Patents by Inventor Paul C. van Hal

Paul C. van Hal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7286680
    Abstract: A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.
    Type: Grant
    Filed: May 19, 2006
    Date of Patent: October 23, 2007
    Assignee: Sonion Nederland B.V.
    Inventors: Michael G. M. Steeman, Hendrik Dolleman, Paul C. van Hal, Adrianus M. Lafort, Jan Hijman, Dion I. de Roo, Auke P. Nauta, Raymond Mögelin
  • Patent number: 7065224
    Abstract: A microphone and method for dampening the frequency response of the microphone by disposing a dampening frame in a rear volume of the microphone. The microphone generally includes a housing, a diaphragm, a damping frame, and a backplate. The diaphragm rests on embossments in the housing, and a damping frame including a damping slit cut into an inner edge of the damping frame is positioned against the diaphragm. The backplate is positioned adjacent the damping frame to define an aperture which allows air to escape from the area between the backplate and the diaphragm into the rear volume of the microphone, thus dampening the frequency response of the microphone. The method includes the steps of aligning a sheet of diaphragms with a sheet of damping frames, curing these two sheets to form a carrier sheet having a plurality of subassemblies, singulating each subassembly, installing a backplate onto each subassembly to form a cartridge, and placing the cartridge into a microphone housing.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: June 20, 2006
    Assignee: Sonionmicrotronic Nederland B.V.
    Inventors: Elrick Lennaert Cornelius, Paul Leonardus Clemens, Paul C. van Hal, Mike Geskus
  • Patent number: 7062058
    Abstract: A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.
    Type: Grant
    Filed: April 17, 2002
    Date of Patent: June 13, 2006
    Assignee: Sonion Nederland B.V.
    Inventors: Michael G. M. Steeman, Hendrik Dolleman, Paul C. van Hal, Adrianus M. Lafort, Jan Hijman, Dion I. de Roo, Auke P. Nauta, Raymond Mögelin
  • Publication number: 20030063768
    Abstract: A microphone and method for dampening the frequency response of the microphone by disposing a dampening frame in a rear volume of the microphone. The microphone generally includes a housing, a diaphragm, a damping frame, and a backplate. The diaphragm rests on embossments in the housing, and a damping frame including a damping slit cut into an inner edge of the damping frame is positioned against the diaphragm. The backplate is positioned adjacent the damping frame to define an aperture which allows air to escape from the area between the backplate and the diaphragm into the rear volume of the microphone, thus dampening the frequency response of the microphone. The method includes the steps of aligning a sheet of diaphragms with a sheet of damping frames, curing these two sheets to form a carrier sheet having a plurality of subassemblies, singulating each subassembly, installing a backplate onto each subassembly to form a cartridge, and placing the cartridge into a microphone housing.
    Type: Application
    Filed: September 28, 2001
    Publication date: April 3, 2003
    Inventors: Elrick Lennaert Cornelius, Paul Leonardus Clemens, Paul C. van Hal, Mike Geskus
  • Publication number: 20020154790
    Abstract: A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.
    Type: Application
    Filed: April 17, 2002
    Publication date: October 24, 2002
    Inventors: Michael G. M. Steeman, Hendrik Dolleman, Paul C. van Hal, Adrianus M. Lafort, Jan Hijman, Dion I. de Roo, Auke P. Nauta, Raymond Mogelin