Abstract: A method for simulating laser machining of a material by a laser machining system comprising the following steps: providing a central unit with: information relating to the material to be machined: delta ?, threshold fluence, incubation coefficient S, complex refractive index n+ik, information about the laser processing system: information relating to a polarization, pulse energy EP, diameter of said machining laser beam at a focal point w, order of a Gaussian p, pulse repetition rate PRR n, wavelength; determining with said central unit on the basis of the information relating to said material to be machined and the laser machining system, a machining profile in two dimensions corresponding to the simulation of a machining of said material to be machined with said laser machining system.

Abstract: Disclosed is an optical system for laser machining that enables simpler and more reliable machining of several patterns simultaneously on the same part. The system comprises an ultra-short pulse laser source for generating a source laser beam; a device with a separation means for separating a source laser beam into a plurality of separated laser beams, such that each of the separated laser beams is directed in a direction of propagation specific thereto; a spatial offsetting unit for obtaining, from the plurality of separated laser beams, a plurality of offset laser beams such that each offset laser beam can propagate around a main axis of propagation A specific thereto and is capable of describing a movement around the main axis of propagation A; and a focusing means configured to focus each offset laser beam on a workpiece in the direction of the axis of propagation specific thereto.

Abstract: A method for volume heat treating a part having an external surface delimiting its volume, the method comprising the following steps: a. providing a laser source; b. providing the part; c. providing support means for supporting the part; d. placing said part so that it is held in position by said support means; and e. irradiating with the laser source at least one segment of the external surface of the part with a laser exposure power and duration to obtain a temperature rise in essentially the entire volume of the part.

Abstract: An optical device for detecting the drift of a light beam of a laser machining system includes a beam splitter for obtaining a first light beam along a first optical path and a second light beam along a second optical path. The optical device further includes a focal module positioned at least partially along the first optical path to obtain a focused light beam that is directed towards a first light beam matrix detection means positioned in a focusing plane associated with the focal module. The optical device also includes an afocal module positioned at least partially along the second optical path to obtain a collimated light beam that is directed towards a second light beam matrix detection means.

Abstract: Method for structuring a substrate (11) and comprising the following steps: —providing a device (100) comprising a light source (33), an optical system (2) for obtaining an outgoing light beam (7) spatially offset in relation to the incoming light beam (1), and capable of modifying this spatial offset, focusing means (9) for focusing the outgoing light beam (7), a substrate holder (59), a movement device (60) for generating a movement (41) between the outgoing light beam (7) and the substrate (11); —providing and placing the substrate (11) on the substrate holder (59); —etching the substrate with the focused outgoing light beam (7) having an angle of attack (107) greater than 1° for any spatial offset between outgoing light beam (7) and incoming light beam (1) imposed by the optical system (2).

Abstract: A method for providing a first and a second laser beam, which are spatially offset in relation to an input laser beam. The method includes: providing a laser source for generating the input laser beam; providing a spatial offsetting unit for providing an offset laser beam that can keep the same polarization between the input laser beam and the offset laser beam; providing a separating unit including a first module for separation by polarization in order to obtain, from the offset laser beam: the first laser beam spatially offset by transmission; and the second laser beam spatially offset by reflection, the first and second spatially offset laser beams being suitable for each describing a circle.

Abstract: An optical device for detecting the drift of a light beam of a laser machining system includes a beam splitter for obtaining a first light beam along a first optical path and a second light beam along a second optical path. The optical device further includes a focal module positioned at least partially along the first optical path to obtain a focused light beam that is directed towards a first light beam matrix detection means positioned in a focusing plane associated with the focal module. The optical device also includes an afocal module positioned at least partially along the second optical path to obtain a collimated light beam that is directed towards a second light beam matrix detection means.

Abstract: Method for determining laser machining parameters for the machining of a material using a laser machining system comprises the following steps: a) providing said central unit with a learning machining function capable of learning on the basis of said plurality of machining data samples, said learning machining function comprising an algorithm capable of defining the following laser machining parameters for said machining result sought and for said machining system: a polarization, an pulse energy Ep, a diameter at the focal point w, a Gaussian order p, a pulse repetition rate PRR of pulses n, a wavelength; b) making said learning machining function to learn so as to said laser machining system can machine said material to be machined according to the machining result sought.

Abstract: A method for simulating laser machining of a material by a laser machining system comprising the following steps: providing a central unit with: information relating to the material to be machined: delta ?, threshold fluence, incubation coefficient S, complex refractive index n+ik, information about the laser processing system: information relating to a polarization, pulse energy EP, diameter of said machining laser beam at a focal point w, order of a Gaussian p, pulse repetition rate PRR n, wavelength; determining with said central unit on the basis of the information relating to said material to be machined and the laser machining system, a machining profile in two dimensions corresponding to the simulation of a machining of said material to be machined with said laser machining system.

Abstract: Method for structuring a substrate (11) and comprising the following steps: —providing a device (100) comprising a light source (33), an optical system (2) for obtaining an outgoing light beam (7) spatially offset in relation to the incoming light beam (1), and capable of modifying this spatial offset, focusing means (9) for focusing the outgoing light beam (7), a substrate holder (59), a movement device (60) for generating a movement (41) between the outgoing light beam (7) and the substrate (11); —providing and placing the substrate (11) on the substrate holder (59); —etching the substrate with the focused outgoing light beam (7) having an angle of attack (107) greater than 1° for any spatial offset between outgoing light beam (7) and incoming light beam (1) imposed by the optical system (2).

Abstract: Machining device (100) comprising: a light source (33); an optical system (2) for obtaining a spatially offset outgoing light beam (7) remaining parallel to a given position upstream focusing means (9), said optical system (2) comprising: a movable mirror (19) such that its normal is able to depict a trajectory in a three-dimensional space, said optical system (2) being configured such that said first incident light beam (4) and said normal to the movable mirror (19) are separated by an angle (15) comprised between 0° and 15° for all possible positions and orientations of said movable mirror (19); driving means (6) for moving said movable mirror (19); a retro reflection system (21) able to provide a second incident light beam (8) parallel to a first reflected light beam (23) on said movable mirror (19); focusing means (9) for focusing outgoing light beam (7) on a target (10).

Abstract: Machining device (100) comprising: a light source (33); an optial system (2) for obtaining a spatially offest outgoing light beam (7) remaining parallel to a given position upstream focusing means (9), said optical system (2) comprising: a movable mirror (19) such that its normal is able to depict a trajectory in a three-dimensional space, said optical system (2) being configured such that said first incident light beam (4) and said normal to the movable mirror (19) are separated by an angle (15) comprised between 0° and 15° for all possible positions and orientations of said movable mirror (19); driving means (6) for moving said movable mirror (19); a retro refletion system (21) able to provide a second incident light beam (8) parallel to a first refelected light beam (23) on said movable mirror (19); focusing means (9) for focusing outgoing light beam (7) on a target (10).