Abstract: A device includes a charge controller to regulate a battery output voltage based on an input voltage and an input current received from a charging circuit. A loop controller monitors the input voltage and the input current to generate a feedback signal to adjust the input voltage to the charge controller.

Abstract: In a described example, an apparatus includes: a first mold compound partially covering a thermal pad that extends through a pre-molded package substrate formed of a first mold compound, a portion of the thermal pad exposed on a die side surface of the pre-molded package substrate, the pre-molded package substrate having a recess on the die side surface, with an exposed portion of the thermal pad and a portion of the first mold compound in a die mounting area in the recess; a semiconductor die mounted to the thermal pad and another semiconductor die mounted to the mold compound in the die mounting area; wire bonds coupling bond pads on the semiconductor dies to traces on the pre-molded package substrate; and a second mold compound over the die side surface of the pre-molded package substrate and covering the wire bonds, the semiconductor dies, the recess, and a portion of the traces.

Abstract: A probe card with a voltage terminal configured to be coupled to a voltage supply and a current terminal configured to be coupled to a current supply. The voltage terminal and the current terminal are configured to be coupled to an input node of a device under test (DUT) field effect transistor (FET) through probe needles. The probe card has an overlap resistor capacitor (RC) element coupled to the input node. The probe card includes an analog to digital (ADC) voltage capture module configured to be coupled to the input node of the DUT FET and to an output node of the DUT FET through the probe needles. The probe card has a resistive element configured to be coupled to the output node of the DUT FET through the probe needles and to an electrically neutral node and an ADC current capture module coupled in parallel to the resistive element.

Abstract: In a described example, an apparatus includes: a first mold compound partially covering a thermal pad that extends through a pre-molded package substrate formed of a first mold compound, a portion of the thermal pad exposed on a die side surface of the pre-molded package substrate, the pre-molded package substrate having a recess on the die side surface, with an exposed portion of the thermal pad and a portion of the first mold compound in a die mounting area in the recess; a semiconductor die mounted to the thermal pad and another semiconductor die mounted to the mold compound in the die mounting area; wire bonds coupling bond pads on the semiconductor dies to traces on the pre-molded package substrate; and a second mold compound over the die side surface of the pre-molded package substrate and covering the wire bonds, the semiconductor dies, the recess, and a portion of the traces.

Abstract: Described embodiments include a rectifier circuit comprising a first resistor with first and second resistor terminals, and a second resistor with third and fourth resistor terminals. The first and third resistor terminals are coupled to an auxiliary power terminal. A current source is coupled between the second resistor terminal and a ground terminal. An amplifier has a first amplifier input coupled to the second resistor terminal, and a second amplifier input coupled to the fourth resistor terminal. A first transistor is coupled between the fourth resistor terminal and a damping terminal, and has a first control terminal coupled to the first amplifier output. A gate drive circuit has an input coupled to the damping terminal. A second transistor is coupled between the damping terminal and a bootstrap supply terminal, and has a second control terminal coupled to an output of the gate drive circuit.

Abstract: In a described example, an apparatus includes: a first mold compound partially covering a thermal pad that extends through a pre-molded package substrate formed of a first mold compound, a portion of the thermal pad exposed on a die side surface of the pre-molded package substrate, the pre-molded package substrate having a recess on the die side surface, with an exposed portion of the thermal pad and a portion of the first mold compound in a die mounting area in the recess; a semiconductor die mounted to the thermal pad and another semiconductor die mounted to the mold compound in the die mounting area; wire bonds coupling bond pads on the semiconductor dies to traces on the pre-molded package substrate; and a second mold compound over the die side surface of the pre-molded package substrate and covering the wire bonds, the semiconductor dies, the recess, and a portion of the traces.

Abstract: One example includes a method for surge-testing a gallium nitride (GaN) transistor device-under-test (DUT) that includes at least one GaN transistor device. The method includes inserting the GaN transistor DUT into a test fixture comprising an inductor such that the inductor is coupled to the GaN transistor device to form a switching power regulator. The method also includes operating the switching power regulator at a DUT operating voltage to generate an output current through the inductor based on a DUT input voltage and a duty-cycle. The method also includes controlling an excitation voltage source to provide a voltage surge-strike to the GaN transistor DUT. The method also includes measuring the output current and the DUT input voltage at least one of during and after the voltage surge-strike. The method further includes storing the measured output current and the measured DUT input voltage in a memory to specify device characteristics of the GaN transistor DUT.

Abstract: Methods, systems, and apparatus to facilitate high side control of a switching power converter are disclosed. An example apparatus includes a latch including a first node coupled to a first source of a first switch and an output coupled to a first gate of the first switch; a first diode coupled to the first node and a second node; a second diode coupled to the second node and ground; a second switch coupled to a voltage source and the second node; and a third switch including a third gate coupled to the second switch, a third source coupled to the second node, and a third drain coupled to the latch.

Abstract: A device includes a charge controller to regulate a battery output voltage based on an input voltage and an input current received from a charging circuit. A loop controller monitors the input voltage and the input current to generate a feedback signal to adjust the input voltage to the charge controller.

Abstract: A device includes a charge controller to regulate a battery output voltage based on an input voltage and an input current received from a charging circuit. A loop controller monitors the input voltage and the input current to generate a feedback signal to adjust the input voltage to the charge controller.

Abstract: Methods, systems, and apparatus to facilitate high side control of a switching power converter are disclosed. An example apparatus includes a latch including a first node coupled to a first source of a first switch and an output coupled to a first gate of the first switch; a first diode coupled to the first node and a second node; a second diode coupled to the second node and ground; a second switch coupled to a voltage source and the second node; and a third switch including a third gate coupled to the second switch, a third source coupled to the second node, and a third drain coupled to the latch.

Abstract: One example includes a method for surge-testing a gallium nitride (GaN) transistor device-under-test (DUT) that includes at least one GaN transistor device. The method includes inserting the GaN transistor DUT into a test fixture comprising an inductor such that the inductor is coupled to the GaN transistor device to form a switching power regulator. The method also includes operating the switching power regulator at a DUT operating voltage to generate an output current through the inductor based on a DUT input voltage and a duty-cycle. The method also includes controlling an excitation voltage source to provide a voltage surge-strike to the GaN transistor DUT. The method also includes measuring the output current and the DUT input voltage at least one of during and after the voltage surge-strike. The method further includes storing the measured output current and the measured DUT input voltage in a memory to specify device characteristics of the GaN transistor DUT.

Abstract: Methods, systems, and apparatus to facilitate high side control of a switching power converter are disclosed. An example apparatus includes a latch including a first node coupled to a first source of a first switch and an output coupled to a first gate of the first switch; a first diode coupled to the first node and a second node; a second diode coupled to the second node and ground; a second switch coupled to a voltage source and the second node; and a third switch including a third gate coupled to the second switch, a third source coupled to the second node, and a third drain coupled to the latch.

Abstract: Methods, systems, and apparatus to facilitate high side control of a switching power converter are disclosed. An example apparatus includes a latch including a first node coupled to a first source of a first switch and an output coupled to a first gate of the first switch; a first diode coupled to the first node and a second node; a second diode coupled to the second node and ground; a second switch coupled to a voltage source and the second node; and a third switch including a third gate coupled to the second switch, a third source coupled to the second node, and a third drain coupled to the latch.

Abstract: Methods, systems, and apparatus to facilitate high side control of a switching power converter are disclosed. An example apparatus includes a latch including a first node coupled to a first source of a first switch and an output coupled to a first gate of the first switch; a first diode coupled to the first node and a second node; a second diode coupled to the second node and ground; a second switch coupled to a voltage source and the second node; and a third switch including a third gate coupled to the second switch, a third source coupled to the second node, and a third drain coupled to the latch.

Abstract: A device includes a charge controller to regulate a battery output voltage based on an input voltage and an input current received from a charging circuit. A loop controller monitors the input voltage and the input current to generate a feedback signal to adjust the input voltage to the charge controller.

Abstract: A device includes a charge controller to regulate a battery output voltage based on an input voltage and an input current received from a charging circuit. A loop controller monitors the input voltage and the input current to generate a feedback signal to adjust the input voltage to the charge controller.

Abstract: A device includes a charge controller to regulate a battery output voltage based on an input voltage and an input current received from a charging circuit. A loop controller monitors the input voltage and the input current to generate a feedback signal to adjust the input voltage to the charge controller.

Abstract: A semiconductor device is formed on a semiconductor substrate, including a primary portion of the substrate. An active component of the semiconductor device is disposed in the primary portion of the substrate. An interconnect region is formed on a top surface of the substrate. Semiconductor material is removed from the substrate in an isolation region, which is separate from the primary portion of the substrate; the isolation region extends from the top surface of the substrate to a bottom surface of the substrate. A dielectric replacement material is formed in the isolation region. The semiconductor device further includes an isolated component which is not disposed in the primary portion of the substrate. The dielectric replacement material in the isolation region separates the isolated component from the primary portion of the substrate.

Abstract: A semiconductor device is formed on a semiconductor substrate, including a primary portion of the substrate. An active component of the semiconductor device is disposed in the primary portion of the substrate. An interconnect region is formed on a top surface of the substrate. Semiconductor material is removed from the substrate in an isolation region, which is separate from the primary portion of the substrate; the isolation region extends from the top surface of the substrate to a bottom surface of the substrate. A dielectric replacement material is formed in the isolation region. The semiconductor device further includes an isolated component which is not disposed in the primary portion of the substrate. The dielectric replacement material in the isolation region separates the isolated component from the primary portion of the substrate.