Abstract: A vacuum chuck for clamping workpieces, in particular wafers, and a measuring device and a method for checking workpieces by way of X-ray fluorescent radiation. The vacuum chuck has a clamping plate having a support surface, having at least one suction connection arranged on a base body for connecting to a negative-pressure device and for clamping the workpiece on the clamping plate by negative pressure received by the base body and having several suction grooves arranged in the clamping plate and are open towards the support surface. The support surface has concentric suction grooves having a suction opening to which a negative-pressure line is connected or which is connected to a work channel. Each suction groove having a separate negative pressure, which is separate to the adjacent suction groove, is selectively controlled by a control valve by a control for supplying the respective negative pressure in the respective suction groove.

Abstract: A vacuum chuck for clamping workpieces, in particular wafers, and a measuring device and a method for checking workpieces by way of X-ray fluorescent radiation. The vacuum chuck has a clamping plate having a support surface, having at least one suction connection arranged on a base body for connecting to a negative-pressure device and for clamping the workpiece on the clamping plate by negative pressure received by the base body and having several suction grooves arranged in the clamping plate and are open towards the support surface. The support surface has concentric suction grooves having a suction opening to which a negative-pressure line is connected or which is connected to a work channel. Each suction groove having a separate negative pressure, which is separate to the adjacent suction groove, is selectively controlled by a control valve by a control for supplying the respective negative pressure in the respective suction groove.

Abstract: A vacuum chuck for clamping workpieces, in particular wafers, and a measuring device and a method for checking workpieces by way of X-ray fluorescent radiation. The vacuum chuck has a clamping plate having a support surface, having at least one suction connection arranged on a base body for connecting to a negative-pressure device and for clamping the workpiece on the clamping plate by negative pressure received by the base body and having several suction grooves arranged in the clamping plate and are open towards the support surface. The support surface has concentric suction grooves having a suction opening to which a negative-pressure line is connected or which is connected to a work channel. Each suction groove having a separate negative pressure, which is separate to the adjacent suction groove, is selectively controlled by a control valve by a control for supplying the respective negative pressure in the respective suction groove.

Abstract: A cutting machine for cutting slices of in particular strand-shaped cutting material includes: a machine housing; a drive motor; a cutting blade, driven in rotation by the drive motor in a cutting plane, for cutting off slices; a stop plate, displaceable parallel to the cutting plane, for setting a desired slice thickness; a carriage, movable back and forth parallel to the cutting plane, having a supporting plate and a bearing wall, the supporting plate and the bearing wall forming a holding device for the cutting material, the carriage including a pivoting device for moving the supporting plate between a starting position and a pivoted-up position, the supporting plate in the starting position and in the pivoted-up position forming a right angle with the cutting plane; and a fixing plate arranged orthogonal to the supporting plate and being rigidly connected to the supporting plate, the fixing plate including a slotted link.

Abstract: A cutting machine for cutting slices of in particular strand-shaped cutting material includes: a machine housing; a drive motor; a cutting blade, driven in rotation by the drive motor in a cutting plane, for cutting off slices; a stop plate, displaceable parallel to the cutting plane, for setting a desired slice thickness; a carriage, movable back and forth parallel to the cutting plane, having a supporting plate and a bearing wall, the supporting plate and the bearing wall forming a holding device for the cutting material, the carriage including a pivoting device for moving the supporting plate between a starting position and a pivoted-up position, the supporting plate in the starting position and in the pivoted-up position forming a right angle with the cutting plane; and a fixing plate arranged orthogonal to the supporting plate and being rigidly connected to the supporting plate, the fixing plate including a slotted link.

Abstract: The invention relates to a device to position and align a rotationally-symmetrical body (28) with respect to a measuring device (19) for the implementation of a measurement on the rotationally-symmetrical body (28), having a basic element (24) which has a contact surface (22) on a pin (23) or is allocated to a contact surface (22) on which the rotationally-symmetrical body (28) is supported for the implementation of the measurement, wherein a positioning element (41) which can be moved relative to the contact surface (22) is provided on the basic element (24), said positioning element (41) comprising a prismatic receiver (64), wherein the contact surface (22) is positioned within the prismatic receiver (64) or abuts on this and a movement path of the positioning element (41) towards the basic element (22) corresponds at least to the height of the prismatic receiver (64).

Abstract: The invention relates to a vacuum chuck for clamping workpieces (19), in particular wafers, and a measuring device and a method for checking workpieces, in particular wafers, by means of X-ray fluorescent radiation.

Abstract: The invention relates to a device to position and align a rotationally-symmetrical body (28) with respect to a measuring device (19) for the implementation of a measurement on the rotationally-symmetrical body (28), having a basic element (24) which has a contact surface (22) on a pin (23) or is allocated to a contact surface (22) on which the rotationally-symmetrical body (28) is supported for the implementation of the measurement, wherein a positioning element (41) which can be moved relative to the contact surface (22) is provided on the basic element (24), said positioning element (41) comprising a prismatic receiver (64), wherein the contact surface (22) is positioned within the prismatic receiver (64) or abuts on this and a movement path of the positioning element (41) towards the basic element (22) corresponds at least to the height of the prismatic receiver (64).