Abstract: A probe-like temperature sensor assembly has a body carrying thereon a length of electrical resistance wire coiled thereabout and having ends of such coiled resistance wire electrically connected to respective terminal means; the resistance wire changes its electrical resistance in response to the temperature of such wire resulting primarily from the heat communicated thereto from the sensed environment; the portion of the body about which the resistance wire is coiled is provided with a slot-like or relieved portion as to accommodate for difference in the rates of thermal expansion in the materials forming the body and resistance wire as to thereby preclude the mechanical fracturing of the resistance wire by the body which would otherwise occur due to a comparatively excessive rate of thermal expansion in such body.