Patents by Inventor Paul F. Fortier
Paul F. Fortier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10969222Abstract: Systems and methods are provided for obtaining measurements of an integrated circuit chip and a connected carrier to obtain the measurements of the interconnect heights. More specifically, a method is provided that includes defining a top best fit reference plane and a bottom best fit reference plane, and adjusting the top best fit reference and the bottom best fit reference to be superposed to one another. The method further includes calculating first distances between each height measurement for a first set of points and the adjusted top best fit reference plane, and calculating second distances between each height measurement for a second set of points and the adjusted bottom best fit reference plane. The method further includes calculating height values of a gap or interconnect between the first substrate and the second substrate by subtracting the thickness of the first substrate and the second distances from the first distances.Type: GrantFiled: November 30, 2017Date of Patent: April 6, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Elaine Cyr, Dominique L. Demers, Paul F. Fortier, Alexander Janta-Polczynski
-
Patent number: 10613282Abstract: An optical structure includes a substrate including a cavity on a first surface of the substrate, an optical component on the substrate and an adhesive applied to a side of the optical component to fix the optical component to the substrate. The optical component includes a recess on a second surface of the optical component, the second surface is opposed to the first surface of the substrate, and the recess is provided along an edge of the second surface.Type: GrantFiled: April 9, 2018Date of Patent: April 7, 2020Assignee: International Business Machines CorporationInventors: Elaine Cyr, Paul F. Fortier, Takashi Hisada, Patrick Jacques, Koji Masuda, Masao Tokunari
-
Patent number: 10539743Abstract: An approach compatible with high volume manufacturing for assembling a photonic chip with integrated optical fibers involving placing a die on an assembly station, providing one or more optical fibers, placing the one or more optical fibers into corresponding one or more grooves of the die, bonding the one or more optical fibers to the die and performing an optical test of the die using the one or more optical fibers, and severing the one or more optical fibers. The die can be removed from the assembly station while retaining a predetermined length of each severed optical fiber and the one or more optical fibers can be prepared for assembly to a next die.Type: GrantFiled: July 11, 2016Date of Patent: January 21, 2020Assignee: International Business Machines CorporationInventors: Paul F. Fortier, Barnim Alexander Janta-Polczynski, Stephan L. Martel, Dany Minier
-
Patent number: 10371907Abstract: An optical structure includes a substrate including a cavity on a first surface of the substrate, an optical component on the substrate and an adhesive applied to a side of the optical component to fix the optical component to the substrate. The optical component includes a recess on a second surface of the optical component, the second surface is opposed to the first surface of the substrate, and the recess is provided along an edge of the second surface.Type: GrantFiled: September 12, 2017Date of Patent: August 6, 2019Assignee: International Business Machines CorporationInventors: Elaine Cyr, Paul F. Fortier, Takashi Hisada, Patrick Jacques, Koji Masuda, Masao Tokunari
-
Publication number: 20180259728Abstract: An optical structure includes a substrate including a cavity on a first surface of the substrate, an optical component on the substrate and an adhesive applied to a side of the optical component to fix the optical component to the substrate. The optical component includes a recess on a second surface of the optical component, the second surface is opposed to the first surface of the substrate, and the recess is provided along an edge of the second surface.Type: ApplicationFiled: September 12, 2017Publication date: September 13, 2018Inventors: Elaine Cyr, Paul F. Fortier, Takashi Hisada, Patrick Jacques, Koji Masuda, Masao Tokunari
-
Publication number: 20180259729Abstract: An optical structure includes a substrate including a cavity on a first surface of the substrate, an optical component on the substrate and an adhesive applied to a side of the optical component to fix the optical component to the substrate. The optical component includes a recess on a second surface of the optical component, the second surface is opposed to the first surface of the substrate, and the recess is provided along an edge of the second surface.Type: ApplicationFiled: April 9, 2018Publication date: September 13, 2018Inventors: Elaine Cyr, Paul F. Fortier, Takashi Hisada, Patrick Jacques, Koji Masuda, Masao Tokunari
-
Patent number: 9989713Abstract: An optical structure includes a substrate including a cavity on a first surface of the substrate, an optical component on the substrate and an adhesive applied to a side of the optical component to fix the optical component to the substrate. The optical component includes a recess on a second surface of the optical component, the second surface is opposed to the first surface of the substrate, and the recess is provided along an edge of the second surface.Type: GrantFiled: March 7, 2017Date of Patent: June 5, 2018Assignee: International Business Machines CorporationInventors: Elaine Cyr, Paul F. Fortier, Takashi Hisada, Patrick Jacques, Koji Masuda, Masao Tokunari
-
Patent number: 9958625Abstract: A structured substrate for optical fiber alignment is produced at least in part by forming a substrate with a plurality of buried conductive features and a plurality of top level conductive features. At least one of the plurality of top level conductive features defines a bond pad. A groove is then patterned in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop. At least a portion of an optical fiber is placed into the groove.Type: GrantFiled: May 22, 2017Date of Patent: May 1, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Russell A. Budd, Paul F. Fortier
-
Publication number: 20180080765Abstract: Systems and methods are provided for obtaining measurements of an integrated circuit chip and a connected carrier to obtain the measurements of the interconnect heights. More specifically, a method is provided that includes defining a top best fit reference plane and a bottom best fit reference plane, and adjusting the top best fit reference and the bottom best fit reference to be superposed to one another. The method further includes calculating first distances between each height measurement for a first set of points and the adjusted top best fit reference plane, and calculating second distances between each height measurement for a second set of points and the adjusted bottom best fit reference plane. The method further includes calculating height values of a gap or interconnect between the first substrate and the second substrate by subtracting the thickness of the first substrate and the second distances from the first distances.Type: ApplicationFiled: November 30, 2017Publication date: March 22, 2018Inventors: Elaine CYR, Dominique L. DEMERS, Paul F. FORTIER, Alexander JANTA-POLCZYNSKI
-
Patent number: 9897444Abstract: Systems and methods are provided for obtaining measurements of an integrated circuit chip and a connected carrier to obtain the measurements of the interconnect heights. More specifically, a method is provided that includes defining a top best fit reference plane and a bottom best fit reference plane, and adjusting the top best fit reference and the bottom best fit reference to be superposed to one another. The method further includes calculating first distances between each height measurement for a first set of points and the adjusted top best fit reference plane, and calculating second distances between each height measurement for a second set of points and the adjusted bottom best fit reference plane. The method further includes calculating height values of a gap or interconnect between the first substrate and the second substrate by subtracting the thickness of the first substrate and the second distances from the first distances.Type: GrantFiled: December 23, 2014Date of Patent: February 20, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Elaine Cyr, Dominique L. Demers, Paul F. Fortier, Alexander Janta-Polczynski
-
Publication number: 20180011250Abstract: An approach compatible with high volume manufacturing for assembling a photonic chip with integrated optical fibers involving placing a die on an assembly station, providing one or more optical fibers, placing the one or more optical fibers into corresponding one or more grooves of the die, bonding the one or more optical fibers to the die and performing an optical test of the die using the one or more optical fibers, and severing the one or more optical fibers. The die can be removed from the assembly station while retaining a predetermined length of each severed optical fiber and the one or more optical fibers can be prepared for assembly to a next die.Type: ApplicationFiled: July 11, 2016Publication date: January 11, 2018Inventors: Paul F. Fortier, Barnim Alexander Janta-Polczynski, Stephan L. Martel, Dany Minier
-
Patent number: 9810864Abstract: An optical fiber component includes an optical fiber array and at least one fiber lid. The optical fiber array has a plurality of individual optical fibers extending between a first end and an opposing second end. The fiber lid has a first surface and an opposing second surface. A portion of the second surface is attached to a portion of the optical fiber array adjacent the second end so as to partially define an adhesion region of the optical fiber component and a compliance region of the fiber pigtail assembly to enable high-yield fiber re-alignment in grooves.Type: GrantFiled: April 5, 2017Date of Patent: November 7, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, Nicolas Boyer, Paul F. Fortier, Alexander Janta-Polczynski
-
Publication number: 20170261706Abstract: A structured substrate for optical fiber alignment is produced at least in part by forming a substrate with a plurality of buried conductive features and a plurality of top level conductive features. At least one of the plurality of top level conductive features defines a bond pad. A groove is then patterned in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop. At least a portion of an optical fiber is placed into the groove.Type: ApplicationFiled: May 22, 2017Publication date: September 14, 2017Inventors: Russell A. Budd, Paul F. Fortier
-
Patent number: 9759868Abstract: The disclosure relates to semiconductor structures and, more particularly, to structures for preventing dicing damage on photonics wafers. The structure includes: an optical waveguide structure to optical fiber interface formed on an integrated circuit; and a groove formed in a substrate and which includes a structure preventing a fluid pressure of a dicing operation from damaging the substrate along the groove.Type: GrantFiled: November 5, 2015Date of Patent: September 12, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brett Cucci, Paul F. Fortier, Jeffrey P. Gambino, Robert K. Leidy, Qizhi Liu, Richard J. Rassel
-
Publication number: 20170242207Abstract: An optical fiber component includes an optical fiber array and at least one fiber lid. The optical fiber array has a plurality of individual optical fibers extending between a first end and an opposing second end. The fiber lid has a first surface and an opposing second surface. A portion of the second surface is attached to a portion of the optical fiber array adjacent the second end so as to partially define an adhesion region of the optical fiber component and a compliance region of the fiber pigtail assembly to enable high-yield fiber re-alignment in grooves.Type: ApplicationFiled: April 5, 2017Publication date: August 24, 2017Inventors: Tymon Barwicz, Nicolas Boyer, Paul F. Fortier, Alexander Janta-Polczynski
-
Patent number: 9701872Abstract: A picktip is provided and includes a picktip member configured to extend along a longitudinal axis defined in parallel with emissions from an ultraviolet (UV) light source. The picktip member partially includes UV transparent material through which the emissions are directed and has an end face from which the emissions are exited. The picktip member defines vacuum pathways terminating at the end face, and the end face has a non-planar topography.Type: GrantFiled: September 23, 2014Date of Patent: July 11, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, Paul F. Fortier, Stephane Harel, Simon LaFlamme, Roch Thivierge
-
Patent number: 9684133Abstract: A component assembly apparatus includes a first device supportive of a first component and a second device configured to bring a second component into contact with the first component. The second device is further configured to apply a first pressurizing force directed to force respective first surfaces of the first and second components together, and the first device is configured to convert a portion of the first pressurizing force into a second pressurizing force directed transversely with respect to the first pressurizing force to force respective second surfaces of the first and second components together.Type: GrantFiled: September 23, 2014Date of Patent: June 20, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, Nicolas Boyer, Guy Brouilette, Paul F. Fortier, Stephane Harel, Roch Thivierge
-
Patent number: 9671578Abstract: A structured substrate for optical fiber alignment is produced at least in part by forming a substrate with a plurality of buried conductive features and a plurality of top level conductive features. At least one of the plurality of top level conductive features defines a bond pad. A groove is then patterned in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop. At least a portion of an optical fiber is placed into the groove.Type: GrantFiled: December 28, 2015Date of Patent: June 6, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Russell A. Budd, Paul F. Fortier
-
Patent number: 9658415Abstract: A structured substrate for optical fiber alignment is produced at least in part by forming a substrate with a plurality of buried conductive features and a plurality of top level conductive features. At least one of the plurality of top level conductive features defines a bond pad. A groove is then patterned in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop. At least a portion of an optical fiber is placed into the groove.Type: GrantFiled: December 28, 2015Date of Patent: May 23, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Russell A. Budd, Paul F. Fortier
-
Patent number: 9651747Abstract: An optical fiber component includes an optical fiber array and at least one fiber lid. The optical fiber array has a plurality of individual optical fibers extending between a first end and an opposing second end. The fiber lid has a first surface and an opposing second surface. A portion of the second surface is attached to a portion of the optical fiber array adjacent the second end so as to partially define an adhesion region of the optical fiber component and a compliance region of the fiber pigtail assembly to enable high-yield fiber re-alignment in grooves.Type: GrantFiled: February 22, 2016Date of Patent: May 16, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, Nicolas Boyer, Paul F. Fortier, Alexander Janta-Polczynski