Abstract: Disclosed is a rigid removable carrier tray for transporting and storing pin sockets. The tray includes one or more arrays of holes of consistent or varying diameter disposed in an upper surface and formed to receive pin sockets. Pin sockets are recessed below the upper surface of the carrier tray when placed in the holes. A flexible adhesive film is disposed over the upper surface of the carrier tray to prevent the pin sockets from falling out of the carrier tray during transport. The pin sockets are installed by removing the adhesive film and press fitting the leads of an integrated circuit ("IC") chip into the pin sockets in the holes. The holes in the array may be arranged in a customized pattern in order to accommodate a particular IC chip, or may be arranged in a generic pattern to accept a variety of IC chips. The carrier tray also includes standoffs with alignment guides and troughs that facilitate stacking and storage.