Abstract: The invention relates to an integrated circuit assembly and a method of making same. The method according to the invention comprising providing a flex substrate having one or more dielectric tape layers, assembling one or more semiconductor chips to said flex substrate, said semiconductor chips having an active surface and a plurality of contact pads on said active surface, providing one or more conductive layers on said flex substrate, said conductive layers forming the electrical connections required for the assembly, electrically connecting the contact pads to the conductive layers.

Abstract: The invention concerns a procedure for forming cocks closable by freezing, belonging to a liquid batch handling unit, and a liquid handling unit set up in accordance with the procedure. The unit consists of two bodies (1,2) placed against each other, the cocks being located between their faces and one of them (2) comprising the flow passages leading to the cock points and the other body (1), which is connected to a refrigerator, being provided with electric heaters located at the cock points and with the aid of which the cocks can be opened and closed.