Patents by Inventor Paul Exline

Paul Exline has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for thermal control of a semiconductor substrate
    Patent number: 6466426
    Abstract: A semiconductor wafer processing apparatus, and more specifically, a semiconductor substrate support pedestal having a substrate support, an isolator, and first and second heat transfer plates for providing a controllable, uniform temperature distribution across the diameter of a semiconductor wafer. A semiconductor wafer placed upon the pedestal is maintained uniformly at a predetermined temperature by heating the wafer with one or more electrodes embedded within the substrate support and cooling the wafer with a fluid passing through the first and second heat transfer plates.
    Type: Grant
    Filed: August 3, 1999
    Date of Patent: October 15, 2002
    Assignee: Applied Materials Inc.
    Inventors: Yeuk-Fai Edwin Mok, Dmitry Lubomirsky, Dennis Koosau, Danny Wang, Senh Thach, Paul Exline