Abstract: An apparatus for automatically aligning a semiconductor wafer with a mask in the manufacture of integrated circuit devices is disclosed. The mask and wafer are each provided with alignment patterns, the alignment pattern on the wafer cooperating with the alignment pattern on the mask in a unique visual mannner to signify alignment. A scanning mechanism is provided for automatically scanning the alignment pattern areas and producing output signals indicative of the relative positions of the alignment patterns on the wafer and mask. Logic circuitry is provided for operating in response to any misalignment represented by the scan output signals to compute formulae which are utilized to produce control signals for driving motor drive mechanisms to produce relative movement between the mask and wafer to bring them into alignment. Several separate alignment cycles are provided, if needed, for zeroing in on finalized alignment.

Abstract: An apparatus for automatically aligning a semiconductor wafer with a mask in the manufacture of integrated circuit devices is disclosed. The mask and wafer are each provided with alignment patterns, the alignment pattern on the wafer cooperating with the alignment pattern on the mask in a unique visual manner to signify alignment. A scanning mechanism is provided for automatically scanning the alignment pattern areas and producing output signals indicative of the relative positions of the alignment patterns on the wafer and mask. Logic circuitry is provided for operating in response to any misalignment represented by the scan outout signals to compute formulae which are utilized to produce control signals for driving motor drive mechanisms to produce relative movement between the mask and wafer to bring them into alignment. Several separate alignment cycles are provided, if needed, for zeroing in on finalized alignment.

Abstract: A surgical cutting instrument includes an electrically heated cutting edge and an automatic control system for maintaining the cutting edge at a constant high temperature for sterilizing the blade, cutting tissue, and cauterizing the incised tissue to reduce hemorrhage from the cut surfaces of the tissues (hemostasis).

Abstract: A surgical cutting instrument includes an electrically heated cutting edge and an automatic control system for maintaining the cutting edge at a constant high temperature for sterilizing the blade, cutting tissue, and cauterizing the incised tissue to reduce hemorrhage from the cut surfaces of the tissues (hemostasie).

Abstract: A gas analyzer is provided which is particularly suited for making transcutaneous measurement of the CO.sub.2 concentration in the blood.In accordance with one embodiment of the invention, sample gases from the body are circulated in a cavity of the device. A rotating wheel in the cavity includes two reference cells and a sample cell which are sequentially rotated into the optical path between a source and a detector. Three signals are thereby provided which may be combined to give an output indication of the CO.sub.2 concentration in the body fluids. In a preferred embodiment, the sample cell is an "inverted cell" being in open communication with the sample gas circulating in the device so that the gas in the sample cell is a portion of the circulating gas which also surrounds the two reference cells. An output indication is thereby obtained which is insensitive to contaminants in the sample.

Abstract: An apparatus for automatically aligning a semiconductor wafer with a mask in the manufacture of integrated circuit devices is disclosed. The mask and wafer are each provided with alignment patterns, the alignment pattern on the wafer cooperating with the alignment pattern on the mask in a unique visual manner to signify alignment. A scanning mechanism is provided for automatically scanning the alignment pattern areas and producing output signals indicative of the relative positions of the alignment patterns on the wafer and mask. Logic circuitry is provided for operating in response to any misalignment represented by the scan output signals to compute formulae which are utilized to produce control signals for driving motor drive mechanisms to produce relative movement between the mask and wafer to bring them into alignment. Several separate alignment cycles are provided, if needed, for zeroing in on finalized alignment.

Abstract: A gas analyzer is provided which is particularly suited for making transcutaneous measurement of the CO.sub.2 concentration in the blood.In accordance with one embodiment of the invention, sample gases from the body are circulated in a cavity of the device. A rotating wheel in the cavity includes two reference cells and a sample cell which are sequentially rotated into the optical path between a source and a detector. Three signals are thereby provided which may be combined to give an output indication of the CO.sub.2 concentration in the body fluids. In a preferred embodiment, the sample cell is an "inverted cell" being in open communication with the sample gas circulating in the device so that the gas in the sample cell is a portion of the circulating gas which also surrounds the two reference cells. An output indication is thereby obtained which is insensitive to contaminants in the sample.

Abstract: An apparatus for automatically aligning a semiconductor wafer with a mask in the manufacture of integrated circuit devices is disclosed. The mask and wafer are each provided with alignment patterns, the alignment pattern on the wafer cooperating with the alignment pattern on the mask in a unique visual manner to signify alignment. A scanning mechanism is provided for automatically scanning the alignment pattern areas and producing output signals indicative of the relative positions of the alignment patterns on the wafer and mask. Logic circuitry is provided for operating in response to any misalignment represented by the scan output signals to compute formulae which are utilized to produce control signals for driving motor drive mechanisms to produce relative movement between the mask and wafer to bring them into alignment. Several separate alignment cycles are provided, if needed, for zeroing in on finalized alignment.