Abstract: Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.

Abstract: A plasma abatement process for abating effluent containing compounds from a processing chamber is described. A plasma abatement process takes gaseous foreline effluent from a processing chamber, such as a deposition chamber, and reacts the effluent within a plasma chamber placed in the foreline path. The plasma dissociates the compounds within the effluent, converting the effluent into more benign compounds. Abating reagents may assist in the abating of the compounds. The abatement process may be a volatizing or a condensing abatement process. Representative volatilizing abating reagents include, for example, CH4, H2O, H2, NF3, SF6, F2, HCl, HF, Cl2, and HBr. Representative condensing abating reagents include, for example, H2, H2O, O2, N2, O3, CO, CO2, NH3, N2O, CH4, and combinations thereof.

Abstract: A plasma abatement process for abating effluent containing compounds from a processing chamber is described. A plasma abatement process takes gaseous foreline effluent from a processing chamber, such as a deposition chamber, and reacts the effluent within a plasma chamber placed in the foreline path. The plasma dissociates the compounds within the effluent, converting the effluent into more benign compounds. Abating reagents may assist in the abating of the compounds. The abatement process may be a volatizing or a condensing abatement process. Representative volatilizing abating reagents include, for example, CH4, H2O, H2, NF3, SF6, F2, HCl, HF, Cl2, and HBr. Representative condensing abating reagents include, for example, H2, H2O, O2, N2, O3, CO, CO2, NH3, N2O, CH4, and combinations thereof.

Abstract: A plasma abatement process for abating effluent containing compounds from a processing chamber is described. A plasma abatement process takes gaseous foreline effluent from a processing chamber, such as a deposition chamber, and reacts the effluent within a plasma chamber placed in the foreline path. The plasma dissociates the compounds within the effluent, converting the effluent into more benign compounds. Abating reagents may assist in the abating of the compounds. The abatement process may be a volatizing or a condensing abatement process. Representative volatilizing abating reagents include, for example, CH4, H2O, H2, NF3, SF6, F2, HCl, HF, Cl2, and HBr. Representative condensing abating reagents include, for example, H2, H2O, O2, N2, O3, CO, CO2, NH3, N2O, CH4, and combinations thereof.

Abstract: A plasma abatement process for abating effluent containing compounds from a processing chamber is described. A plasma abatement process takes gaseous foreline effluent from a processing chamber, such as a deposition chamber, and reacts the effluent within a plasma chamber placed in the foreline path. The plasma dissociates the compounds within the effluent, converting the effluent into more benign compounds. Abating reagents may assist in the abating of the compounds. The abatement process may be a volatizing or a condensing abatement process. Representative volatilizing abating reagents include, for example, CH4, H2O, H2, NF3, SF6, F2, HCl, HF, Cl2, and HBr. Representative condensing abating reagents include, for example, H2, H2O, O2, N2, O3, CO, CO2, NH3, N2O, CH4, and combinations thereof.

Abstract: A plasma abatement process for abating effluent containing compounds from a processing chamber is described. A plasma abatement process takes gaseous foreline effluent from a processing chamber, such as a deposition chamber, and reacts the effluent within a plasma chamber placed in the foreline path. The plasma dissociates the compounds within the effluent, converting the effluent into more benign compounds. Abating reagents may assist in the abating of the compounds. The abatement process may be a volatizing or a condensing abatement process. Representative volatilizing abating reagents include, for example, CH4, H2O, H2, NF3, SF6, F2, HCl, HF, Cl2, and HBr. Representative condensing abating reagents include, for example, H2, H2O, O2, N2, O3, CO, CO2, NH3, N2O, CH4, and combinations thereof.

Abstract: A plasma abatement process for abating effluent containing compounds from a processing chamber is described. A plasma abatement process takes gaseous foreline effluent from a processing chamber, such as a deposition chamber, and reacts the effluent within a plasma chamber placed in the foreline path. The plasma dissociates the compounds within the effluent, converting the effluent into more benign compounds. Abating reagents may assist in the abating of the compounds. The abatement process may be a volatizing or a condensing abatement process. Representative volatilizing abating reagents include, for example, CH4, H2O, H2, NF3, SF6, F2, HCl, HF, Cl2, and HBr. Representative condensing abating reagents include, for example, H2, H2O, O2, N2, O3, CO, CO2, NH3, N2O, CH4, and combinations thereof.

Abstract: Embodiments enclosed herein relate to methods and apparatus for reducing nitrogen oxides (NOx) produced during processing, such as during semiconductor fabrication processing. A processing system may include an abatement controller and an effluent abatement system, wherein the abatement controller controls the effluent abatement system to reduce NOx production, while ensuring abatement of the effluent gases from the processing system. The effluent abatement system may include a combustion-type effluent abatement system and/or a plasma-type effluent abatement system. The abatement controller may select operating modes of the effluent abatement systems to reduce NOx production.

Abstract: A diesel fuel pump module for use within a diesel fuel tank includes a reservoir defining a fuel storage volume. A jet pump having an inlet is positioned within the reservoir and configured to pump fuel from the tank into the reservoir. The module further includes an electric pump having an inlet and an outlet, and an air separation chamber connecting the electric pump outlet to the inlet of the jet pump.

Abstract: A fuel supply system includes a fuel pump configured to pump fuel from a first fuel storage location to an engine. A jet pump is configured to receive an auxiliary supply of fuel from the fuel pump and to return the auxiliary supply of fuel plus an additional flow of fuel drawn from a second fuel storage location to the first fuel storage location. A jet pump supply line has an inlet in fluid communication with an outlet of the fuel pump and has an outlet coupled to an inlet of the jet pump. A jet pump return line has an input coupled to an outlet of the jet pump and has an outlet adjacent to the fuel pump. A shut-off valve operates to selectively limit fuel flow through the jet pump return line.

Abstract: A plasma abatement process for abating effluent containing compounds from a processing chamber is described. A plasma abatement process takes gaseous foreline effluent from a processing chamber, such as a deposition chamber, and reacts the effluent within a plasma chamber placed in the foreline path. The plasma dissociates the compounds within the effluent, converting the effluent into more benign compounds. Abating reagents may assist in the abating of the compounds. The abatement process may be a volatizing or a condensing abatement process. Representative volatilizing abating reagents include, for example, CH4, H2O, H2, NF3, SF6, F2, HCl, HF, Cl2, and HBr. Representative condensing abating reagents include, for example, H2, H2O, O2, N2, O3, CO, CO2, NH3, N2O, CH4, and combinations thereof.

Abstract: Methods and apparatus for controlling a processing system are provided herein. In some embodiments, a method of controlling a processing system may include operating a vacuum pump coupled to a process chamber at a first baseline pump idle speed selected to maintain the process chamber at a pressure equal to a first baseline pump idle pressure; monitoring the pressure in the process chamber while operating the vacuum pump at the first baseline pump idle speed; and determining whether the first baseline pump idle pressure can be maintained in the process chamber when the vacuum pump is operating at the first baseline pump idle speed.

Abstract: A fuel supply system includes a fuel pump configured to pump fuel from a first fuel storage location to an engine. A jet pump is configured to receive an auxiliary supply of fuel from the fuel pump and to return the auxiliary supply of fuel plus an additional flow of fuel drawn from a second fuel storage location to the first fuel storage location. A jet pump supply line has an inlet in fluid communication with an outlet of the fuel pump and has an outlet coupled to an inlet of the jet pump. A jet pump return line has an input coupled to an outlet of the jet pump and has an outlet adjacent to the fuel pump. A shut-off valve operates to selectively limit fuel flow through the jet pump return line.

Abstract: A diesel fuel pump module for use within a diesel fuel tank includes a reservoir defining a fuel storage volume. A jet pump having an inlet is positioned within the reservoir and configured to pump fuel from the tank into the reservoir. The module further includes an electric pump having an inlet and an outlet, and an air separation chamber connecting the electric pump outlet to the inlet of the jet pump.

Abstract: A jet pump assembly includes a fuel supply conduit, a first jet pump integrally formed as a single piece with the fuel supply conduit and in fluid communication with the fuel supply conduit, a second jet pump integrally formed as a single piece with the fuel supply conduit and in fluid communication with the fuel supply conduit, and an inlet conduit integrally formed as a single piece with the second jet pump.

Abstract: Methods and apparatus for controlling a processing system are provided herein. In some embodiments, a method of controlling a processing system may include operating a vacuum pump coupled to a process chamber at a first baseline pump idle speed selected to maintain the process chamber at a pressure equal to a first baseline pump idle pressure; monitoring the pressure in the process chamber while operating the vacuum pump at the first baseline pump idle speed; and determining whether the first baseline pump idle pressure can be maintained in the process chamber when the vacuum pump is operating at the first baseline pump idle speed.

Abstract: A jet pump assembly includes a fuel supply conduit, a first jet pump integrally formed as a single piece with the fuel supply conduit and in fluid communication with the fuel supply conduit, a second jet pump integrally formed as a single piece with the fuel supply conduit and in fluid communication with the fuel supply conduit, and an inlet conduit integrally formed as a single piece with the second jet pump.

Abstract: A rotary fuel pump employs pressure balancing features on the non-vaned side of the impeller to provide localized application of fluid forces so that the impeller is more precisely balanced within the pumping chamber. A generally disc-shaped impeller body has an impeller with a body-side surface and a cover-side surface. The cover-side surface defines an impeller flow channel extending circumferentially around the impeller. The impeller includes a plurality of vanes positioned at least partially within the impeller flow channel. The body-side surface has a plurality of discontinuous undercut regions each coaxially aligned with at least a portion of the impeller flow channel. The impeller has a plurality of apertures wherein each aperture connects the impeller flow channel with a respective undercut region, whereby pressure forces against the impeller from the fuel are substantially balanced in the axial direction.

Abstract: The present invention provides a system for controlling the speed of a motor by altering the magnetic field of the motor. The system includes field modification module, and a motor having field windings and a rotor. The field windings are configured to receive a driving signal that generates a magnetic field causing a rotation of the rotor. The field modification module is proximate the motor and alters the magnetic field in response to an input signal thereby controlling the speed and torque of the rotor.

Abstract: A low deviation pressure relief valve for a fuel pump consisting of a housing having an elongated bore having a continuous wall, an axis, shoulders arranged on the wall so as to extend toward the axis. A ball in the housing has a diameter at least less than the diameter of the bore and a ball retainer located in the bore upstream from the shoulders forms a ball seat by pre-coining process. The ball is smaller than the retainer seat in diameter to ensure an edge seal with the ball. A spring coaxial with the axis located down stream from the ball retainer and supported on the shoulders, and the ball is located between the spring and the ball seat wherein low flow restriction is created and reduced pressure variation is created as fluid flows past the ball and less buckling in the spring is created by guide ribs.