Patents by Inventor Paul E. Naton

Paul E. Naton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5407983
    Abstract: A composition is described with comprises a mixture of(A) from about 5% to about 60% by weight of at least one water-insoluble polymer;(B) from about 1% to about 30% by weight of inorganic or synthetic resinous hollow microspheres; and(C) from about 20% to about 70% of at least one volatile organic liquid which is a solvent for the polymer of (A).The compositions also may contain (D) at least one solid particulate inorganic filler. Adhesive compositions such as solvent cements prepared in accordance with the present invention are characterized as low V(olatile) O(rganic) C(hemical) compositions wherein the VOC is, for example, less than 500 or even less than 400 grams per liter.
    Type: Grant
    Filed: February 10, 1994
    Date of Patent: April 18, 1995
    Assignee: Oatey Company
    Inventor: Paul E. Naton
  • Patent number: 5384345
    Abstract: A composition is described with comprises a mixture of(A) from about 5% to about 60% by weight of at least one water-insoluble polymer;(B) from about 1% to about 30% by weight of inorganic or synthetic resinous hollow microspheres; and(C) from about 20% to about 85% of at least one volatile organic liquid which is a solvent for the polymer of (A).The compositions also may contain (D) at least one solid particulate inorganic filler. Adhesive compositions such as solvent cements prepared in accordance with the present invention are characterized as low VOC compositions wherein the VOC is, for example, less than 500 or even less than 400 grams per liter.
    Type: Grant
    Filed: July 20, 1993
    Date of Patent: January 24, 1995
    Assignee: Oatey Company
    Inventor: Paul E. Naton
  • Patent number: 5028456
    Abstract: A curable polyester composition having improved properties is described, and the curable polyester composition comprises:(A) at least one unsaturated polyester resin;(B) at least one hydrocarbon monomer copolymerizable with the polyester; and(C) at least one aryl sulfonamide-aldehyde resin.When the curable polyester composition is to be used as a plastic body filler, the curable polyester composition generally will be modified to include (D) at least one inorganic filler which may comprise a mixture of an inorganic powder and inorganic hollow microspheres.The curable polyester resin compositions of the invention are useful as plastic body fillers for repairing metal surfaces, and the curable compositions have been found to be particularly useful and advantageous as plastic body fillers for galvanized steel.
    Type: Grant
    Filed: September 28, 1990
    Date of Patent: July 2, 1991
    Assignee: Oatey Company
    Inventor: Paul E. Naton
  • Patent number: 4980414
    Abstract: A curable polyester composition having improved properties is described, and the curable polyester composition comprises:(A) at least one unsaturated polyester resin;(B) at least one hydrocarbon monomer copolymerizable with the polyester; and(C) at least one aryl sulfonamide-aldehyde resin.When the curable polyester composition is to be used as a plastic body filler, the curable polyester composition generally will be modified to include (D) at least one inorganic filler which may comprise a mixture of an inorganic powder and inorganic hollow microspheres.The curable polyester resin compositions of the invention are useful as plastic body fillers for repairing metal surfaces, and the curable compositions have been found to be particularly useful and advantageous as plastic body fillers for galvanized steel.
    Type: Grant
    Filed: April 6, 1989
    Date of Patent: December 25, 1990
    Assignee: Oatey Company
    Inventor: Paul E. Naton
  • Patent number: 4879096
    Abstract: Lead-free and antimony-free solder compositions are described which comprise, as essential ingredients, about 0.05% to about 3% by weight of silver; about 0.5% to about 6% by weight of copper; about 0.1% to about 3% by weight of bismuth; and about 88% to about 99.35% by weight of tin. In preferred embodiments, the solders are also essentially free of cadmium and may also be essentially free of both cadmium and zinc.
    Type: Grant
    Filed: April 19, 1989
    Date of Patent: November 7, 1989
    Assignee: Oatey Company
    Inventor: Paul E. Naton