Patents by Inventor Paul Francis Fortier
Paul Francis Fortier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11280968Abstract: A structural feature of an optical connector assembly in which an optical chip is connectable with a fixed ferrule via a waveguide and is joined onto a section of a substrate. The structural feature includes a structural section disposed on one of the optical chip and the substrate and a ferrule support section that extends from the structural section and comprises a surface for adhesion to the fixed ferrule.Type: GrantFiled: February 21, 2020Date of Patent: March 22, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Barnim Alexander Janta-Polczynski, Elaine Cyr, Richard D. Langlois, Paul Francis Fortier
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Patent number: 11209598Abstract: A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.Type: GrantFiled: February 28, 2019Date of Patent: December 28, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Barnim Alexander Janta-Polczynski, Isabel De Sousa, Jean Audet, Maryse Cournoyer, Sylvain Pharand, Roxan Lemire, Louis-Marie Achard, Paul Francis Fortier
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Patent number: 11146003Abstract: Embodiments provide for a method for pluggable Land Grid Array (LGA) socket for high density interconnects. A method includes inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package. After the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package.Type: GrantFiled: August 22, 2018Date of Patent: October 12, 2021Assignee: International Business Machines CorporationInventors: Alan F. Benner, Benjamin Vito Fasano, Paul Francis Fortier, Hilton T. Toy
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Publication number: 20210263236Abstract: A structural feature of an optical connector assembly in which an optical chip is connectable with a fixed ferrule via a waveguide and is joined onto a section of a substrate. The structural feature includes a structural section disposed on one of the optical chip and the substrate and a ferrule support section that extends from the structural section and comprises a surface for adhesion to the fixed ferrule.Type: ApplicationFiled: February 21, 2020Publication date: August 26, 2021Inventors: BARNIM ALEXANDER JANTA-POLCZYNSKI, Elaine Cyr, Richard D. Langlois, Paul Francis Fortier
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Publication number: 20200279840Abstract: A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.Type: ApplicationFiled: February 28, 2019Publication date: September 3, 2020Inventors: BARNIM ALEXANDER JANTA-POLCZYNSKI, Isabel De Sousa, Jean Audet, Maryse Cournoyer, Sylvain Pharand, Roxan Lemire, Louis-Marie Achard, Paul Francis Fortier
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Patent number: 10754070Abstract: An optical device includes: a substrate including plural waveguide cores; and an optical component provided on the substrate, the optical component including plural lenses, each of the plural lenses transmitting light passing through one of the corresponding plural waveguide cores on the substrate. The substrate and the optical component are each provided with a positioning structure. The positioning structure includes plural protrusions and plural recesses provided on the substrate and the optical component. Each of the plural recesses accommodates a corresponding one of the plural protrusions, and an outer surface of each of the plural protrusions contacts a positioning surface of a corresponding one of the plural recesses. The positioning surface is a part of an inner surface of each of the plural recesses having accommodated the corresponding one of the plural protrusions to position the plural lenses relative to the substrate.Type: GrantFiled: December 5, 2018Date of Patent: August 25, 2020Assignee: International Business Machines CorporationInventors: Koji Masuda, Alexander Janta-Polczynski, Patrick Jacques, Vincent Langlois, Paul Francis Fortier
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Patent number: 10690867Abstract: An optical device includes a substrate including plural waveguide cores and an optical component provided on the substrate. The plural waveguide cores allowing light to pass through the plural waveguide cores and the optical component including plural lenses Each of the plural lenses transmitting light passing through a corresponding one of the plural waveguide cores on the substrate, wherein the optical component includes a body and a protrusion The body being provided with the plural lenses, the protrusion being protruded from a side of the body, and the protrusion is fixed to the substrate with an adhesive.Type: GrantFiled: February 12, 2019Date of Patent: June 23, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Koji Masuda, Patrick Jacques, Paul Francis Fortier, Masao Tokunari
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Publication number: 20200183059Abstract: An optical device includes: a substrate including plural waveguide cores; and an optical component provided on the substrate, the optical component including plural lenses, each of the plural lenses transmitting light passing through one of the corresponding plural waveguide cores on the substrate. The substrate and the optical component are each provided with a positioning structure. The positioning structure includes plural protrusions and plural recesses provided on the substrate and the optical component. Each of the plural recesses accommodates a corresponding one of the plural protrusions, and an outer surface of each of the plural protrusions contacts a positioning surface of a corresponding one of the plural recesses. The positioning surface is a part of an inner surface of each of the plural recesses having accommodated the corresponding one of the plural protrusions to position the plural lenses relative to the substrate.Type: ApplicationFiled: December 5, 2018Publication date: June 11, 2020Inventors: Koji Masuda, Alexander Janta-Polczynski, Patrick Jacques, Vincent Langlois, Paul Francis Fortier
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Patent number: 10338325Abstract: Systems and methods for nanofiller in an optical interface are provided. One system includes a fiber-optic interface for one or more optical fibers that includes a body including one or more grooves defined therein. At least one groove in the one or more grooves is configured to receive a corresponding optical fiber of the one or more optical fibers. The at least one groove of the one or more grooves is further configured to receive an adhesive to attach the body to a portion of the corresponding optical fiber. Further, fiber-optic interface includes a suspended structure associated with the at least one groove configured to couple light between the suspended structure and the corresponding optical fiber. Also, the adhesive comprises nanofiller configured to support an alignment of the suspended structure with the corresponding optical fiber within the at least one groove.Type: GrantFiled: June 1, 2018Date of Patent: July 2, 2019Assignee: International Business Machines CorporationInventors: Barnim Alexander Janta-Polczynski, Tymon Barwicz, Elaine Cyr, Nicolas Boyer, Marie-Claude Paquet, Richard D. Langlois, Paul Francis Fortier
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Patent number: 10302869Abstract: A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on the optical die in contact with the optical interconnect structure. The optical adhesive is arranged beneath the suspended membrane structure to at least partially fill the cavity beneath the suspended membrane structure. The photonic assembly also includes a structural adhesive arranged on the optical die adjacent to the optical adhesive.Type: GrantFiled: September 27, 2018Date of Patent: May 28, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Barnim Alexander Janta-Polczynski, Elaine Cyr, Tymon Barwicz, Nicolas Boyer, Richard D. Langlois, Paul Francis Fortier
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Patent number: 10295749Abstract: A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on the optical die in contact with the optical interconnect structure. The optical adhesive is arranged beneath the suspended membrane structure to at least partially fill the cavity beneath the suspended membrane structure. The photonic assembly also includes a structural adhesive arranged on the optical die adjacent to the optical adhesive.Type: GrantFiled: February 15, 2018Date of Patent: May 21, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Barnim Alexander Janta-Polczynski, Elaine Cyr, Tymon Barwicz, Nicolas Boyer, Richard D. Langlois, Paul Francis Fortier
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Publication number: 20180358725Abstract: Embodiments provide for a method for pluggable Land Grid Array (LGA) socket for high density interconnects. A method includes inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package. After the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package.Type: ApplicationFiled: August 22, 2018Publication date: December 13, 2018Inventors: Alan F. Benner, Benjamin Vito Fasano, Paul Francis Fortier, Hilton T. Toy
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Patent number: 10128590Abstract: Embodiments provide for a method for pluggable Land Grid Array (LGA) socket for high density interconnects. A method includes inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package. After the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package.Type: GrantFiled: August 24, 2015Date of Patent: November 13, 2018Assignee: International Business Machines CorporationInventors: Alan F. Benner, Benjamin Vito Fasano, Paul Francis Fortier, Hilton T. Toy
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Patent number: 10073223Abstract: A clip connects two ferrules together, without a housing, to form a fiber optic connection. The clip has proximal and distal ends which define, and the clip has arms extending along the longitudinal axis to hold a cable-side ferrule in connection with fixed ferrule connected to a photonic module or die. The arms form an opening through which the cable-side ferrule is passed for connecting to the fixed ferrule. The arms have resilient bends forming a spring that can be resiliently extended along the longitudinal axis. The arms have a contact area at their ends which grasp the end of the cable-sided ferrule. The arms resiliently retract to compress the cable-sided ferrule towards the fixed ferrule with a predetermined force. The clip is positioned with respect to the circuit board using a pick and place system. The clip is not taller than either ferrule portion, enabling a limited vertical clearance.Type: GrantFiled: November 1, 2017Date of Patent: September 11, 2018Assignee: International Business Machines CorporationInventors: Tymon Barwicz, Jerome Bougie, Darrell Childers, Paul Francis Fortier, Alexander Janta-Polczynski, Stephan L. Martel
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Publication number: 20180052285Abstract: A clip connects two ferrules together, without a housing, to form a fiber optic connection. The clip has proximal and distal ends which define, and the clip has arms extending along the longitudinal axis to hold a cable-side ferrule in connection with fixed ferrule connected to a photonic module or die. The arms form an opening through which the cable-side ferrule is passed for connecting to the fixed ferrule. The arms have resilient bends forming a spring that can be resiliently extended along the longitudinal axis. The arms have a contact area at their ends which grasp the end of the cable-sided ferrule. The arms resiliently retract to compress the cable-sided ferrule towards the fixed ferrule with a predetermined force. The clip is positioned with respect to the circuit board using a pick and place system. The clip is not taller than either ferrule portion, enabling a limited vertical clearance.Type: ApplicationFiled: November 1, 2017Publication date: February 22, 2018Applicant: International Business Machines CorporationInventors: Tymon BARWICZ, Jerome BOUGIE, Darrell CHILDERS, Paul Francis FORTIER, Alexander JANTA-POLCZYNSKI, Stephan L. MARTEL
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Patent number: 9835804Abstract: A clip connects two ferrules together, without a housing, to form a fiber optic connection. The clip has proximal and distal ends which define, and the clip has arms extending along the longitudinal axis to hold a cable-side ferrule in connection with fixed ferrule connected to a photonic module or die. The arms form an opening through which the cable-side ferrule is passed for connecting to the fixed ferrule. The arms have resilient bends forming a spring that can be resiliently extended along the longitudinal axis. The arms have a contact area at their ends which grasp the end of the cable-sided ferrule. The arms resiliently retract to compress the cable-sided ferrule towards the fixed ferrule with a predetermined force. The clip is positioned with respect to the circuit board using a pick and place system. The clip is not taller than either ferrule portion, enabling a limited vertical clearance.Type: GrantFiled: March 27, 2017Date of Patent: December 5, 2017Assignee: Intenational Business Machines CorporationInventors: Tymon Barwicz, Jerome Bougie, Darrell Childers, Paul Francis Fortier, Alexander Janta-Polczynski, Stephan L. Martel
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Patent number: 9720188Abstract: A clip connects two ferrules together, without a housing, to form a fiber optic connection. The clip has proximal and distal ends which define, and the clip has arms extending along the longitudinal axis to hold a cable-side ferrule in connection with fixed ferrule connected to a photonic module or die. The arms form an opening through which the cable-side ferrule is passed for connecting to the fixed ferrule. The arms have resilient bends forming a spring that can be resiliently extended along the longitudinal axis. The arms have a contact area at their ends which grasp the end of the cable-sided ferrule. The arms resiliently retract to compress the cable-sided ferrule towards the fixed ferrule with a predetermined force. The clip is positioned with respect to the circuit board using a pick and place system. The clip is not taller than either ferrule portion, enabling a limited vertical clearance.Type: GrantFiled: December 31, 2015Date of Patent: August 1, 2017Assignee: International Business Machines CorporationInventors: Tymon Barwicz, Jerome Bougie, Darrell Childers, Paul Francis Fortier, Alexander Janta-Polczynski, Stephan L. Martel
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Publication number: 20170199337Abstract: A clip connects two ferrules together, without a housing, to form a fiber optic connection. The clip has proximal and distal ends which define, and the clip has arms extending along the longitudinal axis to hold a cable-side ferrule in connection with fixed ferrule connected to a photonic module or die. The arms form an opening through which the cable-side ferrule is passed for connecting to the fixed ferrule. The arms have resilient bends forming a spring that can be resiliently extended along the longitudinal axis. The arms have a contact area at their ends which grasp the end of the cable-sided ferrule. The arms resiliently retract to compress the cable-sided ferrule towards the fixed ferrule with a predetermined force. The clip is positioned with respect to the circuit board using a pick and place system. The clip is not taller than either ferrule portion, enabling a limited vertical clearance.Type: ApplicationFiled: March 27, 2017Publication date: July 13, 2017Inventors: Tymon BARWICZ, Jerome BOUGIE, Darrell CHILDERS, Paul Francis FORTIER, Alexander JANTA-POLCZYNSKI, Stephan L. MARTEL
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Patent number: 9706670Abstract: A micro-electronic cover has a planar portion sized and dimensioned to be positionable over and cover electronic components that are electrically connected on a board. The cover has a peripheral edge surrounding the planar portion and the electronic components. The peripheral edge connects the planar portion with the board to define a cover interior. The peripheral edge includes a side opening which provides access for passage of a connector part from a exterior to the cover to a position within the cover interior.Type: GrantFiled: December 31, 2015Date of Patent: July 11, 2017Assignee: International Business Machines CorporationInventors: Tymon Barwicz, Jerome Bougie, Paul Francis Fortier, Alexander Janta-Polczynski, Stephan L. Martel
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Publication number: 20170196097Abstract: A micro-electronic cover has a planar portion sized and dimensioned to be positionable over and cover electronic components that are electrically connected on a board. The cover has a peripheral edge surrounding the planar portion and the electronic components. The peripheral edge connects the planar portion with the board to define a cover interior. The peripheral edge includes a side opening which provides access for passage of a connector part from a exterior to the cover to a position within the cover interior.Type: ApplicationFiled: December 31, 2015Publication date: July 6, 2017Inventors: Tymon BARWICZ, Jerome BOUGIE, Paul Francis FORTIER, Alexander JANTA-POLCZYNSKI, Stephan L. MARTEL