal to an input of a bias inverter in the bias generator, while a bias load transistor in the bias generator couples Vcc to the bias inverter input. The page buffer includes a set of latches that are each coupled to a memory cell by a cascode. A first inverter in each latch has transistors with sizes matching the transistors in the bias inverter. A latch load transistor is connected between a pull-up and pull-down transistor of a second inverter in each latch and is sized to match the bias load transistor.

Abstract: A new double-epitaxial structure for isolating deep (>5 .mu.m) trench capacitors (10, 10') with 1 .mu.m or less spacing (S) is disclosed. The structure comprises a thin, lightly doped upper epitaxial layer (16) on top of a thicker and more heavily doped bottom epitaxial layer (14). The low resistivity bottom epitaxial layer is intended to isolate trench capacitors of any depth. The high resistivity upper epitaxial layer is used for the CMOS periphery (22, 24) and can be selectively doped to achieve a near uniform concentration to isolate trench capacitors in the core region (20) surrounding the capacitors. Isolation between deep trenches at 1 .mu.m spacing has been demonstrated to be applicable for 4 Megabit and greater DRAM integration levels.

Abstract: A process for forming isolation slots having immunity to surface inversion comprises the steps of defining a slot region in a semiconductor substrate, implanting dopants in the substrate adjacent the mouth of the slot which have conductivity types appropriate to counteract inversion across the filled slot, applying a spacer layer over the exposed surface of the layers defining the slot and over the substrate, etching the spacer layer to leave spacers only along the edges of the materials defining the slots and etching the substrate to form the slots.