Abstract: A card having an antenna, one or processors, and memory having stored thereon a first application and a second application configured to receive an input of the card and determine a request associated with the input. The card is further configured to activate, responsive to determining that the request is consistent with a contactless EuroPay-MasterCard-Visa (EMV) data standard, the first application. The first application is configured to communicate, via near field communication (NFC), data to the communicating device via the antenna based on the EMV data standard for payment purposes. The card is further configured to activate, responsive to determining that the request is consistent with a near field communication data exchange format (NDEF) standard, the second application. The second application is configured to communicate, via NFC, data to the communicating device via the antenna based on the NDEF standard for verification/identification purposes.

Abstract: A method and apparatus for adjusting circuit operation in response to physical orientation of an integrated circuit (IC) coupled to a host site via direct soldering or a socket. The IC can be installed in a correct orientation or rotated and installed in an incorrect orientation. The IC may have a square, substantially symmetric footprint and the incorrect orientation may correspond to 90 or 180 degree rotation of the IC from the correct orientation. The orientations may be discerned by sensing electrical characteristics of the installed IC. For example, the IC may ground a detection line when installed in the correct orientation, while the detection line may be floating when the IC is installed in an incorrect orientation. The IC may be switchably connected to other components such as a power supply only when it is detected as being installed in the correct orientation.

Abstract: A method and apparatus for adjusting circuit operation in response to physical orientation of an integrated circuit (IC) coupled to a host site via direct soldering or a socket. The IC can be installed in a correct orientation or rotated and installed in an incorrect orientation. The IC may have a square, substantially symmetric footprint and the incorrect orientation may correspond to 90 or 180 degree rotation of the IC from the correct orientation. The orientations may be discerned by sensing electrical characteristics of the installed IC. For example, the IC may ground a detection line when installed in the correct orientation, while the detection line may be floating when the IC is installed in an incorrect orientation. The IC may be switchably connected to other components such as a power supply only when it is detected as being installed in the correct orientation.

Abstract: A method of manufacturing a compound of general formula (R3—C)2P—L1—X—L2—P—(C—R3)2, in which each R is independently a pendant, optionally substituted, organic group through which the group is linked to tertiary carbon atom C; L1, L2 are independently a linking group selected from an optionally substituted lower alkylene chain connecting the respective phosphorus atom to the group X and X is a bridging group comprising an optionally substituted aryl moiety to which the phosphorus atoms are linked on available adjacent carbon atoms, comprises: i) reacting together a compound of formula H—L1—X—L2—H with an organometallic compound to form an intermediate compound of formula M—L1—X—L2—M, where M is an alkali metal atom; ii) reacting said intermediate compound with a compound of formula (R3—C)2P—A, where A is a halogen atom, to form said compound of general formula (R3—C)2P—L1—X—L2—P&