Patents by Inventor Paul F. Bodenweber
Paul F. Bodenweber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11825592Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.Type: GrantFiled: October 5, 2020Date of Patent: November 21, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Kamal K. Sikka, Chenzhou Lian, Kathryn C. Rivera, Paul F. Bodenweber, Jon A. Casey
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Patent number: 11035625Abstract: A heat sink includes a threaded rod. The threaded rod includes a first portion and a second portion. The first portion may engage with a first heat sink fin and a second portion may engage with a second heat sink fin. The first portion includes a first external thread of a first diameter. The second portion includes a second external thread also of the first diameter and of different pitch than the first external thread. For example, the pitch of a first knurl of the threaded rod may be smaller than the pitch of a second threaded knurl of the threaded rod. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.Type: GrantFiled: July 23, 2019Date of Patent: June 15, 2021Assignee: International Business Machines CorporationInventors: Paul F. Bodenweber, Kamal K. Sikka
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Patent number: 10948247Abstract: A heat sink includes a first fin and a second fin. The spacing between the first fin and the second fin may be adjusted by a threaded rod. The threaded rod may include a first portion that is engaged with the first fin and a second portion that is engaged with the second fin. The thread pitch of the first portion and the second portion may differ. For example, the pitch of a first internal thread of the first fin may be smaller than the pitch of a second internal thread of the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.Type: GrantFiled: July 23, 2019Date of Patent: March 16, 2021Assignee: International Business Machines CorporationInventors: Paul F. Bodenweber, Kamal K. Sikka
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Patent number: 10905029Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: GrantFiled: October 29, 2019Date of Patent: January 26, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
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Publication number: 20210022239Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.Type: ApplicationFiled: October 5, 2020Publication date: January 21, 2021Inventors: Kamal K. SIKKA, Chenzhou LIAN, Kathryn C. RIVERA, Paul F. BODENWEBER, Jon A. CASEY
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Patent number: 10834808Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.Type: GrantFiled: September 28, 2015Date of Patent: November 10, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul F. Bodenweber, Jon A. Casey, Chenzhou Lian, Kathryn C. Rivera, Kamal K. Sikka
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Patent number: 10757833Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: GrantFiled: June 21, 2019Date of Patent: August 25, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
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Patent number: 10584924Abstract: A heat sink includes a first fin and a second fin. The spacing between the first fin and the second fin may be adjusted by a threaded rod. The threaded rod includes a first portion that is engaged with the first fin and a second portion that is engaged with the second fin. The thread pitch of the first portion and the second portion may differ. For example, the pitch of a first internal thread of the first fin may be smaller than the pitch of a second internal thread of the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.Type: GrantFiled: November 16, 2017Date of Patent: March 10, 2020Assignee: International Business Machines CorporationInventors: Paul F. Bodenweber, Kamal K. Sikka
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Publication number: 20200068744Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: ApplicationFiled: October 29, 2019Publication date: February 27, 2020Inventors: Paul F. BODENWEBER, Kenneth C. MARSTON, Kamal K. SIKKA, Hilton T. TOY, Randall J. WERNER, Jeffrey A. ZITZ
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Patent number: 10542636Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: GrantFiled: July 30, 2018Date of Patent: January 21, 2020Assignee: International Business Machines CorporationInventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
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Publication number: 20190346215Abstract: A heat sink includes a threaded rod. The spacing between a first fin and a second fin of the heat sink may be adjusted by the threaded rod. The threaded rod includes a first portion and a second portion. The first portion may engage with the first fin and a second portion may engage with the second fin. The thread pitch of the first portion and the second portion may differ. For example, the pitch of a first knurl of the threaded rod may be smaller than the pitch of a second threaded knurl of the threaded rod. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.Type: ApplicationFiled: July 23, 2019Publication date: November 14, 2019Inventors: Paul F. Bodenweber, Kamal K. Sikka
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Publication number: 20190346214Abstract: A heat sink includes a first fin and a second fin. The spacing between the first fin and the second fin may be adjusted by a threaded rod. The threaded rod may include a first portion that is engaged with the first fin and a second portion that is engaged with the second fin. The thread pitch of the first portion and the second portion may differ. For example, the pitch of a first internal thread of the first fin may be smaller than the pitch of a second internal thread of the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.Type: ApplicationFiled: July 23, 2019Publication date: November 14, 2019Inventors: Paul F. Bodenweber, Kamal K. Sikka
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Publication number: 20190335617Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: ApplicationFiled: June 21, 2019Publication date: October 31, 2019Inventors: Paul F. BODENWEBER, Kenneth C. MARSTON, Kamal K. SIKKA, Hilton T. TOY, Randall J. WERNER, Jeffrey A. ZITZ
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Patent number: 10172258Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: GrantFiled: March 17, 2017Date of Patent: January 1, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
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Publication number: 20180338390Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: ApplicationFiled: July 30, 2018Publication date: November 22, 2018Inventors: Paul F. BODENWEBER, Kenneth C. MARSTON, Kamal K. SIKKA, Hilton T. TOY, Randall J. WERNER, Jeffrey A. ZITZ
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Patent number: 10088244Abstract: A heat sink includes a heat sink base/riser, a first fin, and a second fin. The spacing between the base/riser and the first fin and the second fin, restively, may be adjusted by rotating a threaded rod. The threaded rod includes a first threaded knurl that is engaged with the first fin and a second threaded knurl that is engaged with the second fin. The thread pitch of the first threaded knurl and the second threaded knurl may differ. For example, the pitch of the first threaded knurl may be smaller than the pitch of the second threaded knurl if the first fin is located nearest the heat sink base/riser relative to the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.Type: GrantFiled: November 1, 2017Date of Patent: October 2, 2018Assignee: International Business Machines CorporationInventors: Paul F. Bodenweber, Kamal K. Sikka
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Patent number: 9921008Abstract: A heat sink includes a heat sink base, a first fin, and a second fin. The spacing between the base and the first fin and the second fin, restively, may be adjusted by rotating a threaded rod. The threaded rod includes a first threaded knurl that is engaged with the first fin and a second threaded knurl that is engaged with the second fin. The thread pitch of the first threaded knurl and the second threaded knurl may differ. For example, the pitch of the first threaded knurl may be smaller than the pitch of the second threaded knurl if the first fin is located nearest the heat sink base relative to the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.Type: GrantFiled: April 27, 2017Date of Patent: March 20, 2018Assignee: International Business Machines CorporationInventors: Paul F. Bodenweber, Kamal K. Sikka
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Publication number: 20180073818Abstract: A heat sink includes a first fin and a second fin. The spacing between the first fin and the second fin may be adjusted by a threaded rod. The threaded rod includes a first portion that is engaged with the first fin and a second portion that is engaged with the second fin. The thread pitch of the first portion and the second portion may differ. For example, the pitch of a first internal thread of the first fin may be smaller than the pitch of a second internal thread of the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.Type: ApplicationFiled: November 16, 2017Publication date: March 15, 2018Inventors: Paul F. Bodenweber, Kamal K. Sikka
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Publication number: 20180051940Abstract: A heat sink includes a heat sink base/riser, a first fin, and a second fin. The spacing between the base/riser and the first fin and the second fin, restively, may be adjusted by rotating a threaded rod. The threaded rod includes a first threaded knurl that is engaged with the first fin and a second threaded knurl that is engaged with the second fin. The thread pitch of the first threaded knurl and the second threaded knurl may differ. For example, the pitch of the first threaded knurl may be smaller than the pitch of the second threaded knurl if the first fin is located nearest the heat sink base/riser relative to the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.Type: ApplicationFiled: November 1, 2017Publication date: February 22, 2018Inventors: Paul F. Bodenweber, Kamal K. Sikka
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Publication number: 20170299281Abstract: A heat sink includes a heat sink base, a first fin, and a second fin. The spacing between the base and the first fin and the second fin, restively, may be adjusted by rotating a threaded rod. The threaded rod includes a first threaded knurl that is engaged with the first fin and a second threaded knurl that is engaged with the second fin. The thread pitch of the first threaded knurl and the second threaded knurl may differ. For example, the pitch of the first threaded knurl may be smaller than the pitch of the second threaded knurl if the first fin is located nearest the heat sink base relative to the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.Type: ApplicationFiled: April 27, 2017Publication date: October 19, 2017Inventors: Paul F. Bodenweber, Kamal K. Sikka