Patents by Inventor Paul A. Cavanagh

Paul A. Cavanagh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5063068
    Abstract: Laminated bread wafers are produced by fusing at least part of the opposing outer friable crust of two (or more) sheets of bread. Each sheet is composed of outer friable crusts surrounding a center which is soft and porous relative to the crusts. Specifically, one outer crust or a first sheet and one outer crust of a second sheet are moistened by applying droplets of water (e.g. from sprayed water or steam) sufficient to render them fusable. Thereafter, the moistened outer crusts are pressed together to fuse them. Alternatively, an aqueous paste is applied between at least part of an outer crust of the first sheet and at least part of an outer crust of the second sheet, and the sheets are pressed together to fuse them. The resulting laminated bread product comprises multiple layers with a sealed edge, the layers being arranged in the following order: a top friable crust, a porous softer upper core layer, a central fusion layer, a porous softer lower core layer, and a bottom friable crust.
    Type: Grant
    Filed: June 7, 1990
    Date of Patent: November 5, 1991
    Assignee: Cavanagh Company
    Inventor: Paul A. Cavanagh
  • Patent number: 4621997
    Abstract: An apparatus for manufacturing wafers is disclosed that includes a pair of rolls each containing cavities that form the wafers. The cavities each have outer edge walls that extend from the bottom portion of the cavity at an obtuse angle and the two rolls are arranged so that the cavities become effectively mirror images of each other as they engage at the nip. The cavities also have portions rising from the bottom thereof that impress a design substantially equal from both sides to proclude warping of the bread.
    Type: Grant
    Filed: September 23, 1985
    Date of Patent: November 11, 1986
    Assignee: Cavanagh & Sons, Inc.
    Inventors: John F. Cavanagh, Jr., Paul A. Cavanagh
  • Patent number: 4469476
    Abstract: Wafers are produced by guiding a sheet of bread having friable outer crusts and a relatively soft center through wafer forming apparatus. The apparatus includes a pair of rolls, one of said rolls, i.e., a cutting roll having one or more wafer forming recesses or cavities therein and the other roll being a pressure roll which operates in rolling engagement with the cutting roll. As the sheet of bread is introduced into the nip formed between the two rolls the pressure roll acts to press the bread into the cavity or cavities on the cutting roll and into engagement with the edges of the cavity or cavities to cut wafers from the sheet of bread. Each cavity is configured to have a bottom surface which rises as a gradually tapering wall to a cutting edge which is coterminious with the surface of the cutting roll.
    Type: Grant
    Filed: April 6, 1979
    Date of Patent: September 4, 1984
    Assignee: Cavanagh & Sons, Inc.
    Inventors: John F. Cavanagh, Paul A. Cavanagh
  • Patent number: 4352831
    Abstract: Wafers are produced by guiding a sheet of bread having friable outer crusts and a relatively soft center through wafer forming apparatus. The apparatus includes a pair of rolls, one of said rolls, i.e., a cutting roll having one or more wafer forming recesses or cavities therein and the other roll being a pressure roll which operates in rolling engagement with the cutting roll. As the sheet of bread is introduced into the nip formed between the two rolls the pressure roll acts to press the bread into the cavity or cavities on the cutting roll and into engagement with the edges of the cavity or cavities to cut wafers from the sheet of bread. Each cavity is configured to have a bottom surface which rises as a gradually tapering wall to a cutting edge which is coterminous with the surface of the cutting roll. Continuous production of wafers is possible with the edges of the wafers being sharply defined, free of undesirable crumbling and devoid of fracture lines.
    Type: Grant
    Filed: April 27, 1981
    Date of Patent: October 5, 1982
    Assignee: Cavanagh & Sons
    Inventors: John F. Cavanagh, Paul A. Cavanagh