Abstract: Foams suitable for such uses as landfill coverage, frost protection, volatile emission control, gas control in mining, are composed of a hydrolyzable protein and a pre-gelatinized cationic modified starch along with other ingredients. The foam concentrate can be made at ambient temperature, is stable over time, can be easily tailored to achieve a desired foam stiffness and drain time characteristic over wide ranges, and can be easily diluted at ambient temperature to produce a foamable composition.

Abstract: Foams suitable for such uses as landfill coverage, frost protection, volatile emission control, gas control in mining, are composed of a hydrolyzable protein and a pre-gelatinized cationic modified starch along with other ingredients. The foam concentrate can be made at ambient temperature, is stable over time, can be easily tailored to achieve a desired foam stiffness and drain time characteristic over wide ranges, and can be easily diluted at ambient temperature to produce a foamable composition.

Abstract: A method for processing a substrate using a proximity head is disclosed. The method is initiated by, providing a head with a head surface positioned proximate to a surface of the substrate. The head has a width and a length, and the head has a plurality of ports that are configured in rows along the length of the head. The plurality of rows can extend over a width of the head, and there is a first group of ports configured to dispense a first fluid. The first fluid is dispensed to the surface of the substrate forming a meniscus between the surface of the substrate and the surface of the head. The method also includes delivering gaseous carbon dioxide from a second group of ports of the head to an interface between the meniscus and the substrate. The carbon dioxide assists in promoting a reduced surface tension on the meniscus relative to surface of the substrate.

Abstract: A method for treating a marker material includes combining at least one treatment for a marker material, a foaming agent and a solvent to form a marker composition, foaming the marker composition to form a foamed marker composition, and applying the foamed marker composition to a marker material.

Abstract: Hydrogen sulfide in a landfill is reduced by dispersing a hydrogen sulfide control agent, such as an iron compound, into the landfill. The hydrogen sulfide control agent may be a component of an injected foam. Gas is also recovered from the landfill by introducing water into the landfill, as part of the foam, to promote digestion of organic matter.

Abstract: Gas is recovered from a landfill by introducing water into the landfill to promote digestion of organic matter in the landfill, and removing from the landfill gas produced by digestion. The improvement comprises the introduction of water as part of an aqueous foam, whereby the water is distributed more uniformly throughout the landfill. Iron salts may be included in the foam to eliminate hydrogen sulfide.

Abstract: Hydrogen sulfide in a landfill is reduced by dispersing a hydrogen sulfide control agent, such as an iron compound, into the landfill. The hydrogen sulfide control agent may be a component of an injected foam. Gas is also recovered from the landfill by introducing water into the landfill, as part of the foam, to promote digestion of organic matter.

Abstract: A method for treating a marker material includes combining at least one treatment for a marker material, a foaming agent and a solvent to form a marker composition, foaming the marker composition to form a foamed marker composition, and applying the foamed marker composition to a marker material.

Abstract: Surface cleaning, chemical treatment and drying of semiconductor substrates is carried out using foam as a medium instead of a condensed phase liquid medium. In cleaning and chemical treatment, by introducing a foam into an overflow vessel the foam is caused to pass over the substrate in moving contact therewith. Drying of the substrate is carried out, using a water solution of carbon dioxide in a pressurizable vessel. By releasing the pressure in the vessel, a layer of foam is established on the surface of the solution. The solution is discharged from the vessel, causing the foam layer to pass over the substrate in moving contact therewith. The carbon dioxide reduces the surface tension of the water, thereby enabling the foam layer to be produced and also assisting in the elimination of water from the surface of the substrate. In both cases, the use of foam reduces materials requirements and also reduces the quantity of particles deposited onto the substrate in the treatment process.

Abstract: Gas is recovered from a landfill by introducing water into the landfill to promote digestion of organic matter in the landfill, and removing from the landfill gas produced by digestion. The improvement comprises the introduction of water as part of an aqueous foam, whereby the water is distributed more uniformly throughout the landfill. Iron salts may be included in the foam to eliminate hydrogen sulfide.

Abstract: A method for treating a landscaping material includes combining at least one treatment for a landscaping material, a foaming agent and a solvent to form a landscaping composition, foaming the landscaping composition to form a foamed landscaping composition, and applying the foamed landscaping composition to a landscaping material.

Abstract: Surface cleaning, chemical treatment and drying of semiconductor substrates is carried out using foam as a medium instead of a condensed phase liquid medium. In cleaning and chemical treatment, by introducing a foam into an overflow vessel the foam is caused to pass over the substrate in moving contact therewith. Drying of the substrate is carried out, using a water solution of carbon dioxide in a pressurizable vessel. By releasing the pressure in the vessel, a layer of foam is established on the surface of the solution. The solution is discharged from the vessel, causing the foam layer to pass over the substrate in moving contact therewith. The carbon dioxide reduces the surface tension of the water, thereby enabling the foam layer to be produced and also assisting in the elimination of water from the surface of the substrate. In both cases, the use of foam reduces materials requirements and also reduces the quantity of particles deposited onto the substrate in the treatment process.

Abstract: Surface cleaning, chemical treatment and drying of semiconductor substrates is carried out using foam as a medium instead of a condensed phase liquid medium. In cleaning and chemical treatment, by introducing a foam into an overflow vessel the foam is caused to pass over the substrate in moving contact therewith. Drying of the substrate is carried out, using a water solution of carbon dioxide in a pressurizable vessel. By releasing the pressure in the vessel, a layer of foam is established on the surface of the solution. The solution is discharged from the vessel, causing the foam layer to pass over the substrate in moving contact therewith. The carbon dioxide reduces the surface tension of the water, thereby enabling the foam layer to be produced and also assisting in the elimination of water from the surface of the substrate. In both cases, the use of foam reduces materials requirements and also reduces the quantity of particles deposited onto the substrate in the treatment process.

Abstract: Surface cleaning, chemical treatment and drying of semiconductor substrates is carried out using foam as a medium instead of a condensed phase liquid medium. In cleaning and chemical treatment, by introducing a foam into an overflow vessel the foam is caused to pass over the substrate in moving contact therewith. Drying of the substrate is carried out, using a water solution of carbon dioxide in a pressurizable vessel. By releasing the pressure in the vessel, a layer of foam is established on the surface of the solution. The solution is discharged from the vessel, causing the foam layer to pass over the substrate in moving contact therewith. The carbon dioxide reduces the surface tension of the water, thereby enabling the foam layer to be produced and also assisting in the elimination of water from the surface of the substrate. In both cases, the use of foam reduces materials requirements and also reduces the quantity of particles deposited onto the substrate in the treatment process.

Abstract: Surface cleaning, chemical treatment and drying of semiconductor substrates is carried out using foam as a medium instead of a condensed phase liquid medium. In cleaning and chemical treatment, by introducing a foam into an overflow vessel the foam is caused to pass over the substrate in moving contact therewith. Drying of the substrate is carried out, using a water solution of carbon dioxide in a pressurizable vessel. By releasing the pressure in the vessel, a layer of foam is established on the surface of the solution. The solution is discharged from the vessel, causing the foam layer to pass over the substrate in moving contact therewith. The carbon dioxide reduces the surface tension of the water, thereby enabling the foam layer to be produced and also assisting in the elimination of water from the surface of the substrate. In both cases, the use of foam reduces materials requirements and also reduces the quantity of particles deposited onto the substrate in the treatment process.

Abstract: Surface cleaning, chemical treatment and drying of semiconductor substrates is carried out using foam as a medium instead of a condensed phase liquid medium. In cleaning and chemical treatment, by introducing a foam into an overflow vessel the foam is caused to pass over the substrate in moving contact therewith. Drying of the substrate is carried out, using a water solution of carbon dioxide in a pressurizable vessel. By releasing the pressure in the vessel, a layer of foam is established on the surface of the solution. The solution is discharged from the vessel, causing the foam layer to pass over the substrate in moving contact therewith. The carbon dioxide reduces the surface tension of the water, thereby enabling the foam layer to be produced and also assisting in the elimination of water from the surface of the substrate. In both cases, the use of foam reduces materials requirements and also reduces the quantity of particles deposited onto the substrate in the treatment process.

Abstract: Compositions useful in generating a foam particularly well adapted for use as a barrier are provided. These compositions contain keratin protein, a modified starch composed of at least 75% amylopectin, a ferrous ion component, and a dispersant.

Abstract: A composition for forming an essentially biodegradable foam for application to a substrate to provide a barrier between the substrate and the atmosphere formulated from a mixture in water of specified materials in certain proportional relationships. Its use in preparing such a foam barrier is also provided.

Abstract: Aqueous thixotropic foam-producing chemical compositions are presented which are comprised of an anionic sulfonate or sulfate surfactant, a fatty acid having 10-30 carbon atoms, an acrylic-based thixotropic thickener, an acrylic acid polymer processing aide and a base present in a concentration sufficiently high to neutralize all of the acid components of the mixture and adjust the pH to above 7.5. The thixotropic foam-producing compositions are useful for producing thixotropic foams which have the ability to resist slumping on sloped surfaces. Also disclosed is a process for mixing highly viscous, low density chemical foaming compositions with water without causing foaming of the resulting mixture.

Abstract: A foam generating apparatus is disclosed which generates foam from a foamable liquid by pumping the liquid by means of a high pressure pump from a storage tank to a combining device in which the liquid is combined with compressed air. The apparatus is capable of both operation and storage under extremely cold ambient conditions without the components of the apparatus becoming frozen. When the apparatus is not generating the product foam, a foamable liquid is recirculated throughout the apparatus to prevent the components of the apparatus from becoming frozen. The recirculation system is especially useful in preventing the high pressure pump from becoming frozen during storage in cold environments, while also reducing the amount of wear on the pump.