Patents by Inventor Paul Colfer

Paul Colfer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus to form electronic components with at least one N- or P-doped portion
    Patent number: 7737006
    Abstract: A method of manufacturing an electronic component comprising at least one n- or p-doped portion, comprising the steps of: co-depositing inorganic semi-conducting nanoparticles and dopant on a substrate, the nanoparticles being a group four element such as silicon or germanium; fusing the nanoparticles by heating to form a continuous layer; and subsequently; and, recrystallising the layer.
    Type: Grant
    Filed: October 30, 2003
    Date of Patent: June 15, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Paul Colfer, Lorraine Byrne, Eugene Cahill, Phil Keenan, Niall Stobie
  • Electronic components
    Publication number: 20060237719
    Abstract: A method of manufacturing an electronic component comprising at least one n- or p-doped portion, comprising the steps of: co-depositing inorganic semi-conducting nanoparticles and dopant on a substrate, the nanoparticles being a group four element such as silicon or germanium; fusing the nanoparticles by heating to form a continuous layer; and subsequently; and, recrystallising the layer.
    Type: Application
    Filed: October 30, 2003
    Publication date: October 26, 2006
    Inventors: Paul Colfer, Lorraine Byrne, Eugene Cahill, Phil Keenan, Niall Stobie