Abstract: A method of making transmission lines and buried passive components in a green tape comprising embossing a channel or opening into the green tape of the desired size under heat and pressure, screen printing an ink of a conductive material or a passive component material to fill said embossed channel or opening; and firing said green tape. The embossing tool forms channels and openings having improved dimensional control over that obtained using screen printing. Further, embossing provides improved thickness control of lines and passive components as well.

Abstract: Patterned glass layers which are defect-free and have smooth surfaces are formed by a method wherein a mixture of glass frit and a photoresist composition is applied to the surface of the substrate; the layer is photolithographically patterned by exposing and developing predetermined areas of the layer; then after development and prior to firing of the glass frit, the layer of material is subjected to treatment with a suitable plasma at a temperature below the thermal decomposition temperature of the photoresist composition to remove the photoresist composition from the portion of the resist layer remaining on the substrate; and then the remainder of the layer, consisting essentially of glass frit, is fired to form a smooth, defect-free, patterned glass layer over the surface of the substrate.